specmat question

Mary Tang mtang at snf.stanford.edu
Wed Aug 18 16:55:55 PDT 2004

Hi SangBum --

Sorry for the delay.  Tylan4 is now gold-compatible and can be used for
the process flow you propose.  Your wafers will then be considered
gold-contaminated after tylan4 processing.  Under these conditions, your
process flow is approved.

Thanks for your patience --


SangBum Kim wrote:

> Dear Dr. Tang,  I have requested SpecMat to approve me to use Tylan4
> last Thursday and haven't received any response yet. Could you tell me
> the status of my request? I am including the original message I sent
> to SpecMat at the end. Thank you very much! Sincerely,SangBum
> ----- Original Message -----
> From: SangBum Kim
> To: specmat at snf.stanford.eduSent: Thursday, August 12, 2004 8:52
> PMSubject: Tylan4 for annealing the bonded Si wafers
>  Dear SpecMat,  I would like to use Tylan4 for annealing the bonded Si
> wafers. The processes that the bonded Si wafers went through are 1)
> Cleaning at the diffusion wet bench2) Oxygen plasma etching in
> Drytek23) Spin, Rinse and Dry4) Wafers are bonded manually at room
> temperature5) Tylan4 (recipe 400AN) Please let me know whether I can
> use this process. Thanks,SangBum Kim (coral login name:kimsangb)

Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
mtang at stanford.edu

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