Tylan4 for annealing the bonded Si wafers

SangBum Kim kimsangb at stanford.edu
Thu Aug 12 20:52:56 PDT 2004

Dear SpecMat,

 I would like to use Tylan4 for annealing the bonded Si wafers. The processes that the bonded Si wafers went through are

1) Cleaning at the diffusion wet bench
2) Oxygen plasma etching in Drytek2
3) Spin, Rinse and Dry
4) Wafers are bonded manually at room temperature
5) Tylan4 (recipe 400AN)

Please let me know whether I can use this process.

SangBum Kim (coral login name:kimsangb)
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20040812/cbe3fd70/attachment.html>

More information about the specmat mailing list