From mcvittie at snf.stanford.edu Wed Mar 1 16:34:15 2006 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Wed, 01 Mar 2006 16:34:15 -0800 Subject: Dry etching of Al or Ag film References: <1141093511.4403b487547e0@webmail.stanford.edu> Message-ID: <44063D87.8C2B744F@snf.stanford.edu> Hideo, You should be directing you PQuest requests to the PQuest users. There is an Al etch process already on the PQ. See Carl Faulkner for details. As for etching Ag, there is no process process on the PQ. If you come up with an Ag etch process, you would have to get approval before you could try it. I am not aware of any plasma etch processes for Ag. Like Au, I do not believe there are any volatile Ag products to build a etch process around. Probably the best you could do with Ag is a sputter etch process with some enhancement with the addition of Cl2. Jim Hideo Iwase wrote: > Dear labmembers; > > I would like to etch silver or aluminum film in PlasmaQuest. Does anyone > have experience of that? I would be grateful if someone would let me know > the etching conditions for these films. > > Details of my experiment are as follows; > material of film: Al or Ag > thickness of film : 20-100 nm. > Mask : PMMA (t=300 nm) > substrate: GaAs wafer > Patterns: Ph.C-like (a =250 nm, ?? = 50-150 nm) > > Any suggestion is greatly appreciated. > > Best Regards; > > Hideo Iwase. > Vuckovic group in Ginzton Lab. From jndyxmy at vsnl.net.in Wed Mar 8 00:41:23 2006 From: jndyxmy at vsnl.net.in (Edgardo) Date: Wed, 08 Mar 2006 06:41:23 -0200 Subject: No Love sincerer than the love of food Message-ID: <259d01c6427b$51026580$2e9fd1f6@jndyxmy> My name is Bobby MXXX and I am 27 years old. I currently weigh 171 lbs thanks to the help of HOODIA. I was a long time ephedra user and was suffering from major with drawl when it was taken off the market. My symptoms were horrible and I had heavy depression and fatigue when I stopped using it. 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With all the many diet pills out there HOODIA has truly lived up to it's expectations. I'll stay in touch and keep you updated on my progress. Thanks, Christy S. - Currently 186 lbs Order online securely from our website http://pk-hood.com (A sample is available at no cost to you) keep out of this promotional campaign? pls click the remove link at our website, and enter your id there From scaccag at stanford.edu Thu Mar 16 15:21:16 2006 From: scaccag at stanford.edu (Luigi Scaccabarozzi) Date: Thu, 16 Mar 2006 15:21:16 -0800 (PST) Subject: pquest free from now: finished early Message-ID: From edmyers at stanford.edu Wed Mar 22 13:50:38 2006 From: edmyers at stanford.edu (Ed Myers) Date: Wed, 22 Mar 2006 13:50:38 -0800 Subject: PQuest Preventive Maintenance Message-ID: <6.0.1.1.2.20060322133003.02dfc010@edmyers.pobox.stanford.edu> PQuest Users, Does the PQuest community want the SNF staff to schedule regular preventive maintenance on the PQuest chamber? A month ago Ceser cleaned the PQuest chamber after we received some complaints on repeatability of an etch process. Apparently, this had a very positive effect on the user's etch. The SNF staff would like to take on more responsibility in maintaining the chamber condition, if it is agreeable with the PQuest community. I'm told that manual cleaning of the chamber is very unpleasant. The proposed approach would mix in manual chamber cleans along with evaluation of a shutdown-chamber clean recipe similar to what Elmer added to the AMT etcher. We will plan on implementing a preventive maintenance program unless we hear objections from the PQuest user community. We are also looking for a champion to help us design and evaluate the effects of any preventive maintenance. Regards, Ed From nbelov at nanochip.com Thu Mar 23 10:01:23 2006 From: nbelov at nanochip.com (Nickolai Belov) Date: Thu, 23 Mar 2006 10:01:23 -0800 Subject: PQuest Preventive Maintenance Message-ID: Ed, Thank you for bringing up the issue. Preventive maintenance is a set of procedures. I would suggest to e-mail a detailed description of your approach to the preventive maintenance to PQuest users and to ask for a feedback. In general, it is clear to me that regular maintenance is absolutely necessary. With respect Nickolai Belov Nanochip, Inc. SNF labmember -----Original Message----- From: Ed Myers [mailto:edmyers at stanford.edu] Sent: Wednesday, March 22, 2006 1:51 PM To: pquest at snf.stanford.edu Cc: mtang at stanford.edu; rissman at stanford.edu Subject: PQuest Preventive Maintenance PQuest Users, Does the PQuest community want the SNF staff to schedule regular preventive maintenance on the PQuest chamber? A month ago Ceser cleaned the PQuest chamber after we received some complaints on repeatability of an etch process. Apparently, this had a very positive effect on the user's etch. The SNF staff would like to take on more responsibility in maintaining the chamber condition, if it is agreeable with the PQuest community. I'm told that manual cleaning of the chamber is very unpleasant. The proposed approach would mix in manual chamber cleans along with evaluation of a shutdown-chamber clean recipe similar to what Elmer added to the AMT etcher. We will plan on implementing a preventive maintenance program unless we hear objections from the PQuest user community. We are also looking for a champion to help us design and evaluate the effects of any preventive maintenance. Regards, Ed From praveen at arri.uta.edu Tue Mar 28 10:57:00 2006 From: praveen at arri.uta.edu (Praveen P.S.) Date: Tue, 28 Mar 2006 12:57:00 -0600 Subject: etching BCB Message-ID: <002f01c65299$6537fdc0$542f6b81@praveenps> Dear Pquest users, I am planning to use pquest to etch a thin layer of BCB (approx 0.2 to 0.5 microns). If any of you have any recipe file that I could use, please let me know. Thanks for any suggestions in advance Regards, Praveen -------------- next part -------------- An HTML attachment was scrubbed... URL: From mcvittie at snf.stanford.edu Wed Mar 29 10:06:54 2006 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Wed, 29 Mar 2006 10:06:54 -0800 Subject: PQuest Preventive Maintenance References: <6.0.1.1.2.20060322133003.02dfc010@edmyers.pobox.stanford.edu> Message-ID: <442ACCBE.A28FAB63@snf.stanford.edu> Ed, I think improved maintenance of the PQ is fine but one has to be careful of not get into unintended consequences, which degrade etch processes. One really does not want to be opening a Cl etch chamber unless one has to. There are 2 issues. First, you will introduce water from the cleaning process and second, you will change the surface chemistry of the chamber walls. Some processes are very sensitive to the water level in the chamber and all the processes are sensitive to wall surface chemistry. So the result is it takes a good effort to get a chamber back to where it should be after a wet clean. For the Lam etcher, we were given a 2 page procedure from Lam called ?Post We-Clean Chamber Recovery and Seasoning? to be done after every wet clean. This procedure recommends running 25 wafers under various conditions. Although we are not going to run 25 wafers through this system, we need to develop a similar procedure for the PQ. I recommend that any chamber cleaning be based on process needs and not on an arbitrary time bases. Jim Ed Myers wrote: > PQuest Users, > > Does the PQuest community want the SNF staff to schedule regular preventive > maintenance on the PQuest chamber? > > A month ago Ceser cleaned the PQuest chamber after we received some > complaints on repeatability of an etch process. Apparently, this had a > very positive effect on the user's etch. The SNF staff would like to take > on more responsibility in maintaining the chamber condition, if it is > agreeable with the PQuest community. I'm told that manual cleaning of the > chamber is very unpleasant. The proposed approach would mix in manual > chamber cleans along with evaluation of a shutdown-chamber clean recipe > similar to what Elmer added to the AMT etcher. > > We will plan on implementing a preventive maintenance program unless we > hear objections from the PQuest user community. We are also looking for a > champion to help us design and evaluate the effects of any preventive > maintenance. > > Regards, > Ed From mcvittie at snf.stanford.edu Wed Mar 29 12:46:04 2006 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Wed, 29 Mar 2006 12:46:04 -0800 Subject: PQuest Post Clean Recovery and Sapphire Carriers References: <6.0.1.1.2.20060322133003.02dfc010@edmyers.pobox.stanford.edu> <442ACCBE.A28FAB63@snf.stanford.edu> Message-ID: <442AF20B.756F11BD@snf.stanford.edu> All, To help develop a post wet clean recovery process for the PQ, I have attached a recommended procedure for the Lam etcher. I have also included an in-situ plasma clean procure for the Lam. I actually have 2 more in-situ plasma clean procedures for the Lam but I only have hard copies of them. Presently, most of the III-V users are using bare Si wafers for their carriers. This means that they are adding some SiCl4 to their etch process. The good thing about doing this is that SiCl4 is a useful additive to GaAs etching. On the down side, Si is a III-V dopant and the exposed Si carrier is changing the free Cl concentration around the sample. At other universities, sapphire carrier wafers are sometimes used to avoid the effects of etching the carrier. I have some 4" sapphire wafers if someone wants to try changing carriers. The change will most likely affect the etch results plus you will change the apparent bias voltage. Jim Jim McVittie wrote: > Ed, > > I think improved maintenance of the PQ is fine but one has to be careful of not > get into unintended consequences, which degrade etch processes. One really does > not want to be opening a Cl etch chamber unless one has to. There are 2 issues. > First, you will introduce water from the cleaning process and second, you will > change the surface chemistry of the chamber walls. Some processes are very > sensitive to the water level in the chamber and all the processes are sensitive > to wall surface chemistry. So the result is it takes a good effort to get a > chamber back to where it should be after a wet clean. For the Lam etcher, we > were given a 2 page procedure from Lam called ?Post We-Clean Chamber Recovery > and Seasoning? to be done after every wet clean. This procedure recommends > running 25 wafers under various conditions. Although we are not going to run > 25 wafers through this system, we need to develop a similar procedure for the > PQ. I recommend that any chamber cleaning be based on process needs and not on > an arbitrary time bases. > > Jim > > Ed Myers wrote: > > > PQuest Users, > > > > Does the PQuest community want the SNF staff to schedule regular preventive > > maintenance on the PQuest chamber? > > > > A month ago Ceser cleaned the PQuest chamber after we received some > > complaints on repeatability of an etch process. Apparently, this had a > > very positive effect on the user's etch. The SNF staff would like to take > > on more responsibility in maintaining the chamber condition, if it is > > agreeable with the PQuest community. I'm told that manual cleaning of the > > chamber is very unpleasant. The proposed approach would mix in manual > > chamber cleans along with evaluation of a shutdown-chamber clean recipe > > similar to what Elmer added to the AMT etcher. > > > > We will plan on implementing a preventive maintenance program unless we > > hear objections from the PQuest user community. We are also looking for a > > champion to help us design and evaluate the effects of any preventive > > maintenance. > > > > Regards, > > Ed -------------- next part -------------- A non-text attachment was scrubbed... Name: WetClean.doc Type: application/msword Size: 28672 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... 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