about microloading and aspect ratio dependent etching effect

[Jin Yao]

Hi, 

 

I was wondering if any other people concern about the microloading and
aspect ratio dependent etching effect in P5000?

 

 Recently what I use is Ch. C. Poly Etch with OX as mask, which is quite
standard Si etch.

 However I got ( twice ) 5700A for 2 um width gap and 8700A for adjacent 10
um gap in 80sec M.E. recipe.

Mine is not poly, though. is Crystalline Si.  Not at 3000A/min range as the
manual said.

 

Anyone have some comments on how your etching rate range is or how to
improve the microloading among your features?

 

Thank you!  

 

Jin 

 

 

 

 

 

 

 

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