Problem mrc SNF 2012-08-23 16:42:43: Wafer in MRC overheats

fpurkl at snf.stanford.edu fpurkl at snf.stanford.edu
Sun Dec 23 09:09:41 PST 2012


2 min of the standard Argon milling recipe heats the wafer to a point where the photoresist (1.6um 3612 hardbaked and exposed to UV for 10 min) completely wrinkles.
I've run 4 test etches:
2 min, standard recipe: sever wrinkling of photoresist
2 min, standard recipe + 1sccm of O2 (suggested by one user to decrease wrinkling): same sever wrinkling, higher PR etch rate
1 min standard recipe: no wrinkling
1 min, standard recipe + 1sccm of O2: no wrinkling, higher PR etch rate
Etching for 2 min followed by a cooldown for 2 min has be our standard procedure for a while and it has worked without any problems up until the generator switch (possibly unrelated).



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