From jwc at snf.stanford.edu Mon Jun 7 11:31:01 2004 From: jwc at snf.stanford.edu (James Conway) Date: Mon, 07 Jun 2004 11:31:01 -0700 Subject: PiRL Information Message-ID: <40C4B465.2060408@snf.stanford.edu> Greetings SpecMat and Mahnaz: Attached is the MSDS for PiRL by brewer scientific. This is a proprietary polymer for release layer under photoresist. I would like obtain a 250 ml sample of this material to evaluate if we can use this as a release layer under SU-8 resist -- so we can get the SU-8 off after RIE etching. Might also be useful for lift-off structures. Please approve limited quantities for evaluation use only under my control. Thank you, James Conway jwc ++++++++++++++++++++++++++++++++++++++++++++ Hi James, Thanks for the call back. I have attached some overview information on PiRL, processing information for PiRL, and the MSDS. We would be able to send a 250 ml sample. As you mentioned, we would appreciate feedback, pictures, etc. Also, we ask customers to cover the shipping cost. So if you could please send me your shipping information. You mentioned that you would be starting the work this summer. If so, when would you need the sample? Regards, Shane -------------- next part -------------- A non-text attachment was scrubbed... Name: sm_pirl_pres_a.pdf Type: application/pdf Size: 785505 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: PiRL_msds.pdf Type: application/pdf Size: 12003 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: sm_pirl_data.pdf Type: application/pdf Size: 286500 bytes Desc: not available URL: From tschultz at lsinc.biz Tue Jun 8 08:28:13 2004 From: tschultz at lsinc.biz (Tim Schultz) Date: Tue, 8 Jun 2004 08:28:13 -0700 Subject: Yttria Stabilized Zirconia Request Message-ID: Special Materials Committee, I am re-requesting approval to process wafers deposited with a thin film of yttria stabilized zirconia. This specific request is for use of lithography equipment and resist strip equipment (for rework) as noted in #12 below. There has been confusion as to what tools our material is approved for. At one time this material was approved for the metal chamber of the P5000, and Lilliputian Systems was performing lithography on the material long before I joined the company in February. Recently we were told we could not use the wbmetal or wbnonmetal benches for resist strip, although we had thought we were approved for these benches. We have found YSZ to be extremely stable and inert. HF is the only dry or wet etch chemistry we have found so far that has any significant effect. Attached are 2 papers which describe the use of YSZ for gate dielectrics and discuss the materials thermal stability. Also attached are technical notes from the manufacturer. In response to #17 below, attached is a materials analysis report of an as-deposited wafer. The only contaminant found was Hafnium at less than 1 at.%, which is typical of YSZ from any supplier. We have had one on one discussions with members of the special materials committee who told us they would give us a reply within the week. This did not occur. We would greatly appreciate a timely response to this formal written request. 1) Requestor name: Tim Schultz (for Lilliputian Systems) 2) Phone number: 707 344-1756 3) email address: tschultz at lsinc.biz 4) Requestor?s PI (Advisor) or Company: Lilliputian Systems 46560 Fremont Blvd, Suite 419 Fremont, CA 94538 5) The name of the new Chemical (give all names commonly used): YSZ, Yttria Stabilized Zirconia 6) N/A 7) Name of vendor/manufacturer that you are planning to obtain this material from: The material is applied as a thin film by Barr Associates, the material is manufactured by Fuel Cell Materials, a subsidiary of NexTech Materials. 8) URL for vendor?s website where info on the proposed chemical can be found: www.barrassociates.com, www.nextechmaterials.com, www.fuelcellmaterials.com 9) Vendor?s address and phone number: Barr Associates, Inc., 2 Lyberty Way, Westford, MA 01886, 978-692-7513 NexTech Materials & Fuel Cell Materials, 404 Enterprise Drive, Lewis Center, OH 43035-9423, 614-842-6606 10) What is your reason for wanting to bring this material into the lab: Fuel Cell Process Development 11) Make a strong case why you can not use an already approved chemical/material for this purpose: This is the material that meets our product requirements. 12) List all the lab equipment and wet benches that you propose to use with this chemical: svgcoat svgdev karlsuss nikon convection ovens - 90C,110C,150C wbmetal wbnonmetal 13) Proposed quantity of the chemical that you want to bring into lab (give both raw and mixed quantities): 0.5-20 micron thin film on Si/SiO2/SiN 4" substrate (all ox and nit depositions at SNF), 6-15 wafers per lot 14) State the form that the proposed chemical is in. (Is it solid, powder or liquid? Note: as a general rule, powders are not permitted in the clean room.): Solid thin film on substrate. 15) N/A 16) From manufacturer, vendor or the Stanford safety site, obtain a legible Material Safety Data Sheet (MSDS) for all the proposed chemicals. Send these to the person listed below. See attachment. 17) If the chemical/material is to be used in any the "clean" equipment, purity specifications will be needed. This is most important for chemicals/material that are not normally used for VLSI device fabrication. To be allowed into a "clean" tool, the material should MOS grade or better. See attachment. 18) Read the MSDSs as well as the Stanford Chemical Storage Groups and the Stanford Chemical Safety Data Base sections on this website to determine the Storage Group Identifier and Main Hazard Class of your chemical/material: Storage Group: G Main Hazard Class: Non-hazardous Additional Hazards: dust can cause lung and skin irritation. 19) N/A 20) In your discussions with vendors, try to determine the best way to dispose of your spent chemicals and by-products. The lab has acid/base, HF and solvent drains. The acid/base drains go to a neutralization system before going the city waste water system. The city of Palo Alto has tight limits on the amount of heavy metals that be disposed of through the waste water system. If your chemical contains any metals, there is a good chance that you will have to collect all your waste and dispose of it in labeled containers which are picked up the Health and Safety Department. The HF drains go to a central tank which is pumped out by a HF disposal service at considerable expense on a regular basis. The solvent drains in the solvent benches are collected under the benches and disposed of by Heath and Safety as needed. Disposal: Standard landfill methods consistent with applicable Federal, State and local law. 21) Put together a detailed process flow description on how you proposed to use this chemical. This should include: Any chemical mixing, all lab equipment and wet benched to be used, all containers to be used, where chemical is to be stored and how chemical and by-products are to be deposed of. This should be in a Word file attached to your e-mail request. In reviewing your procedure, we will be most interested in how the safety and contamination issues are to be dealt with. See Attachment. -------------- next part -------------- A non-text attachment was scrubbed... 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Name: YSZ MSDS.doc Type: application/msword Size: 235008 bytes Desc: not available URL: From mmager at stanford.edu Tue Jun 15 16:27:05 2004 From: mmager at stanford.edu (Morgan Douglas Mager) Date: Tue, 15 Jun 2004 16:27:05 -0700 Subject: New Material Approval Message-ID: <1087342025.40cf85c9d30b3@webmail.stanford.edu> Attached is the paperwork for approval of a new chemical at CIS. The chemical is borosilicafilm 5x10^20 from Emulsitone. It is produced for use with semiconductor processing so comes semiconductor grade. -Morgan Mager -------------- next part -------------- A non-text attachment was scrubbed... Name: SNF new material.doc Type: application/msword Size: 65536 bytes Desc: not available URL: From mtang at snf.stanford.edu Thu Jun 17 08:08:45 2004 From: mtang at snf.stanford.edu (Mary Tang) Date: Thu, 17 Jun 2004 08:08:45 -0700 Subject: New Material Approval References: <1087342025.40cf85c9d30b3@webmail.stanford.edu> Message-ID: <40D1B3FD.1A893762@snf.stanford.edu> Hi everyone -- This looks fine to me. Unless there are objections from other SpecMat'ers, can we take it that this is approved? Mary Morgan Douglas Mager wrote: > Attached is the paperwork for approval of a new chemical at CIS. The > chemical is borosilicafilm 5x10^20 from Emulsitone. It is produced for use > with semiconductor processing so comes semiconductor grade. > > -Morgan Mager > > ------------------------------------------------------------------------ > Name: SNF new material.doc > SNF new material.doc Type: WINWORD File (application/msword) > Encoding: base64 > Download Status: Not downloaded with message -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at snf.stanford.edu Thu Jun 17 08:09:13 2004 From: mtang at snf.stanford.edu (Mary Tang) Date: Thu, 17 Jun 2004 08:09:13 -0700 Subject: Yttria Stabilized Zirconia Request References: Message-ID: <40D1B419.DAA81661@snf.stanford.edu> Hi everyone -- Any updates or thoughts on this? Mary Tim Schultz wrote: > Special Materials Committee, > > I am re-requesting approval to process wafers deposited with a thin film of > yttria stabilized zirconia. This specific request > is for use of lithography equipment and resist strip equipment (for rework) > as noted in #12 below. > > There has been confusion as to what tools our material is approved for. At > one time this material was approved for the metal chamber of the P5000, and > Lilliputian Systems was performing lithography on the material long before I > joined the company in February. Recently we were told we could not use the > wbmetal or wbnonmetal benches for resist strip, although we had thought we > were approved for these benches. > > We have found YSZ to be extremely stable and inert. HF is the only dry or > wet etch chemistry we have found so far that has any significant effect. > Attached are 2 papers which describe the use of YSZ for gate dielectrics and > discuss the materials thermal stability. Also attached are technical notes > from the manufacturer. > > In response to #17 below, attached is a materials analysis report of an > as-deposited wafer. The only contaminant found was Hafnium at less than 1 > at.%, which is typical of YSZ from any supplier. > > We have had one on one discussions with members of the special materials > committee who told us they would give us a reply within the week. This did > not occur. We would greatly appreciate a timely response to this formal > written request. > > 1) Requestor name: > > Tim Schultz (for Lilliputian Systems) > > 2) Phone number: > > 707 344-1756 > > 3) email address: > > tschultz at lsinc.biz > > 4) Requestor?s PI (Advisor) or Company: > > Lilliputian Systems > 46560 Fremont Blvd, Suite 419 > Fremont, CA 94538 > > 5) The name of the new Chemical (give all names commonly used): > > YSZ, Yttria Stabilized Zirconia > > 6) N/A > > 7) Name of vendor/manufacturer that you are planning to obtain this material > from: > > The material is applied as a thin film by Barr Associates, the material is > manufactured by Fuel Cell Materials, a subsidiary of NexTech Materials. > > 8) URL for vendor?s website where info on the proposed chemical can be > found: > > www.barrassociates.com, www.nextechmaterials.com, www.fuelcellmaterials.com > > 9) Vendor?s address and phone number: > > Barr Associates, Inc., 2 Lyberty Way, Westford, MA 01886, 978-692-7513 > NexTech Materials & Fuel Cell Materials, 404 Enterprise Drive, Lewis Center, > OH 43035-9423, 614-842-6606 > > 10) What is your reason for wanting to bring this material into the lab: > > Fuel Cell Process Development > > 11) Make a strong case why you can not use an already approved > chemical/material for this purpose: > > This is the material that meets our product requirements. > > 12) List all the lab equipment and wet benches that you propose to use with > this chemical: > > svgcoat > svgdev > karlsuss > nikon > convection ovens - 90C,110C,150C > wbmetal > wbnonmetal > > 13) Proposed quantity of the chemical that you want to bring into lab (give > both raw and mixed quantities): > > 0.5-20 micron thin film on Si/SiO2/SiN 4" substrate (all ox and nit > depositions at SNF), 6-15 wafers per lot > > 14) State the form that the proposed chemical is in. (Is it solid, powder or > liquid? Note: as a general rule, powders are not permitted in the clean > room.): > > Solid thin film on substrate. > > 15) N/A > > 16) From manufacturer, vendor or the Stanford safety site, obtain a legible > Material Safety Data Sheet (MSDS) for all the proposed chemicals. Send these > to the person listed below. > > See attachment. > > 17) If the chemical/material is to be used in any the "clean" equipment, > purity specifications will be needed. This is most important for > chemicals/material that are not normally used for VLSI device fabrication. > To be allowed into a "clean" tool, the material should MOS grade or better. > > See attachment. > > 18) Read the MSDSs as well as the Stanford Chemical Storage Groups and the > Stanford Chemical Safety Data Base sections on this website to determine the > Storage Group Identifier and Main Hazard Class of your chemical/material: > > Storage Group: G > Main Hazard Class: Non-hazardous > Additional Hazards: dust can cause lung and skin irritation. > > 19) N/A > > 20) In your discussions with vendors, try to determine the best way to > dispose of your spent chemicals and by-products. The lab has acid/base, HF > and solvent drains. The acid/base drains go to a neutralization system > before going the city waste water system. The city of Palo Alto has tight > limits on the amount of heavy metals that be disposed of through the waste > water system. If your chemical contains any metals, there is a good chance > that you will have to collect all your waste and dispose of it in labeled > containers which are picked up the Health and Safety Department. The HF > drains go to a central tank which is pumped out by a HF disposal service at > considerable expense on a regular basis. The solvent drains in the solvent > benches are collected under the benches and disposed of by Heath and Safety > as needed. > > Disposal: Standard landfill methods consistent with applicable Federal, > State and local law. > > 21) Put together a detailed process flow description on how you proposed to > use this chemical. This should include: Any chemical mixing, all lab > equipment and wet benched to be used, all containers to be used, where > chemical is to be stored and how chemical and by-products are to be deposed > of. This should be in a Word file attached to your e-mail request. In > reviewing your procedure, we will be most interested in how the safety and > contamination issues are to be dealt with. > > See Attachment. > > ------------------------------------------------------------------------ > Name: RTA for YSZ Gate Dielectrics.pdf > RTA for YSZ Gate Dielectrics.pdf Type: Portable Document Format (application/pdf) > Encoding: base64 > Download Status: Not downloaded with message > > Name: YSZ Report MAS.doc > YSZ Report MAS.doc Type: WINWORD File (application/msword) > Encoding: base64 > Download Status: Not downloaded with message > > Name: Zirconia and Hafnia as Gate Oxides.pdf > Zirconia and Hafnia as Gate Oxides.pdf Type: Portable Document Format (application/pdf) > Encoding: base64 > Download Status: Not downloaded with message > > Name: LSI YSZ Process 6-5-04.doc > LSI YSZ Process 6-5-04.doc Type: WINWORD File (application/msword) > Encoding: base64 > Download Status: Not downloaded with message > > Name: YSZ MSDS.doc > YSZ MSDS.doc Type: WINWORD File (application/msword) > Encoding: base64 > Download Status: Not downloaded with message -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at snf.stanford.edu Thu Jun 17 08:14:51 2004 From: mtang at snf.stanford.edu (Mary Tang) Date: Thu, 17 Jun 2004 08:14:51 -0700 Subject: PiRL Information References: <40C4B465.2060408@snf.stanford.edu> Message-ID: <40D1B56B.2EBA89C4@snf.stanford.edu> Hi everyone -- Brewer Scientific has visited a couple of times to discuss this (and other) polymers. I understand that several labmembers have expressed interest in this product. (James -- I take it that you are submitting this on behalf of the interested labmembers who will be doing the actual characterization work.) This is, I believe, a variation of polyimide. If use is restricted to manual coaters and dry etching tools, then I think it's OK to use. Are there any objections? Mary James Conway wrote: > Greetings SpecMat and Mahnaz: > > Attached is the MSDS for PiRL by brewer scientific. > > This is a proprietary polymer for release layer under photoresist. I > would like obtain a 250 ml sample of this material to evaluate if we can > use this as a release layer under SU-8 resist -- so we can get the SU-8 > off after RIE etching. Might also be useful for lift-off structures. > > Please approve limited quantities for evaluation use only under my control. > > Thank you, > > James Conway > jwc > > ++++++++++++++++++++++++++++++++++++++++++++ > Hi James, > > Thanks for the call back. I have attached some overview information on > PiRL, processing information for PiRL, and the MSDS. > > We would be able to send a 250 ml sample. As you mentioned, we would > appreciate feedback, pictures, etc. Also, we ask customers to cover the > shipping cost. So if you could please send me your shipping information. > > You mentioned that you would be starting the work this summer. If so, when > would you need the sample? > > Regards, > Shane > > ------------------------------------------------------------------------ > Name: sm_pirl_pres_a.pdf > sm_pirl_pres_a.pdf Type: Portable Document Format (application/pdf) > Encoding: base64 > Download Status: Not downloaded with message > > Name: PiRL_msds.pdf > PiRL_msds.pdf Type: Portable Document Format (application/pdf) > Encoding: base64 > Download Status: Not downloaded with message > > Name: sm_pirl_data.pdf > sm_pirl_data.pdf Type: Portable Document Format (application/pdf) > Encoding: base64 > Download Status: Not downloaded with message -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mahnaz at snf.stanford.edu Mon Jun 21 16:03:54 2004 From: mahnaz at snf.stanford.edu (Mahnaz Mansourpour) Date: Mon, 21 Jun 2004 16:03:54 -0700 Subject: PiRL Information References: <40C4B465.2060408@snf.stanford.edu> <40D1B56B.2EBA89C4@snf.stanford.edu> Message-ID: <40D7695A.7B3639AA@snf.stanford.edu> I will be interested to see how this chemical performs. mahnaz Mary Tang wrote: > Hi everyone -- > > Brewer Scientific has visited a couple of times to discuss this (and other) > polymers. I understand that several labmembers have expressed interest in this > product. (James -- I take it that you are submitting this on behalf of the > interested labmembers who will be doing the actual characterization work.) > > This is, I believe, a variation of polyimide. If use is restricted to manual > coaters and dry etching tools, then I think it's OK to use. Are there any > objections? > > Mary > > James Conway wrote: > > > Greetings SpecMat and Mahnaz: > > > > Attached is the MSDS for PiRL by brewer scientific. > > > > This is a proprietary polymer for release layer under photoresist. I > > would like obtain a 250 ml sample of this material to evaluate if we can > > use this as a release layer under SU-8 resist -- so we can get the SU-8 > > off after RIE etching. Might also be useful for lift-off structures. > > > > Please approve limited quantities for evaluation use only under my control. > > > > Thank you, > > > > James Conway > > jwc > > > > ++++++++++++++++++++++++++++++++++++++++++++ > > Hi James, > > > > Thanks for the call back. I have attached some overview information on > > PiRL, processing information for PiRL, and the MSDS. > > > > We would be able to send a 250 ml sample. As you mentioned, we would > > appreciate feedback, pictures, etc. Also, we ask customers to cover the > > shipping cost. So if you could please send me your shipping information. > > > > You mentioned that you would be starting the work this summer. If so, when > > would you need the sample? > > > > Regards, > > Shane > > > > ------------------------------------------------------------------------ > > Name: sm_pirl_pres_a.pdf > > sm_pirl_pres_a.pdf Type: Portable Document Format (application/pdf) > > Encoding: base64 > > Download Status: Not downloaded with message > > > > Name: PiRL_msds.pdf > > PiRL_msds.pdf Type: Portable Document Format (application/pdf) > > Encoding: base64 > > Download Status: Not downloaded with message > > > > Name: sm_pirl_data.pdf > > sm_pirl_data.pdf Type: Portable Document Format (application/pdf) > > Encoding: base64 > > Download Status: Not downloaded with message > > -- > Mary X. Tang, Ph.D. > Stanford Nanofabrication Facility > CIS Room 136, Mail Code 4070 > Stanford, CA 94305 > (650)723-9980 > mtang at stanford.edu > http://snf.stanford.edu From Umberto.Ulmanella at appliedbiosystems.com Tue Jun 29 16:27:55 2004 From: Umberto.Ulmanella at appliedbiosystems.com (Umberto Ulmanella) Date: Tue, 29 Jun 2004 16:27:55 -0700 Subject: Application to use SU-8 Message-ID: To whom it may concern, I am contemplating the possibility of using SU-8 photoresist from Microchem corp. (http://www.microchem.com) in my process. The goal is to obtain tall structures, in the order of 100um or more, in particular reservoir and channels, with minimum feature size 10um. Currently the design has not been finalized, so the choice between the different families of product is still open, with the SU8-50 to 100 and SU8-2035 to 2100 the most likely. I would appreciate any feedback on the choice of a particular type, especially for what concerns the difference between the traditional SU8 and the newer SU8-2000 types. Please find attached the necessary documentation as per the SNF procedures listed in your website. Any suggestions regarding changes to equipment and/or procedures are welcome. Regards, Umberto Ulmanella -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: MSDS SU-8 Developer.pdf Type: application/octet-stream Size: 384600 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: MSDS SU-8 PR.pdf Type: application/octet-stream Size: 41631 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... 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