Tin/Cu

Mary Tang mtang at snf.stanford.edu
Fri Jun 27 15:58:13 PDT 2003


Hi all --

Aditi (coral login = kitu) has asked for copper and then tin to be
deposited on her substrates (no break in vacuum between depositions).
Since tin is a low melting temperature metal, will this be a problem for
metalica?  Are there any other concerns?

Mary

--
Mary X. Tang, Ph.D.
National Nanofabrication Users' Network
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at snf.stanford.edu





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