Problem pquest SNF 2009-06-08 12:25:16: Variable air leak--only OK for O2 etching

jimkruger at snf.stanford.edu jimkruger at snf.stanford.edu
Mon Jun 8 12:25:17 PDT 2009


I suspect the variable air leak is the ferrofluidic feed-thru for the wafer clamp.
I would not use the system for anything except recipes with large O2 flows.  BCl3, in particular, is likely to cause a mess.
jim




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