From shuluc at stanford.edu Tue May 4 16:22:55 2010 From: shuluc at stanford.edu (Shu-Lu Chen) Date: Tue, 4 May 2010 16:22:55 -0700 (PDT) Subject: particles issues of p5000 Message-ID: <1641128860.599769.1273015375550.JavaMail.root@zm06.stanford.edu> Hi, Is there anyone with the experience of using chamber A to etch Al/Si on top of Ge surface ? We found some particles after the Al/Si etch and are wondering what those particles could be. Thanks for any information. Best, Erik From mmessana at stanford.edu Tue May 4 16:49:37 2010 From: mmessana at stanford.edu (Matthew W. Messana) Date: Tue, 4 May 2010 16:49:37 -0700 Subject: particles issues of p5000 In-Reply-To: <1641128860.599769.1273015375550.JavaMail.root@zm06.stanford.edu> References: <1641128860.599769.1273015375550.JavaMail.root@zm06.stanford.edu> Message-ID: <00aa01caebe4$74eb9ef0$5ec2dcd0$@edu> Depending on your etch, p5000 may not etch the silicon in your Al/Si. You should try to do a "freckle etch" to get rid of the Si. John Shott made some suggestions to me for doing the freckle etch in drytek2. The message is below. Matt ----------------------------------------------------------------------- From: John Shott ----------------------------------------------------------------------- The references that I can find to a freckle etch in drytek2 date to the era when we could still use Freon 115 (C2FCl5) so that information is not strictly applicable. It was, however, a short silicon etch using the same recipe as our normal poly etch at that time .... just a very short etch: pressure = 150 mTorr RF power = 500 watts Time = 15 sec Freon 115 flow = 50 sccm SF6 flow = 50 sccm and that matched the recipe that we normally used for poly silicon in that era. If I am not mistaken, our current poly etch is: pressure = 150 mTorr RF power = 400 watts SF6 flow = 117 sccm Freon 22 flow = 51 sccm I would suggest also trying a short 15 second etch using this recipe and think that it should work well to clean up any residual silicon dust without doing too much damage to anything else. Note: you'll want to watch this carefully .... I think that there is a trouble report that we have not addressed that if the second numbers on the recipe 2 process time are set to other than "00" that it will not stop that step at the proper time. So, I'd set a time of 00:15 .... but would be watching it like a hawk to hit the "Clear wafer" button (the red one just above the green Standby button to terminate the process after 15 seconds in case it doesn't terminate when it reaches 15 seconds. Of course, a test wafer is always a good idea. ----------------------------------------------------------------------- ----------------------------------------------------------------------- -----Original Message----- From: Shu-Lu Chen [mailto:shuluc at stanford.edu] Sent: Tuesday, May 04, 2010 4:23 PM To: p5000etch at snf.stanford.edu Subject: particles issues of p5000 Hi, Is there anyone with the experience of using chamber A to etch Al/Si on top of Ge surface ? We found some particles after the Al/Si etch and are wondering what those particles could be. Thanks for any information. Best, Erik From cmcg at stanford.edu Fri May 21 18:05:32 2010 From: cmcg at stanford.edu (Chris McGuinness) Date: Fri, 21 May 2010 18:05:32 -0700 (PDT) Subject: please return recipes to original settings In-Reply-To: <182194641.374272.1274490149884.JavaMail.root@zm02.stanford.edu> Message-ID: <201571733.374344.1274490332181.JavaMail.root@zm02.stanford.edu> If you change the settings for a given recipe please be sure to return them to the original values when you are finished. I found jim-ox for Ch. B changed in the following: mag field: 60gauss to 50 gauss CHF3: 30sccm to 15sccm CF4: 15sccm to 30sccm I don't think I could booby-trap a recipe better than changing it in this way. Fortunately I have dealt with so many problems on this tool that I check everything extremely anally. If it were up to me I would not allow anyone to change any of the recipe settings except the run time. If people want to experiment there could be a separate recipe for this. -Chris