From Yiching_Liang at MolDev.com Mon Dec 1 10:23:28 2003 From: Yiching_Liang at MolDev.com (Yiching Liang) Date: Mon, 01 Dec 2003 10:23:28 -0800 Subject: bringing outside materials Message-ID: Hi- I am a new industry user at SNF, and I would like to obtain approval to bring in the following materials for processing in the SNF. 1. new blank wafers: these are 4" double-sided silicon wafers purchased from Siltronix. They are semiconductor quality. We would like to use them because they have better thickness uniformity than the ones at the SNF stock room. They are still sealed in original packaging/container. We would like to use them in "clean" equipment (Tylan tubes, drytek2, etc.) 2. partially processed wafers: these are the same type of wafers as above, except they have been through some processing. They were processed at the EPFL Center of MicroNanoTechnology in Switzerland (http://cmi.epfl.ch). We can provide a complete process log if necessary. All protocols have been followed to make sure they are kept very clean throughout the process. They have low-stress nitride deposited, then RIE etched as etch masks for a KOH etch. After the KOH etch, they have been decontaminated in H2O:H2O2:HCl for 30 minutes, although the ratio of chemicals (3:2:2) are slightly different from the SNF standard of 1:1:1. After the decontamination, they have been rinsed in DI water, then RCA cleaned (H2O:H2O2:NH4OH at 5:1:1/75C/15min, and H2O:H2O2:HCl at 6:1:1/75C/15min). And that is the last process the wafers saw and have been kept in a closed wafer box since. We would like to bring them in to SNF to apply a top SiO2 coating: tylanbpsg, sts (PEVCD oxide), and maybe Balzer for sputtered SiO2. This is a one-time request (5 wafers max, probably 3) as we are transferring our prototyping from EPFL to SNF and would like to start with these wafers so that we do not have to introduce too many new variables at once. We will gladly follow any further cleaning procedures SNF requires. Thanks! Yiching Coral name: yiching -- Yiching Liang R&D Engineer, IonWorks Molecular Devices 1311 Orleans Dr. Sunnyvale, CA 94089 Direct: 408-548-6011 Fax: 408-747-0965 From mtang at snf.stanford.edu Thu Dec 4 17:05:27 2003 From: mtang at snf.stanford.edu (Mary Tang) Date: Thu, 04 Dec 2003 17:05:27 -0800 Subject: bringing outside materials References: Message-ID: <3FCFD9D7.8E803A2C@snf.stanford.edu> Hi Yiching -- I defer to the other SpecMat members, but would say that your first request is no problem. The wafers should be pre-cleaned as usual, but can be processed in the tylan tubes. Your second request is no problem, if you plan to use the sts dep tool, as this is "gold contaminated." Since tylanbpsg and the balzers are "clean", the wafers may pose more of a problem there. In general, wafers processed in an unqualified outside facility require a TXRF analysis for trace metals (about $300 from Charles Evans, with 2-3 day turnaround) to ensure that there is no serious contamination risk before bringing into a "clean" tool at SNF. John Shott (please correct me if I'm wrong) indicated that just this time, that if the wafers are re-cleaned here, that he didn't think it would be a problem for tylanbpsg (please doublecheck with him.) I'm not sure what the status of the balzers at this time is -- please check with Jim McVittie and Maurice (use of this system is somewhat restricted.) I'm going to be on vacation for a week -- if you have further questions, please direct them to Jim or John. Mary Yiching Liang wrote: > Hi- > > I am a new industry user at SNF, and I would like to obtain approval to > bring in the following materials for processing in the SNF. > > 1. new blank wafers: these are 4" double-sided silicon wafers purchased > from Siltronix. They are semiconductor quality. We would like to use > them because they have better thickness uniformity than the ones at the > SNF stock room. They are still sealed in original packaging/container. > We would like to use them in "clean" equipment (Tylan tubes, drytek2, > etc.) > > 2. partially processed wafers: these are the same type of wafers as > above, except they have been through some processing. They were > processed at the EPFL Center of MicroNanoTechnology in Switzerland > (http://cmi.epfl.ch). We can provide a complete process log if > necessary. All protocols have been followed to make sure they are kept > very clean throughout the process. They have low-stress nitride > deposited, then RIE etched as etch masks for a KOH etch. After the KOH > etch, they have been decontaminated in H2O:H2O2:HCl for 30 minutes, > although the ratio of chemicals (3:2:2) are slightly different from the > SNF standard of 1:1:1. After the decontamination, they have been rinsed > in DI water, then RCA cleaned (H2O:H2O2:NH4OH at 5:1:1/75C/15min, and > H2O:H2O2:HCl at 6:1:1/75C/15min). And that is the last process the > wafers saw and have been kept in a closed wafer box since. We would like > to bring them in to SNF to apply a top SiO2 coating: tylanbpsg, sts > (PEVCD oxide), and maybe Balzer for sputtered SiO2. This is a one-time > request (5 wafers max, probably 3) as we are transferring our > prototyping from EPFL to SNF and would like to start with these wafers > so that we do not have to introduce too many new variables at once. We > will gladly follow any further cleaning procedures SNF requires. > > Thanks! > > Yiching > Coral name: yiching > > -- > Yiching Liang > R&D Engineer, IonWorks > Molecular Devices > 1311 Orleans Dr. > Sunnyvale, CA 94089 > Direct: 408-548-6011 > Fax: 408-747-0965 -- Mary X. Tang, Ph.D. National Nanofabrication Users' Network Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From true at snf.stanford.edu Thu Dec 18 10:47:01 2003 From: true at snf.stanford.edu (Randall True) Date: Thu, 18 Dec 2003 10:47:01 -0800 (PST) Subject: PQuest etcher status In-Reply-To: <3FD660AB.500C7B33@snf.stanford.edu> Message-ID: SNF Management, There continues to be disagreement about what exactly the status of the Plasma Quest etcher. As I understand it, the tool was purchased by the Yamamoto group many years ago, and in exchange for making it availible to all lab users, the facilitization and maintenance was to be performed by SNF. I have been developing a process using the PQuest for the last 2 years. Use of the PQuest for non-III-V etching is crucial to my work and that of others. Can you please clarify the siutation and answer a couple of questions? 1) At this point, who "owns" the Pquest? It is listed on the website along with all of the other equipment and as far as I know, every other tool is owned by SNF. 2) Who has the ultimate authority in making policy decisions about the Pquest? 3) Is it possible to restrict the use of the PQuest only to III-V etching, even excluding current non-III-V processes that have been demonstrated to be compatible with III-V etching? Or the corollary: Does SNF guarantee that the Pquest will remain availible to industrial users for non-III-V processes, at least ones that are currently approved, at least for the current 3 days a week? 4) Would SNF permit a situation where members of the Harris and Yamomoto Groups are allowed to run non-III-V etching processes but other users are not? Thank you for your attention, Randy True Nanoplex