From mtang at stanford.edu Wed Dec 1 10:34:01 2010 From: mtang at stanford.edu (Mary Tang) Date: Wed, 01 Dec 2010 10:34:01 -0800 Subject: Reminder: PQuest users' meeting, 2 pm today Message-ID: <4CF69519.1060500@stanford.edu> Hi all -- Just a reminder that there's a pquest users' meeting today, at 2 pm, in Allen 201. We will discuss: 1. Current equipment status and process concerns/results. 2. Chlorine versus fluorine/high temp scheduling 3. Logging run date 4. Process quals If you can't make it and want to be heard, please send a representative or forward information to this list or favorite staff member. Thanks, Team Etch -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at stanford.edu Wed Dec 1 18:39:56 2010 From: mtang at stanford.edu (Mary Tang) Date: Wed, 01 Dec 2010 18:39:56 -0800 Subject: Pquest users' meeting summary Message-ID: <4CF706FC.5080303@stanford.edu> Dear pquest users -- Many thanks to those who attended and for the contributions by those who couldn't. The meeting was well attended (even two faculty!) and well-represented by many different groups. Here's a summary: 1. Chlorine versus fluorine, 2011. Because there are many more chlorine than fluorine users, it was decided to increase the chlorine-only time. Starting in 2011, the schedule will be 1.5 weeks of chlorine-only after chamber clean followed by 0.5 weeks of fluorine-allowed. Chamber cleans will be done on alternate Fridays. This will keep the current chamber clean frequency, which is good, and allow fluorine users access twice/month. 2. Chlorine versus fluorine, 2010. The system will remain chlorine-only until next Friday, Dec. 10, when it becomes fluorine-allowed. A chamber clean will be done over the shutdown. 3. Process problems. Several people have observed variable etch rates in ZEP, PMMA, and GaAs. One group's problems seem to be recently resolved. Some reminders on pquest operation which will help with process control: monitor DC bias voltage (and adjust RF accordingly); run O2 clean until DC bias stabilized; check (and rezero if needed) the VAT pressure controller; run recipes with chlorine flows within controllable range (3 sccm is recommended); use ellipsometry to measure resist thicknesses below 1000 A. 4. Shutdown. Elmer plans to repair the noisy clamp, clean the chamber, check for chips in the darkspace, and adjust the clamp pressure to try to get the helium blow by down a little. Stray chips in the darkspace have been historically known to cause variable etch rate or plasma flickering. The clamp pressure is a balancing act between good backside cooling and wafer breakage so needs to be done carefully. 5. Other stuff discussed: instituting logsheet data entry on Coral disable - this will allow us to collect and monitor data (like DC bias); defining a basic process qual, to check machine functionality; temperature dots are available to check for substrate heating; optical spectroscopy testing for fluorines or chamber cleanliness. Again, thanks all. We would also like to encourage everyone to share observations about pquest process performance, especially any problems you encounter. Team Pquest Etch (Jim and Jimmer, Elmer, Mary) -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From rthowe at stanford.edu Wed Dec 1 22:22:55 2010 From: rthowe at stanford.edu (Roger T. Howe) Date: Wed, 01 Dec 2010 22:22:55 -0800 Subject: Pquest users' meeting summary In-Reply-To: <4CF706FC.5080303@stanford.edu> References: <4CF706FC.5080303@stanford.edu> Message-ID: <4CF73B3F.6000407@stanford.edu> Mary, Elmer, Jim, and Jim + PQuest user community: Thanks for coming to a good solution on the PQuest. Let's hope that a year from now, or sooner, we're dealing with the initial ramp-up of a new III-V etcher. I'd have been there if I wasn't lecturing. Roger On 12/1/10 6:39 PM, Mary Tang wrote: > Dear pquest users -- > > > Many thanks to those who attended and for the contributions by those > who couldn't. The meeting was well attended (even two faculty!) and > well-represented by many different groups. Here's a summary: > > > 1. Chlorine versus fluorine, 2011. Because there are many more > chlorine than fluorine users, it was decided to increase the > chlorine-only time. Starting in 2011, the schedule will be 1.5 weeks > of chlorine-only after chamber clean followed by 0.5 weeks of > fluorine-allowed. Chamber cleans will be done on alternate Fridays. > This will keep the current chamber clean frequency, which is good, and > allow fluorine users access twice/month. > > > 2. Chlorine versus fluorine, 2010. The system will remain > chlorine-only until next Friday, Dec. 10, when it becomes > fluorine-allowed. A chamber clean will be done over the shutdown. > > > 3. Process problems. Several people have observed variable etch > rates in ZEP, PMMA, and GaAs. One group's problems seem to be > recently resolved. Some reminders on pquest operation which will help > with process control: monitor DC bias voltage (and adjust RF > accordingly); run O2 clean until DC bias stabilized; check (and rezero > if needed) the VAT pressure controller; run recipes with chlorine > flows within controllable range (3 sccm is recommended); use > ellipsometry to measure resist thicknesses below 1000 A. > > > 4. Shutdown. Elmer plans to repair the noisy clamp, clean the > chamber, check for chips in the darkspace, and adjust the clamp > pressure to try to get the helium blow by down a little. Stray chips > in the darkspace have been historically known to cause variable etch > rate or plasma flickering. The clamp pressure is a balancing act > between good backside cooling and wafer breakage so needs to be done > carefully. > > > 5. Other stuff discussed: instituting logsheet data entry on Coral > disable - this will allow us to collect and monitor data (like DC > bias); defining a basic process qual, to check machine functionality; > temperature dots are available to check for substrate heating; optical > spectroscopy testing for fluorines or chamber cleanliness. > > > Again, thanks all. We would also like to encourage everyone to share > observations about pquest process performance, especially any problems > you encounter. > > > Team Pquest Etch (Jim and Jimmer, Elmer, Mary) > From bucklesm at stanford.edu Tue Dec 14 08:44:43 2010 From: bucklesm at stanford.edu (Sonia Mary Buckley) Date: Tue, 14 Dec 2010 08:44:43 -0800 (PST) Subject: pquest free now Message-ID: <853448963.805039.1292345083599.JavaMail.root@zm09.stanford.edu> From rissman at stanford.edu Tue Dec 14 12:14:57 2010 From: rissman at stanford.edu (Paul Rissman) Date: Tue, 14 Dec 2010 12:14:57 -0800 Subject: Jim Kruger just released his time after lunch Message-ID: <4D07D041.7070604@stanford.edu>