Comment mrc SNF 2012-04-04 10:35:12: Ar recipe check

latta at snf.stanford.edu latta at snf.stanford.edu
Wed Apr 4 10:35:12 PDT 2012


After a report of extreme etching during O2 recipe I ran a thermal oxide qual using the standard Ar recipe (Ar 15sccm, 12.5mT, 100W, 580pV, 10 mins) and got 13.7A/min etch rate.  This is consistant with ER's during the resist burning study of Oct 2011.
We used the Ar recipe because it is the most sensitive to leaks.
Wlii the O2 recipe under observation.




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