From wistey at stanford.edu Tue Jul 1 11:05:53 2003 From: wistey at stanford.edu (Mark Wistey) Date: Tue, 1 Jul 2003 11:05:53 -0700 Subject: user meeting In-Reply-To: Message-ID: I just got the email about the pquest meeting. (A little more notice would've been helpful...) What went on there? - Mark From mcvittie at snf.stanford.edu Tue Jul 1 11:55:09 2003 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Tue, 01 Jul 2003 11:55:09 -0700 Subject: Restrictions on PQuest Training Message-ID: <3F01D90D.655B1F5D@snf.stanford.edu> Henny, I would like all new users for the PQuest to get my approval before getting training on this tool. I want to find out what materials and processes they propose to use and how the present users feel about what is proposed. Thanks, Jim -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From mcvittie at snf.stanford.edu Tue Jul 1 12:12:07 2003 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Tue, 01 Jul 2003 12:12:07 -0700 Subject: PQuest Logbook and New Processes Message-ID: <3F01DD07.A855C1A2@snf.stanford.edu> PQuest Users, 1. Because of all the recent problems on the PQuest, I would like all new proposed processes to get approval before being tried. Until we work out a better procedure, send me your proposals and I will get input from the rest of the PQuest users. The goal in to keep incompatible processes out of the PQuest, or at least to let all the users know what is being proposed. 2. From now on, the filling out the PQuest logbook is mandatory of use of the PQuest. If you do not fill out the log, you may be taken off the tool for a while. Mike Wiemer will be putting together a new logsheet to help us better track processing problems. Thanks, Jim McVittie -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From hphan at snf.stanford.edu Tue Jul 1 14:44:59 2003 From: hphan at snf.stanford.edu (Henry Phan) Date: Tue, 01 Jul 2003 14:44:59 -0700 Subject: Reservation Time Message-ID: <3F0200DB.F65523E2@snf.stanford.edu> Hi, As you all known that Jim had assigned the non-GaAs users can use the machine three day a week. Couple users agreed that a good reservation policy would be 3hrs of the prime time (8am-6pm) and 10hrs total for the 3 day. If you want to use the machine longer than that, please use it after the prime time. Don't forget the log book. Jim will remove your name off the list if you do. Thank you very much!!!! -- Henry _ _ _ _ Henry Q. Phan Stanford Nanofabrication Facility CIS Room 146, Mail Code 4070 Stanford, CA 94305 (650)725-3659 hphan at snf.stanford.edu From mcvittie at snf.stanford.edu Wed Jul 2 22:09:12 2003 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Wed, 02 Jul 2003 22:09:12 -0700 Subject: PQuest Process Info Request Message-ID: <3F03BA78.509E9E5F@snf.stanford.edu> PQuest Users, I would to get a handle on all the processes being run on the PQuest etcher. Please fill out the following questionnaire for any process you have previously run on the PQuest and want to run in the future. Please return this info to me in the next week. I will try to get a copy of all the processes put into the back of the log book. Thanks, Jim McVittie Name:________________________ Group/Company:_________________________ Email address: ____________________ Date:__________________________ Process name: ____________________ Material to be etched:____________ Chamber condition procedure: Step 1 Top Power______W, Bottom Power_______W, Pressure____________mT Gases and flows_________________________ Plasma time________min Step 2 Top Power______W, Bottom Power_______W, Pressure____________mT Gases and flows_________________________ Plasma time________min Comments:__________________________________________________________ ___________________________________________________________________ Etch Process: Sample size_________, Mask Mat'l___________, Carrier__________ Step 1 Top Power______W, Bottom Power_______W, Pressure____________mT Gases and flows___________________________________________________ Temperature ______C, Bias voltage______V, Plasma time _________sec Step 2 Top Power______W, Bottom Power_______W, Pressure____________mT Gases and flows___________________________________________________ Temperature ______C, Bias voltage______V, Plasma time _________sec Step 3 Top Power______W, Bottom Power_______W, Pressure____________mT Gases and flows___________________________________________________ Comment on rates, selectivity and on how well this process works: ________________ _________________________________________________________________ _________________________________________________________________ -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From mcvittie at snf.stanford.edu Wed Jul 2 22:16:58 2003 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Wed, 02 Jul 2003 22:16:58 -0700 Subject: III-V Processing Period Begins Thursday Message-ID: <3F03BC4A.D045C458@snf.stanford.edu> PQuest Users, Just a reminder that this week the PQuest is reserved for III-V material etching on Thursday, Friday and Saturday. As far as I am aware, the only III-V materials presently being etched are GaAs and AlGaAs. Jim -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From cshen at briontech.com Thu Jul 3 10:53:02 2003 From: cshen at briontech.com (cshen at briontech.com) Date: Thu, 3 Jul 2003 10:53:02 -0700 (PDT) Subject: reservation cancelled Message-ID: <61091.171.64.100.112.1057254782.squirrel@mail.briontech.com> From dhui at stanford.edu Thu Jul 3 18:58:11 2003 From: dhui at stanford.edu (Hui Deng) Date: Thu, 3 Jul 2003 18:58:11 -0700 Subject: Reservation on Sat. cancelled Message-ID: <003001c341cf$b98bf9e0$441b40ab@stanford.edu> From alirezaa at stanford.edu Mon Jul 7 22:04:27 2003 From: alirezaa at stanford.edu (Alireza Khalili) Date: Mon, 07 Jul 2003 22:04:27 -0700 Subject: Tuesday's reservation cancelled In-Reply-To: <61091.171.64.100.112.1057254782.squirrel@mail.briontech.co m> Message-ID: <5.2.1.1.2.20030707220329.00b44d80@alirezaa.pobox.stanford.edu> From mcvittie at snf.stanford.edu Wed Jul 9 09:55:29 2003 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Wed, 09 Jul 2003 09:55:29 -0700 Subject: Deleting Old Processes on PQuest Message-ID: <3F0C4901.18320ADA@snf.stanford.edu> PQuest Users, Thanks for senting me your PQuest processes. Now that I have all the current processes, I am going to start deleting all the old processes that are no longer being used. Any process that has not been sent to me by THIS FRIDAY ( 5pm July 11) will be considered a new process and will need to get my approval being able to be run on the PQuest. Only processes that I have recieved will be kept on the PQuest. Over the weekend, I will send out a list of all the current approved processes. Running unproved processes will be ground for being removed from the PQuest user list. Thanks, Jim McVittie -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From dhui at stanford.edu Wed Jul 9 10:50:46 2003 From: dhui at stanford.edu (Hui Deng) Date: Wed, 9 Jul 2003 10:50:46 -0700 Subject: Reservations today cancelled, Message-ID: <001301c34642$a06c8c00$0200a8c0@stanford.edu> Sorry for the late notice... From mcvittie at snf.stanford.edu Wed Jul 9 22:19:50 2003 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Wed, 09 Jul 2003 22:19:50 -0700 Subject: PQuest Process Form should filled out in full Message-ID: <3F0CF776.3249702D@snf.stanford.edu> PQuest Users, I am senting out the process form again since some of you seem to have loss it. I expect the form to be filled out in FULL including the results section. Unless you are away and have contacted me, incomplete form do not count. Thanks, Jim McVittie Name:________________________ Group/Company:_________________________ Email address: ____________________ Date:__________________________ Process name: ____________________ Material to be etched:____________ Chamber condition procedure: Step 1 Top Power______W, Bottom Power_______W, Pressure____________mT Gases and flows_________________________ Plasma time________min Step 2 Top Power______W, Bottom Power_______W, Pressure____________mT Gases and flows_________________________ Plasma time________min Comments:__________________________________________________________ ___________________________________________________________________ Etch Process: Sample size_________, Mask Mat'l___________, Carrier__________ Step 1 Top Power______W, Bottom Power_______W, Pressure____________mT Gases and flows___________________________________________________ Temperature ______C, Bias voltage______V, Plasma time _________sec Step 2 Top Power______W, Bottom Power_______W, Pressure____________mT Gases and flows___________________________________________________ Temperature ______C, Bias voltage______V, Plasma time _________sec Step 3 Top Power______W, Bottom Power_______W, Pressure____________mT Gases and flows___________________________________________________ Comment on rates, selectivity and on how well this process works: ________________ _________________________________________________________________ _________________________________________________________________ -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From mcvittie at snf.stanford.edu Thu Jul 10 08:57:37 2003 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Thu, 10 Jul 2003 08:57:37 -0700 Subject: PQuest Processes and Names Message-ID: <3F0D8CF1.5A07CA99@snf.stanford.edu> PQuest, >From my standpoint of trying to get on top of the processes in the PQuest, I consider a new process name a new process. If you are using GIGI1 with a different name, it is a new process, and you need to fill out the form. After all the forms are in, we can look at starting some new naming conventions to make similar processes have similar or the same name. For now, I want the users to tell me what the different processes on the PQuest are and which ones can be deleted. My plan is to keep copies of the deleted in my office or with the student overseeing the processes for the PQuest. I sorry about all the emails but it seems like I am dealing with junior high kids. Jim -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From mcvittie at snf.stanford.edu Fri Jul 11 09:19:42 2003 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Fri, 11 Jul 2003 09:19:42 -0700 Subject: Etch Process Mixing Guidelines from AMAT Message-ID: <3F0EE39D.39DACFBF@snf.stanford.edu> PQuest Users, Since we have had lots of questions about mixing etch processes on the PQuest, I thought it would interested for you to see what Applied Materials recommends for their dielectric chambers. Jim MxP+ Process Mixing Guidelines The MxP+ chamber has been designed to confine polymer deposition to the chamber liners. Because the chamber liner polymer can be removed and deposited during the etch process, there are secondary process effects that need to be considered when the MxP+ chamber is used in a mixed process mode. Below are general process mixing guidelines for the various dielectric etch processes. Pad and Via vs. Front End Processes Due to metal contamination concerns from sputtered metals (Al, Pt, etc.) and etched TiN or TaN, it is recommended that processes such as via, pad, oxide and nitride hardmask open for metal (Al, Pt, etc.) processes typically stopping on TiN or TaN liners be kept separate from front end processes. An additional reason to separate these processes is that the polymer produced is different from the insulating polymer produced from contact, spacer, etc., processes and may affect the processes differently. All CoSix contact etch processes should be in dedicated chambers. Polymerizing vs. Lean Processes The concern from mixing polymerizing and lean processes is that lean processes will tend to etch the chamber liner polymer more so than polymerizing processes. The excessive etching of the chamber liner polymer can become a particle source. Another concern is that the Fluorine containing species are released from the chamber liner polymer and will contribute to the process, so maintaining the chamber liner polymer becomes critical especially with low etch rate or F-starved processes. Mixing of these processes is possible through management of the process loading, however, chamber seasonings may be required. High O2 Processes vs. Low O2 Processes Oxygen containing processes can be divided into two categories of low O2/CHxFy ratio (polymer depositing ) processes and high O2/CHxFy ratio (non-polymer depositing) processes. The same concerns would apply when mixing polymerizing vs. lean processes. In the case of mixing nitride etch processes such as high O2/CH3F processes (i.e. nitride spacer ) with low O2/CH3F processes (ie. nitride locos) can create problems. The polymer produced from CH3F processes does not adhere as well as polymer produced from non-CH3F containing processes. Processes relatively high in O2 will remove the powdery, poorly adhering polymer and can result in particle and process drift problems. Planarization Processes Planarization processes such as SOG and photoresist etch back are usually kept separate from other processes due to their sensitivity to chamber conditions and low MTBC when mixed with other processes due to particle problems. For processes that are more polymerizing due to selectivity requirements, such as SOG etch back processes with SOG:TEOS selectivity <1, these processes can be mixed with other processes. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From booth at snf.stanford.edu Fri Jul 11 12:37:22 2003 From: booth at snf.stanford.edu (Len Booth) Date: Fri, 11 Jul 2003 12:37:22 -0700 Subject: Pquest Recipe Identification Message-ID: <3F0F11F2.E03A179F@snf.stanford.edu> All Users - Jim McVittie has asked all of you to e-mail him with the Recipe names that you still need & use on the machine, with the process purpose of the recipe, and the process parameters. Since some recipes may be used very infrequently, I've attached to this e-mail a listing of every recipe name that is currently on the machine (as of July10,2003), to help jog some of your memories, and hopefully get all useful recipe info to Jim soon. Please look at this list, and e-mail Jim with the information he has asked for. Recipes that are not identified & approved by Jim, will be deleted. Len -------------- next part -------------- A non-text attachment was scrubbed... Name: RCPNAMES.doc Type: application/msword Size: 33280 bytes Desc: not available URL: From hphan at snf.stanford.edu Fri Jul 11 17:49:52 2003 From: hphan at snf.stanford.edu (Henry Phan) Date: Fri, 11 Jul 2003 17:49:52 -0700 Subject: Reservation Time Message-ID: <3F0F5B2F.A826D100@snf.stanford.edu> Pquest Users, There seems to be some confusion about the reservation policy on the Pquest, so I'd like to clarify the situation. GaAs/Non-GaAs Week Split: GaAs etching can be done during the Non-GaAs days (Sun, Mon & Tues), but reservations for GaAs etching are not allowed during this time and it is generally discouraged because of the high usage by Non-GaAs users. Reservations limits during the Non-GaAs days: The 10hr reservation limit is a total limit, including prime and non-prime time. There are only 72 hours per week availible, and one user cannot reserve more than 10 hours for the 3 days. If you do not follow this rule, I will delete your reservations. Please follow the rule. Note: you can use the machine for more than 10 hours/3 days, just not reserve it. -- Henry _ _ _ _ Henry Q. Phan Stanford Nanofabrication Facility CIS Room 146, Mail Code 4070 Stanford, CA 94305 (650)725-3659 hphan at snf.stanford.edu From zlrao at stanford.edu Mon Jul 14 21:35:17 2003 From: zlrao at stanford.edu (Zhilong Rao) Date: Mon, 14 Jul 2003 21:35:17 -0700 Subject: Reservation on 9:30am--12:00 tomorrow cancelled Message-ID: <000e01c34a8a$7e753a60$39aa0c80@Rao> An HTML attachment was scrubbed... URL: From mcvittie at snf.stanford.edu Thu Jul 17 17:18:43 2003 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Thu, 17 Jul 2003 17:18:43 -0700 Subject: Draft of GaAs Etch Processes Message-ID: <3F173CE3.EF17EB4D@snf.stanford.edu> PQuest Users, I am back from a short vacation. Attached is an Excel file with the GaAs Processes that were sent to me. If you sent me a GaAs process, please read this over. Please send me any corrections or missing info. I will try and get to the Non-GaAs process tomorrow. Jim -------------- next part -------------- A non-text attachment was scrubbed... Name: GaAsProcesses-draft.xls Type: application/msexcel Size: 17408 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From zlrao at stanford.edu Thu Jul 17 20:38:03 2003 From: zlrao at stanford.edu (Zhilong Rao) Date: Thu, 17 Jul 2003 20:38:03 -0700 Subject: Tomorrow morning pquest is free! References: <3F173CE3.EF17EB4D@snf.stanford.edu> Message-ID: <000f01c34cdd$feca2590$39aa0c80@Rao> From cshen at briontech.com Tue Jul 22 20:55:54 2003 From: cshen at briontech.com (cshen at briontech.com) Date: Tue, 22 Jul 2003 20:55:54 -0700 (PDT) Subject: pquest finished earlier, free from now Message-ID: <61126.171.64.100.112.1058932554.squirrel@mail.briontech.com> From booth at snf.stanford.edu Fri Jul 25 13:44:56 2003 From: booth at snf.stanford.edu (Len Booth) Date: Fri, 25 Jul 2003 13:44:56 -0700 Subject: Pquest Maintenance downtime Message-ID: <3F2196C8.3C909D06@snf.stanford.edu> Pquest Users - I have reserved prime time next Wednesday July 30 from 0700 thru 1800, to remove & repair some screws in the LoadLock assembly. The necessary machine work and reinstallation and alignment of the load arm & wafer transfer should take much less time than I have reserved. If the machine is ready earlier than 1800 I will remove the remaining reservation. Len