From kimsora at stanford.edu Mon Jul 10 10:16:13 2006 From: kimsora at stanford.edu (Sora Kim) Date: Mon, 10 Jul 2006 10:16:13 -0700 Subject: nitride etch rate in p5000 Message-ID: <004901c6a444$8b7e9d20$325640ab@kimsora> Dear all, I am wondering if there is a recipe for nitride with high etch rate as much as 300nm/min. I measured the etch rate of Jim-Nitride. It was about 60-70nm/min. Thank you very much. Sora -------------- next part -------------- An HTML attachment was scrubbed... URL: From mcvittie at snf.stanford.edu Mon Jul 10 13:09:34 2006 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Mon, 10 Jul 2006 13:09:34 -0700 Subject: nitride etch rate in p5000 References: <004901c6a444$8b7e9d20$325640ab@kimsora> Message-ID: <44B2B3FE.45C09CBB@snf.stanford.edu> Hi, The nitride etch which I install on the P5000 when the tool first started up was named CH.B Jim-nitr (Parameters: CHF3 25 CF4 50 Ar 100 pressure 250mT power 500W magnetic field 60.0Gauss Endpoint detection is with file: jim_nit.alg Wavelength is 4170 (which is for SiN) Etch rates: For nitride: 5268 A/min For photoresist: 1894.7 A/min Profile of this Si3N4 etch: sidewalls have 85degree slope. Sora Kim wrote: > Part 1.1 Type: Plain Text (text/plain) > Encoding: quoted-printable From eenriquez at snf.stanford.edu Tue Jul 11 15:34:36 2006 From: eenriquez at snf.stanford.edu (Elmer Enriquez) Date: Tue, 11 Jul 2006 15:34:36 -0700 Subject: P5000 Update 7/11 Message-ID: <44B4277C.6020007@snf.stanford.edu> Ch.A- Down for "He valve not opening...". Found the root cause of this and various other problems of the system . The culprit is a coolant leakage from the chuck into the helium cooling line. This explains the 1) bad Ch.A pump. 2) dark-brown film on the chuck. 3) erratic backside helium manifold pressure reading 4) "He valve not opening" fault 5) burning resist during process . We will pull out the cathode assembly tonight to evaluate the damage. It is very likely that we will need to replace the cathode.... but we'll see. Ch. B- Up We've had a couple of "high backside He leak rate" faults. I believe that this is caused by warped or mis-aligned wafers because the "backside He leak rate" routine is working as it should now. If you experience this fault, verify that the wafer flats are facing out of the cassette toward the load lock and re-run the lot. Another problem is the MFC#3 flow faults. This error is due to a bad recipe. The MFC# 3 flow setpoint in the recipe is set at around 5% of maximum flow. Ideally, the flow should be kept around 10% - 90% of maximum flow. This particular MFC (CF4), the minimum flow you can operate at without faulting is 15 sccm. Ch. C- Up The new wafer clamp should be here on Thursday. From rmelamud at stanford.edu Sat Jul 15 01:54:46 2006 From: rmelamud at stanford.edu (Renata Melamud) Date: Sat, 15 Jul 2006 01:54:46 -0700 Subject: SOI stuck in p5000 Ch B Message-ID: <1152953686.44b8ad56a8a36@webmail.stanford.edu> Hi p5000 users, I was running 8 wafers for processing in ChB On the 6th wafer, I got a robot position fault. I tried to return all wafers to cassette, but the system seems to have lost the 6th wafer. It's not in the elevator and I don't see it on the robot arm. So it's probably still in the chamber. If you don't have to use p5000 this weekend, I would really appreciate the staff pulling it out before the machine is used again. However, I didn't red light it, since the other chambers might be usable. If you have any suggestions on how to find / retrieve this wafer, please let me know. The wafer is important to me. Thanks a bunch, Renata From elmere at stanford.edu Wed Jul 26 18:51:59 2006 From: elmere at stanford.edu (Elmer Enriquez) Date: Wed, 26 Jul 2006 18:51:59 -0700 Subject: P5000 Chamber A update Message-ID: <44C81C3F.7060500@stanford.edu> Chamber A is down for a bad mechanical pump. The pump is being rebuilt and will be ready next Monday. The chamber will be available by next Tuesday.