Tin/Cu

Mary Tang mtang at snf.stanford.edu
Mon Jun 30 13:06:07 PDT 2003


Thanks Jim --  I take it this means that In is OK for the metalica?

Mary

Jim McVittie wrote:

> Mary,
>
> The melting point is not the issue. It is the vapor pressure is the concern.
> The vapor pressure of tin is not that bad. Tin has a vapor pressure of 1E-4
> T at 997C. My cutoff for high vapor pressure materials is Indium, which has
> a vapor pressure.of 1E-4 T at 773C. By the way Copper is at 1E-4 T at 1017C,
> so there is not much difference between copper and tin.
>
>     Jim
>
> Mary Tang wrote:
>
> > Hi all --
> >
> > Aditi (coral login = kitu) has asked for copper and then tin to be
> > deposited on her substrates (no break in vacuum between depositions).
> > Since tin is a low melting temperature metal, will this be a problem for
> > metalica?  Are there any other concerns?
> >
> > Mary
> >
> > --
> > Mary X. Tang, Ph.D.
> > National Nanofabrication Users' Network
> > Stanford Nanofabrication Facility
> > CIS Room 136, Mail Code 4070
> > Stanford, CA  94305
> > (650)723-9980
> > mtang at snf.stanford.edu

--
Mary X. Tang, Ph.D.
National Nanofabrication Users' Network
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at snf.stanford.edu





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