PQuest Process Form should filled out in full
Jim McVittie
mcvittie at snf.stanford.edu
Wed Jul 9 22:19:50 PDT 2003
PQuest Users,
I am senting out the process form again since some of you seem to have
loss it. I expect the form to be filled out in FULL including the
results section. Unless you are away and have contacted me, incomplete
form do not count.
Thanks, Jim McVittie
Name:________________________ Group/Company:_________________________
Email address: ____________________ Date:__________________________
Process name: ____________________ Material to be etched:____________
Chamber condition procedure:
Step 1
Top Power______W, Bottom Power_______W, Pressure____________mT
Gases and flows_________________________ Plasma time________min
Step 2
Top Power______W, Bottom Power_______W, Pressure____________mT
Gases and flows_________________________ Plasma time________min
Comments:__________________________________________________________
___________________________________________________________________
Etch Process:
Sample size_________, Mask Mat'l___________, Carrier__________
Step 1
Top Power______W, Bottom Power_______W, Pressure____________mT
Gases and flows___________________________________________________
Temperature ______C, Bias voltage______V, Plasma time _________sec
Step 2
Top Power______W, Bottom Power_______W, Pressure____________mT
Gases and flows___________________________________________________
Temperature ______C, Bias voltage______V, Plasma time _________sec
Step 3
Top Power______W, Bottom Power_______W, Pressure____________mT
Gases and flows___________________________________________________
Comment on rates, selectivity and on how well this process works:
________________
_________________________________________________________________
_________________________________________________________________
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