request for a pquest user meeting very soon
Randy True
true at snf.stanford.edu
Wed Jun 18 15:40:36 PDT 2003
Pquest Users, Dr. McVittie, and Henry:
In the past couple weeks, I have heard rumors about GaAs users having
problems with their processes and the possibility of restricting the
access of non-GaAs users to the pquest. Technical problems with standard
etch processes (such as etch rates and strange films being deposited)
should be logged in the log book and if serious, sent out to the
pquest at snf email list or typed up in coral. I propose that we have a
pquest users meeting in the next couple of days to discuss these issues.
In the meantime, can all users who have had problems in the Pquest in
the last month, please send out an email to pquest at snf describing the
probelms in detail, so then we can complie a list and make informed
decisions.
I informally found out today that there was a problem with a film being
deposited on a dummy wafer and Dan Pickard sent the film out for
analysis and determined that the film was particles of silicon oxide.
This is significant information that needs to be shared with all pquest
users. I had problems plating into wafers etched on 6/4, and I thought
this was due to an adhesion problem. But now that I know that people
have seen unwanted films deposited in the Pquest, I am also considering
that as the source of this problem. I always etch do a 20min seasoning
with my recipe on the Si dummy wafer and did not see any obvious film
deposition. Dr. McVittie told me today that the system went through a
wet clean on Mon. Have the GaAs users with problems done any etches
since then? Are the problems still there?
This is why it is important for users to COMMUNICATE about technical
problems with a machine. I realize that users may want to take some time
to figure out what the problem is, but the current situation has gone
far past that. GaAs users have substantial problems and instead of
addressing them in an open format, they are having important discussions
behind closed doors. That is simply not right. I and other non-GaAs
users have spent considerable time and money developing processes on the
pquest and we should have a voice in talks about policy changes. If you
are a non-GaAs user and you want to keep using the pquest, then please
speak up before it's too late.
I completely agree that maintaining GaAs etch processes is a top
priority, but I think that the current problems can be solved without
drastic changes in the materials policy of the pquest. There are
approved processes that can be run concurrently with GaAs etching, and
problems with GaAs etching will most likely also cause problems with
these etches. As a first step to preserving all approved processes (GaAs
and non), we need to come up with good diagnostics to determine if
chamber conditions are abnormal, and then good cleaning procedures to
return the system to normal. Problems with GaAs etching are a recurring
issue (see pquest archive from last summer) and we need to solve it once
and for all. Let's all get in the same room and figure this out.
--Randy True
Summary of my recent problems:
5/20 - good etch, no plating problems
6/4 - bad etch, at least 10% reduction in etch rate, no plating
Data on Pquest Usage:
June 03 45 Logs, 14 Users, Non GaAs Materials: PI, Cyclotene,
Al/Ti/Er/Yb, SiO2, Ni, Zr0, Al
May 03 49 Logs, 13 Users, Non GaAs Materials: PI, Al/Ti/Er/Yb, SiO2, Ni
April 03 12 Logs, 6 Users, Non GaAs Materials: PI, SiO2
Mar 03 18 Logs, Non GaAs Materials: PI, Al/Ti/Er/Yb, SiO2
Feb 03 10 Logs, Non GaAs Materials: PI, Al/Ti/Er/Yb
Jan 03 20 Logs, Non GaAs Materials: PI, Al/Ti/Er/Yb
More info on pquest usage for the last year, including when new
processes were introduced, are listed on my cube.
More information about the pquest
mailing list