From eenriquez at snf.stanford.edu Fri Aug 7 09:00:35 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 7 Aug 2009 09:00:35 -0700 Subject: Comment mrc SNF 2009-08-07 09:00:34: CHF3 is unavailable Message-ID: New gas cylinder is scheduled to be here on Monday, 8/10. From eenriquez at snf.stanford.edu Fri Aug 7 09:40:26 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 7 Aug 2009 09:40:26 -0700 Subject: Comment mrc SNF 2009-08-07 09:00:34: CHF3 is unavailable Message-ID: From eenriquez at snf.stanford.edu Fri Aug 7 09:45:10 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 7 Aug 2009 09:45:10 -0700 Subject: Problem mrc SNF 2009-08-07 09:45:10: CHF3 is unavailable Message-ID: New gas cylinder is scheduled to be here on Monday, 8/10. From lwchang at snf.stanford.edu Mon Aug 10 16:49:29 2009 From: lwchang at snf.stanford.edu (lwchang at snf.stanford.edu) Date: Mon, 10 Aug 2009 16:49:29 -0700 Subject: Comment mrc SNF 2009-08-10 16:49:28: When will CHF3 be available? Message-ID: Need to etch oxide...thanks! From shott at snf.stanford.edu Tue Aug 11 15:34:06 2009 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Tue, 11 Aug 2009 15:34:06 -0700 Subject: Problem mrc SNF 2009-08-07 09:45:10: CHF3 is unavailable Message-ID: Freon 23 tank has been replaced. John From shott at snf.stanford.edu Tue Aug 11 15:34:13 2009 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Tue, 11 Aug 2009 15:34:13 -0700 Subject: Comment mrc SNF 2009-08-10 16:49:28: When will CHF3 be available? Message-ID: Freon 23 tank has been replaced. John From calarrudo at snf.stanford.edu Tue Aug 18 18:59:08 2009 From: calarrudo at snf.stanford.edu (calarrudo at snf.stanford.edu) Date: Tue, 18 Aug 2009 18:59:08 -0700 Subject: Problem mrc SNF 2009-08-18 18:59:08: Leak during the etch Message-ID: The MRC has a leak during the etch process. 500A of Pt etches in 5:30, today it etched in 8:30. These are the conditions I used for the etch, Argon (15.0 sccm), Pressure (12.5 mtorr), RF (100 watts), PV (660 volts)This is the standard recipe that I have used for the last 2 years. I did a leak-up check and the pressure climbed to 50.0 mtorr. I didn't shut the system down but use with caution. From eenriquez at snf.stanford.edu Wed Aug 19 09:53:44 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 19 Aug 2009 09:53:44 -0700 Subject: Problem mrc SNF 2009-08-18 18:59:08: Leak during the etch Message-ID: No leak found. Leak up rate is about 7 mT/min. Ran an O2 plasma. The plasma was the correct color (greenish- white). The lower etch rate obtained by the user might be due to excessive water vapor due to insufficient pumpdown time. If possible, after pumping down the sample, wait around 5-10 minutes before starting the etch. From calarrudo at snf.stanford.edu Wed Aug 19 11:00:46 2009 From: calarrudo at snf.stanford.edu (calarrudo at snf.stanford.edu) Date: Wed, 19 Aug 2009 11:00:46 -0700 Subject: Problem mrc SNF 2009-08-19 11:00:45: Leak Message-ID: The problem is not with O2 it is with Argon. Please check my previous e/mail. From calarrudo at snf.stanford.edu Wed Aug 19 19:40:13 2009 From: calarrudo at snf.stanford.edu (calarrudo at snf.stanford.edu) Date: Wed, 19 Aug 2009 19:40:13 -0700 Subject: Problem mrc SNF 2009-08-19 19:40:13: MRC Etch Rate Changed Message-ID: I tried etching a 500A Pt wafer with Nancy for 5:30 which should have cleared but did not. I etched in 1:00 increments of one minute for a total time of 8:30 the same time as yesterday's test wafer. I did a 30:00 minute chamber clean with Argon. Elmer and I did a leak check for the next test wafer, and pumped the chamber down for 8:00 at 5:30 the wafe did not clear. I left a 500A Pt test wafer for Elmer to try tomorrow. My etches are critical I don't understand what is wrong with the Argon Sputter Etch other than possibly the black valve between the Argon and SF6 may be bad. Anyone who uses the NMRC for Sputter Etch use with caution and do a test wafer. From calarrudo at snf.stanford.edu Wed Aug 19 19:57:46 2009 From: calarrudo at snf.stanford.edu (calarrudo at snf.stanford.edu) Date: Wed, 19 Aug 2009 19:57:46 -0700 Subject: Problem mrc SNF 2009-08-19 19:57:46: Argon Message-ID: Also, when you turn on the Argon in the front of the machine it does not go to 00.0 sccms it reads 00.8 sccms when you turn the knob all the way down. From emyers at snf.stanford.edu Fri Aug 21 14:12:47 2009 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 21 Aug 2009 14:12:47 -0700 Subject: Comment mrc SNF 2009-08-21 14:12:47: MRC Test Update Message-ID: The leak rate after a 10min Ar plasma was ~12mtorr/min. This was after cleaning resetting the front view port window. Subsequent Pt etch rate did not recover and the lab member is still concerned about the performance of the MRC. From lwchang at snf.stanford.edu Mon Aug 24 19:08:46 2009 From: lwchang at snf.stanford.edu (lwchang at snf.stanford.edu) Date: Mon, 24 Aug 2009 19:08:46 -0700 Subject: Problem mrc SNF 2009-08-24 19:08:46: O2 leak? Message-ID: My polymer mask usually holds up to 1min etch. (recipe: F23 30sccm 20mT 200W) I did a test run today and found out the polymer (30nm) was all gone after 1min etch...My sample is very susceptible to O2. Could there be a O2 leak path to the chamber? I know the process last worked on 8/12/09. Has there been any change to the system after 8/12? From calarrudo at snf.stanford.edu Tue Aug 25 17:29:20 2009 From: calarrudo at snf.stanford.edu (calarrudo at snf.stanford.edu) Date: Tue, 25 Aug 2009 17:29:20 -0700 Subject: Comment mrc SNF 2009-08-25 17:29:19: MRC Message-ID: After the small leak was found and fixed in the SF6 line above the shutoff I etched 500A of Pt with an Etch Time of 5:30. The MRC is now etching correctly for my wafers. From latta at snf.stanford.edu Wed Aug 26 13:03:33 2009 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 26 Aug 2009 13:03:33 -0700 Subject: Comment mrc SNF 2009-08-26 13:03:33: Ar sputter etch test Message-ID: Run after fix (15 sccm, 15 mT, 100W) etch rate = 3A/min Last test ER = 5A/min From latta at snf.stanford.edu Wed Aug 26 13:04:26 2009 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 26 Aug 2009 13:04:26 -0700 Subject: Problem mrc SNF 2009-08-19 11:00:45: Leak Message-ID: several things looked at including leak detection From latta at snf.stanford.edu Wed Aug 26 13:04:59 2009 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 26 Aug 2009 13:04:59 -0700 Subject: Problem mrc SNF 2009-08-19 19:40:13: MRC Etch Rate Changed Message-ID: User reports fixed- 24 Aug From latta at snf.stanford.edu Wed Aug 26 13:05:19 2009 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 26 Aug 2009 13:05:19 -0700 Subject: Problem mrc SNF 2009-08-19 19:57:46: Argon Message-ID: noted From latta at snf.stanford.edu Wed Aug 26 13:05:54 2009 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 26 Aug 2009 13:05:54 -0700 Subject: Comment mrc SNF 2009-08-21 14:12:47: MRC Test Update Message-ID: Member reports etch ok. From calarrudo at snf.stanford.edu Wed Aug 26 22:05:02 2009 From: calarrudo at snf.stanford.edu (calarrudo at snf.stanford.edu) Date: Wed, 26 Aug 2009 22:05:02 -0700 Subject: Problem mrc SNF 2009-08-26 22:05:01: MRC Etch Rate Problem Message-ID: The MRC has a problem with the Etch Rate its taking longer than 5:30 to etch wafers with 500A Pt. Confirmed with test wafer I etched early this evening, etched the 1st quarter of the wafer in 5:30, 2nd quaeter of same wafer under etched in 5:30.