From grupp at snowmass.Stanford.EDU Tue Feb 3 21:11:00 2004 From: grupp at snowmass.Stanford.EDU (Dan Grupp) Date: Tue, 3 Feb 2004 21:11:00 -0800 (PST) Subject: request Message-ID: Guys, I have reserved (cmfaulkn) pquest time on this Wednesday. The processes are part of the non-gaas processes. It's the night before, and no one has signed up, and we really don't want to stay hear all night if the machine is free tomorrow. I looked at t the usage, which has been rather sparse, so i don't think it will have impact on anyone. I hope i am being respectful of your processing needs. Please contact me directly at 650-704-9551, and not via email if you'd like to discuss more (i talked to rafa, and couldn't find gigi and mark). THanks, DAn --------------------------------------------------------------------------- Dr. Daniel Grupp, Visiting Scholar Center for Integrated Systems Stanford University Stanford, CA 94305 (650) 724-6911 FAX: 723-4659 --------------------------------------------------------------------------- From mcvittie at snf.stanford.edu Fri Feb 6 09:54:19 2004 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Fri, 06 Feb 2004 09:54:19 -0800 Subject: Request New User to use PQuest for Al Etch Message-ID: <4023D4CB.E2391D12@snf.stanford.edu> Pquest Users, Ed Ward, who is an industrial user, has requested to use the Pquest to etch Al with a PR mask on Si wafers. He can not use the P5000 since his wafers have Pt and Pr (praseodymium) under the Al and SiO2. The reason he can not use the P5000 is because it is CMOS clean tool and we have no contamination data on Pr. He has been using the MRC for etching Pt layer but his Al layer ( 2000A) is too thick for a MRC sputter etch. During his Al etch only PR, Al and SiO2 will be exposed to the plasma. In the last 18 month three different users have used the Pquest to etch Al, so I do not see any process or new materials issues. In the logbook KVAP, Sigari and CarlAl are listed as Al etch processes. I am inclined to let him use the tool. I believe he only wants to do a few runs and the etch times are only a few minutes. Thanks, Jim -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From scaccag at stanford.edu Sun Feb 8 13:25:34 2004 From: scaccag at stanford.edu (Luigi Scaccabarozzi) Date: Sun, 8 Feb 2004 13:25:34 -0800 (PST) Subject: Request New User to use PQuest for Al Etch In-Reply-To: <4023D4CB.E2391D12@snf.stanford.edu> Message-ID: Jim, if he is using only Cl2 or BCl3 that's fine with me. Gigi On Fri, 6 Feb 2004, Jim McVittie wrote: > Pquest Users, > > Ed Ward, who is an industrial user, has requested to use the Pquest to > etch Al with a PR mask on Si wafers. He can not use the P5000 since his > wafers have Pt and Pr (praseodymium) under the Al and SiO2. The reason > he can not use the P5000 is because it is CMOS clean tool and we have no > contamination data on Pr. He has been using the MRC for etching Pt layer > but his Al layer ( 2000A) is too thick for a MRC sputter etch. During > his Al etch only PR, Al and SiO2 will be exposed to the plasma. > > In the last 18 month three different users have used the Pquest to etch > Al, so I do not see any process or new materials issues. In the logbook > KVAP, Sigari and CarlAl are listed as Al etch processes. > > I am inclined to let him use the tool. I believe he only wants to do a > few runs and the etch times are only a few minutes. > > Thanks, Jim >