Poll on Use of PQuest at 200C

Jim McVittie mcvittie at snf.stanford.edu
Wed Nov 5 15:09:59 PST 2003


All,

It is clear I have few supporters for trying out the PQuest at temperatures above
100C. I will wait a year and see if I get the same reaction next year.

    Jim

Luigi Scaccabarozzi wrote:

> Jim,
> there is something not clear to me about the o-ring : you are saying that
> every time the chuck goes above 100C
> we have to remove and put back in place/change the o-ring?
> Would that mean opening the chamber evry time these users run their
> process?
> I hope I misunderstood you, otherwise I don't see why the tool has a
> rubber o-ring AND is supposed to run high tmep processes...
> Thanks
> Gigi
>
> On Wed, 5 Nov 2003, Jim McVittie wrote:
>
> > Hui,
> >
> > See reply below.
> >
> > > Jim,
> > >
> > > I know essentially nothing about that H2 treatment, so it is hard to vote
> > > yes or no. But I have a few concerns. Firstly, can the rubber ring sustain
> > > such high temperature?
> > >
> >
> > To go above 100C the chuck o-ring has to be removed. With this o-ring removed,
> > no rubber
> > /polymer parts should get hot when the chuck is heated above 100C. The
> > processes to worry about in regard to the o-ring are those using high
> > percentages oxygen, such used for chamber cleaning and etch polymers.
> >
> > >
> > > Is there a cleaning/seasoning recipe required after/before the high-T H2
> > > procedure? And will it make a serious damage or contamination to the
> > > system if a wrong wafer is put in for that H2 procedure?
> > >
> >
> > As with any significant process changes in a plasma system, the chamber needs
> > seasoning before starting a new process. This is true for all process changes.
> > If your processs is different than that used by the previous user, the general
> > rule is to start by seasoning the chamber using the new process and a few
> > dummy wafers.
> >
> > >
> > > If the system is able to handle the procedure, are there special steps to
> > > take before and after the H2 plasma procedure, or, will the procedure be
> > > much trickier than the standard one, so that users might be more
> > > vulnerable to mistakes?
> > >
> > >
> >
> > At this time, I do not see that a H2 process will cause any special problems
> > other than the expected thermal stress on the chuck and the connections to it.
> > There would be additional procedures needed before and after heating the chuck
> > above 100C. As mentioned above the chuck o-ring would have to removed and
> > replaced afterwards. In addition, we would probably want to blow out the chuck
> > cooling line with N2 before heating the chuck.
> >
> >     Jim
> >
> > > Hui
> > >
> > > Quoting Jim McVittie <mcvittie at snf.stanford.edu>:
> > >
> > > > PQuest Users,
> > > >
> > > > I have 2 users, who would like to treat their samples in a H2 plasma at
> > > > temperatures between 200 and 250C. The PQuest should be able to do this
> > > > since it was designed to do PECVD as well as etching in that it has a
> > > > heater in the wafer check. Right now we have no written procedures for
> > > > going above 90C and there is a question about how high of a temperature
> > > > the Vespel wafer lift pins can take. As for the Vespel pins, I am still
> > > > checking to see which type of Vespel was used for making them. The
> > > > mechanical properities for the lowest grade Vespel are good to 280C.
> > > >
> > > > If the all currents materials in the system will allow going to 200 or
> > > > 250C, what is your opinion of allowing these users to use the PQuest in
> > > > this mode?  Right now I do not believe their will be a problem but we
> > > > have not used the chuck heater for a number of years.
> > > >
> > > >     Thanks, Jim
> > > >
> >
-------------- next part --------------
A non-text attachment was scrubbed...
Name: mcvittie.vcf
Type: text/x-vcard
Size: 422 bytes
Desc: Card for Jim McVittie
URL: <http://snf.stanford.edu/pipermail/pquest/attachments/20031105/7b35773e/attachment.vcf>


More information about the pquest mailing list