From hjkim at exch.hpl.hp.com Fri Jun 6 14:33:59 2003 From: hjkim at exch.hpl.hp.com (Kim, Han-jun) Date: Fri, 6 Jun 2003 14:33:59 -0700 Subject: p5000 available from 3:30 till 5:30 pm Message-ID: <40700B4C02ABD5119F0000902787664406C0153D@hplex1.hpl.hp.com> Sorry about late notice. Best, Han-jun ===================================== Han-Jun Kim Hewlett-Packard Lab. (650) 857-8525 1501 Page Mill Rd. (650) 857-8948 FAX MS 1198 hjkim at hpl.hp.com Palo Alto, CA 94304 ===================================== From bashar at snf.stanford.edu Wed Jun 11 12:09:12 2003 From: bashar at snf.stanford.edu (Shabbir A. Bashar, Ph.D.) Date: Wed, 11 Jun 2003 12:09:12 -0700 Subject: Bashar's Reservation Cancelled for 6/11/03 Message-ID: I've cancelled my reservation for this afternoon. Shabbir. From bashar at snf.stanford.edu Wed Jun 11 12:41:34 2003 From: bashar at snf.stanford.edu (Shabbir A. Bashar, Ph.D.) Date: Wed, 11 Jun 2003 12:41:34 -0700 Subject: Question about Silicon Dry Etch Message-ID: Dear P5000 Users, I would like to know if you know of any company that offers Silicon dry etching service. My needs are as follows: (a) near vertical sidewall profile; (b) very smooth sidewall smoothness and (c) depth of app. 2.5um. A significant portion of my Si wafer surface is exposed (60% to 80%). Thanks in advance. Shabbir. From booth at snf.stanford.edu Fri Jun 13 06:46:12 2003 From: booth at snf.stanford.edu (Len Booth) Date: Fri, 13 Jun 2003 06:46:12 -0700 Subject: P5000etch Ch.C is ready Message-ID: <3EE9D5A4.F881E2C2@snf.stanford.edu> Cesar assembled Ch.C last night, & cycled wafers successfully, & the Shutdown for Ch.C has been cleared. First user needs to season Ch.C before doing regular etching. Len From mcvittie at snf.stanford.edu Tue Jun 17 15:37:22 2003 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Tue, 17 Jun 2003 15:37:22 -0700 Subject: Chamber C Wafer Sticking Problem Poll Message-ID: <3EEF9822.9332D5AB@snf.stanford.edu> P5000 Users, I am trying to better understand the Chamber C wafer sticking problem. By sticking I means that the wafer did not unload properly. If you used chamber C in the last month can you please fill out the following poll. Appromiate numbers are OK. Name______________ Number of times you used chamber C since May 15 ____ How many wafers did you run in this peroid ________ How many of these wafer got struck _______ At the edge of the wafer where the clamp contacts, what was the surface material on the wafers that got struck. Resist ___, Oxide ____, Si _____, Poly _____, Other _____ Are there any comments that you want to make concerning this problem. __________________________________________________________________ Can you please retuirn this poll to me. Thanks, Jim McVittie -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From bashar at snf.stanford.edu Tue Jun 17 18:40:33 2003 From: bashar at snf.stanford.edu (Shabbir A. Bashar, Ph.D.) Date: Tue, 17 Jun 2003 18:40:33 -0700 Subject: Chamber C Wafer Sticking Problem Poll In-Reply-To: <3EEF9822.9332D5AB@snf.stanford.edu> Message-ID: Hi Jim, Here's the answers to your poll: Name: Shabbir Bashar Number of times I used Chamber C since May 15: 12 Number of wafers run in this period: 64 (till 6/16/03) Number of wafers that got stuck: 9 (that is 9 out 12 times i.e. 75% of the time I used this system) Surface Material at the edge where clamp contacts the wafer: clean Si, never processed before, straight for the stores. My company as well as atleast one other user for Chamber C has come forward to share the cost (app. $2,700) of getting the replacement clamp from Applied Materials. I have been trying in vain to get some work done since 6/9/03 (i.e. almost for the last ten days) on the P5000 and EVERY TIME my wafer got stuck. Please be sensitive to the fact that this is seriously impeding my work. Thanks for your help and support. Shabbir. -----Original Message----- From: Jim McVittie [mailto:mcvittie at snf.stanford.edu] Sent: Tuesday, June 17, 2003 2:37 PM To: p5000etch at snf.stanford.edu Subject: Chamber C Wafer Sticking Problem Poll P5000 Users, I am trying to better understand the Chamber C wafer sticking problem. By sticking I means that the wafer did not unload properly. If you used chamber C in the last month can you please fill out the following poll. Appromiate numbers are OK. Name______________ Number of times you used chamber C since May 15 ____ How many wafers did you run in this peroid ________ How many of these wafer got struck _______ At the edge of the wafer where the clamp contacts, what was the surface material on the wafers that got struck. Resist ___, Oxide ____, Si _____, Poly _____, Other _____ Are there any comments that you want to make concerning this problem. __________________________________________________________________ Can you please retuirn this poll to me. Thanks, Jim McVittie From mcvittie at snf.stanford.edu Wed Jun 18 09:15:11 2003 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Wed, 18 Jun 2003 09:15:11 -0700 Subject: Chamber C Wafer Sticking Problem Poll References: Message-ID: <3EF0900F.A950ED9E@snf.stanford.edu> Bashar, Although we have seen some wafer sticking in the past, this time it is much worst than before. A replacement clamp has a long lead time so to the get the chamber up in the near term, it is important to understand what is going on with the present clamp. We are in contact with both Applied Materials and MIT to see what help we can get from them. This particular clamp came from MIT. So far, they are telling me they did not see the sticking problem on their tool. However, I still need to talk to the tech in charge of their tool. I am hoping that we can figure out some treatment to the clamp finger that will prevent the sticking. I will keep you posted on what I find out, Jim "Shabbir A. Bashar, Ph.D." wrote: > Hi Jim, > > Here's the answers to your poll: > > Name: Shabbir Bashar > Number of times I used Chamber C since May 15: 12 > Number of wafers run in this period: 64 (till 6/16/03) > Number of wafers that got stuck: 9 (that is 9 out 12 times i.e. 75% of the > time I used this system) > Surface Material at the edge where clamp contacts the wafer: clean Si, never > processed before, straight for the stores. > > My company as well as atleast one other user for Chamber C has come forward > to share the cost (app. $2,700) of getting the replacement clamp from > Applied Materials. I have been trying in vain to get some work done since > 6/9/03 (i.e. almost for the last ten days) on the P5000 and EVERY TIME my > wafer got stuck. Please be sensitive to the fact that this is seriously > impeding my work. > > Thanks for your help and support. > > Shabbir. > > -----Original Message----- > From: Jim McVittie [mailto:mcvittie at snf.stanford.edu] > Sent: Tuesday, June 17, 2003 2:37 PM > To: p5000etch at snf.stanford.edu > Subject: Chamber C Wafer Sticking Problem Poll > > P5000 Users, > > I am trying to better understand the Chamber C wafer sticking problem. > By sticking I means that the wafer did not unload properly. If you used > chamber C in the last month can you please fill out the following poll. > Appromiate numbers are OK. > > Name______________ > > Number of times you used chamber C since May 15 ____ > > How many wafers did you run in this peroid ________ > > How many of these wafer got struck _______ > > At the edge of the wafer where the clamp contacts, what was the surface > material on the wafers that got struck. Resist ___, Oxide ____, Si > _____, Poly _____, Other _____ > > Are there any comments that you want to make concerning this problem. > > __________________________________________________________________ > > Can you please retuirn this poll to me. > > Thanks, Jim McVittie -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From bashar at snf.stanford.edu Wed Jun 18 10:15:55 2003 From: bashar at snf.stanford.edu (Shabbir A. Bashar, Ph.D.) Date: Wed, 18 Jun 2003 10:15:55 -0700 Subject: Chamber C Wafer Sticking Problem Poll In-Reply-To: <3EF0900F.A950ED9E@snf.stanford.edu> Message-ID: Thanks Jim. Shabbir. -----Original Message----- From: Jim McVittie [mailto:mcvittie at snf.stanford.edu] Sent: Wednesday, June 18, 2003 8:15 AM To: bashar at snf.stanford.edu Cc: p5000etch at snf.stanford.edu; mtang at snf.stanford.edu; shott at chutzpah.stanford.edu Subject: Re: Chamber C Wafer Sticking Problem Poll Bashar, Although we have seen some wafer sticking in the past, this time it is much worst than before. A replacement clamp has a long lead time so to the get the chamber up in the near term, it is important to understand what is going on with the present clamp. We are in contact with both Applied Materials and MIT to see what help we can get from them. This particular clamp came from MIT. So far, they are telling me they did not see the sticking problem on their tool. However, I still need to talk to the tech in charge of their tool. I am hoping that we can figure out some treatment to the clamp finger that will prevent the sticking. I will keep you posted on what I find out, Jim "Shabbir A. Bashar, Ph.D." wrote: > Hi Jim, > > Here's the answers to your poll: > > Name: Shabbir Bashar > Number of times I used Chamber C since May 15: 12 > Number of wafers run in this period: 64 (till 6/16/03) > Number of wafers that got stuck: 9 (that is 9 out 12 times i.e. 75% of the > time I used this system) > Surface Material at the edge where clamp contacts the wafer: clean Si, never > processed before, straight for the stores. > > My company as well as atleast one other user for Chamber C has come forward > to share the cost (app. $2,700) of getting the replacement clamp from > Applied Materials. I have been trying in vain to get some work done since > 6/9/03 (i.e. almost for the last ten days) on the P5000 and EVERY TIME my > wafer got stuck. Please be sensitive to the fact that this is seriously > impeding my work. > > Thanks for your help and support. > > Shabbir. > > -----Original Message----- > From: Jim McVittie [mailto:mcvittie at snf.stanford.edu] > Sent: Tuesday, June 17, 2003 2:37 PM > To: p5000etch at snf.stanford.edu > Subject: Chamber C Wafer Sticking Problem Poll > > P5000 Users, > > I am trying to better understand the Chamber C wafer sticking problem. > By sticking I means that the wafer did not unload properly. If you used > chamber C in the last month can you please fill out the following poll. > Appromiate numbers are OK. > > Name______________ > > Number of times you used chamber C since May 15 ____ > > How many wafers did you run in this peroid ________ > > How many of these wafer got struck _______ > > At the edge of the wafer where the clamp contacts, what was the surface > material on the wafers that got struck. Resist ___, Oxide ____, Si > _____, Poly _____, Other _____ > > Are there any comments that you want to make concerning this problem. > > __________________________________________________________________ > > Can you please retuirn this poll to me. > > Thanks, Jim McVittie From booth at snf.stanford.edu Fri Jun 27 14:52:46 2003 From: booth at snf.stanford.edu (Len Booth) Date: Fri, 27 Jun 2003 14:52:46 -0700 Subject: P5000etch Chamber C recipes Message-ID: <3EFCBCAE.4C77E8D8@snf.stanford.edu> Users - The used clamp that we currently have in Ch C, continues to have trouble unloading wafers. Cesar did some testing that indicates a longer final pumpout step for recipes in Ch C, can make unloading wafers more reliable (but probably not 100% reliable!). Until furtner notice, we will require a recipes run in Ch C to include a final pumpout step (the last step in every recipe) to use a step time of at least 240 seconds. This morning, I edited every recipe for Ch C to include this 240 sec pumpout step. Do NOT shorten this step. We are trying to keep Ch C operating, while we wait for a new clamp ring to be manufactured and delivered to us in August. Len