which metal for lift off

James Conway jwc at snf.stanford.edu
Fri Jul 11 10:03:16 PDT 2008


I really like 200 Angstroms of Ti followed by 300 - 500 angstroms of Au 
for the 100 nm films.  Evaporated never sputtered

I may have a need for a similar stack on wafers I am trying expose on 
the Hitachi -- so if you wish we could do some of this work together and 
compare results.

Best,

JWC



Arash Hazeghi wrote:
>
> Hello RAITH users,
>
> I am writing 50nm square arrays as well as dot arrays on 2% 950K 
> resist. In order to inspect the quality of the exposure I want to do a 
> quick metallization + lift off, has anyone tried lift off on dot 
> arrays recently? What is the ideal metal and thickness?
>
>  
>
> Thank you,
>
>  
>
> Arash
>
>  
>
>  
>
> -----------------------------------------------------------------------------
>
> Arash Hazeghi
>
>  
>
> PhD Candidate,
>
> Stanford Center for Integrated Systems
>
> 420 Via Palou Mall, CIS-X 300
>
> Stanford, CA 94305
>
> phone: +1-(650)-725-0418
>
>  
>
>  
>
> http://www.stanford.edu/~ahazeghi/
>
>  
>
>  
>
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