New Material registering request [UV15]
mahnaz at snf.stanford.edu
Thu Mar 4 11:13:09 PST 2004
I think is just fine.
Mary Tang wrote:
> Hi all --
> Hiro has several requests for similar materials. As it seems that all the
> processing through the material cure will be done outside SNF, the films that
> the drytek and the semhitachi see will be generally inert (organic or silicone
> polymers of mixtures thereof.) All these sound OK to me. Can we approve
> "Tetsuhiro (Hiro) Hatogai" wrote:
> > Special Materials Committee:
> > Here is the application for new material, UV15.
> > Mainly we are going to use these materials in "Drytek1" and
> > "semhitachi".
> > I attached the scanned MSDS for the material.
> > Here is the information for the material required by following website.
> > http://snf.stanford.edu/Materials/NewMatProc.html
> > 1. Requestor name: Tetsuhiro Hatogai
> > 2. Phone number: 650-799-5366
> > 3. Email address: hatogai at stanford.edu
> > 4. Requestors PI: Professor R. Fabian W. Pease
> > 5. Name of new chemical: UV15
> > 6. No other materials
> > 7. Name of vendor: Master Bond Inc.
> > 8. http://www.masterbond.com
> > 9. 154 Hobart Street Hackensack, New Jersey 07601
> > 10. We would like to find materials that suit well to fabricate small
> > structures
> > 11. Find other material that is comparable with UV15.
> > 12. Drytek1, semhitachi
> > 13. 1 oz.
> > 14. Liquid
> > 15. No chemical is needed to mix it
> > 16. Please see attached
> > 17. Will not be used in the clean area
> > 18. Storage group identifier = L, Main Hazard Class = 6
> > 19. Should be enough room
> > 20. It can be disposed as usual trash.
> > 21. Process Flow:
> > (1) Spin-coat PVA on a silicon wafer that has small structure on it
> > using spin coater that our group owns in Packard 076
> > (2) Detach dried PVA film from silicon wafer,
> > (3) Spin-coat UV15 on the side that has structures on it of dried PVA
> > film
> > (4) Etch back UV15 to reduce the thickness of residual layer using
> > drytek1
> > (5) Observe the structures and measure the residual layer thickness
> > using semhitachi
> > Sincerely,
> > Tetsuhiro Hatogai (Hiro)
> > ------------------------------------------------------------------------
> > Name: MSDS UV15 p1.JPG
> > MSDS UV15 p1.JPG Type: JPEG Image (image/jpeg)
> > Encoding: base64
> > Name: MSDS UV15 p2.JPG
> > MSDS UV15 p2.JPG Type: JPEG Image (image/jpeg)
> > Encoding: base64
> Mary X. Tang, Ph.D.
> Stanford Nanofabrication Facility
> CIS Room 136, Mail Code 4070
> Stanford, CA 94305
> mtang at stanford.edu
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