From masafumi at stanford.edu Sat May 1 20:02:42 2004 From: masafumi at stanford.edu (masa) Date: Sat, 01 May 2004 20:02:42 -0700 Subject: New material request Message-ID: <20040430120518.FF5A.MASAFUMI@stanford.edu> Dear Special Materials Committee, I'd like to request to use new materials in CIS. Here is information below. This material has been approved for drytek and wbgen already. Requestor name: Masafumi Nakamura Phone number: 6507259936 email address: masafumi at stanford.edu Requestor?s PI (Advisor) or Company: Prof. Prinz The name of the new Chemical (give all names commonly used): YSZ(Yttrium Stabilized Zirconia) If there are secondary new chemicals that must be used with this material, such as a developer for a new resist, list each of them here and supply MSDSs for each of them. Name of vendor/manufacturer that you are planning to obtain this material from: Kurt J. Lesker URL for vendor?s website where info on the proposed chemical can be found: http://www.lesker.com/newweb/menu_sputtertargets.cfm?CFID=509541&CFTOKEN=52542279 Vendor?s address and phone number: 3983 First Street Livermore, CA 94551 1-800-245-1656/925-449-0104 What is your reason for wanting to bring this material into the lab: I want to process, such as etch, Si wafer or SiN in CIS after deposition of this material. List all the lab equipment and wet benches that you propose to use with this chemical: wbnitride Proposed quantity of the chemical that you want to bring into lab (give both raw and mixed quantities): YSZ: Yttrium 16%, Zirconia 84% - Purity:99.7% State the form that the proposed chemical is in: Thin film on Si wafer. Put together a detailed process flow description on how you proposed to use this chemical: The material is RF sputtered thin film. Regards. Masafumi Nakamura From mcvittie at snf.stanford.edu Tue May 4 08:52:11 2004 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Tue, 04 May 2004 08:52:11 -0700 Subject: New Material registering request [MB300, SK-9] References: <000001c4318a$dc6aef60$6500a8c0@toshibauser> Message-ID: <4097BC2A.A30A622D@snf.stanford.edu> Hiro, Since your meterials have no metals in them, you can go ahead and use them in the AMTetcher and P5000. Jim "Tetsuhiro (Hiro) Hatogai" wrote: > Dear Jim McVittie: > > Thank you for having a brief talk on SpecMat today.This is a reminder > email that you asked me. > > Since I am planning to graduate this June with Engineer Degree, I > really appreciate a quick approval of these two materials. > > P5000 and AMT8100 were to be used in the final step of the experiment > that is planed to be made for my Engineer degree thesis. > > Sincerely, > > Hiro (Tetsuhiro Hatogai) > > -----Original Message----- > From: Tetsuhiro (Hiro) Hatogai [mailto:hatogai at stanford.edu] > Sent:Wednesday, April 28, 20046:21 PM > To: 'Jim McVittie' > Cc: 'Charles D Schaper'; 'R. Fabian W. Pease' > Subject: RE: New Material registering request [MB300, SK-9] > > Dear Jim McVittie: > > Thank you very much for taking your time this morning. > > I made sure that MB300 and SK-9 do not contain any metal. I hope that > these two materials are approved to be used in P5000, AMT 8100 Plasma > Etcher (amtetcher), Drytek2, and wbmetal soon. > > FYI, here is my question to the manufactures and reply from each > manufacture of two materials, SK-9 and MB300. > > My question to them: > > We are going to put the material that MB-300 (or SK9) is applied in > Experimentalequipment that need to be away from metal contamination. > We would like to choose an adhesive that does not contain Au, Cu, Na, > Liand Li in it.If you could say that there are no metal in MB-300(or > SK-9), that would be so nice. > > 1. Reply from SK-9 manufacturer, Summers Optical > > No it does not > > Thank you so much and if we can be of further assistance to you please > do not hesitate to contact me. I look forward to hearing from you. > All of the very best, > > Stacie kirsch > Summers Optical > 1560 Industry Road > PO Box 380 > 1560 Industry Road > HatfieldPa19440 > Tel:215-412-8380 > Fax: 215-412-8450 > E-mail: sgkcck at aol.com > www.emsdiasum.com > > 2. Reply from MB300 manufacturer, Master Bond Inc. > > There are no metallic fillers in MB300. To purchase new material call > Anne or > > Lori for assistance > > Rich Maurici > > Tech Sales > > Master Bond Inc. > > 154 Hobart Street > > Hackensack, NJ07601 > > phone: 201-343-8983 > > fax: 201-343-2132 > > web: www.masterbond.com > > email: main at masterbond.com > > Best Regard, > > Hiro (Tetsuhiro Hatogai) > > -----Original Message----- > From: Tetsuhiro (Hiro) Hatogai [mailto:hatogai at stanford.edu] > Sent: Tuesday, April 27, 20042:37 AM > To: 'Jim McVittie' > Cc: 'specmat at snf.stanford.edu'; 'Charles D Schaper'; 'R. Fabian W. > Pease' > Subject: RE: New Material registering request [MB300] > > Dear Jim McVittie, > > Thanks for the reply and I really appreciate your offering advice to > us. > > Here is the brief explanation of our process. > > First we use Drytek1 (Recipe: Resistsstrip) to reduce the thickness of > the residual layer of the pattern (made of SK-9: silicone contained UV > curable material) to be printed by back etching. > > Then we place the pattern on top of Aluminum or Oxide layer using very > thin (about 0.5-3um) adhesive (MB300 or use SK-9 again) layer. These > patterns are used as an etching mask for patterning (i) Aluminum or > (ii) Oxide layer. > > (i) For Patterning Aluminum layer (20nm in thickness), we are thinking > about using AMT 8100 Plasma Etcher (amtetcher). Another way for > patterning Aluminum is using wet etcher (wbmetal). Just before using > wbmetal, Wafer is gone through Drytek2 (Ultra Plasma) to attract > etchant effectively. > > (ii) For Patterning Oxide, we are thinking about using Applied > Materials Precision 5000 Etcher: p5000etch. > > Finally, fabricated structures are observed using hitachisem. > > For more detail, please see attached files. I added the size such as > film thickness to the process flow I sent before. > > Although we are using Drytek1 for thinning the residual layer, we are > going to use Drytek2 instead of Drytek1 to avoid sample contaminations > after the approval. > > I heard you are very busy these days. But if you have a time to meet, > please let me know. I am happy to drop you by and explain our process > more and have your advice. > > Thank you, > > Hiro > > -----Original Message----- > > From: Jim McVittie [mailto:mcvittie at snf.stanford.edu] > > Sent: Monday, April 26, 20048:37 PM > > To: hatogai at stanford.edu > > Cc: specmat at snf.stanford.edu; 'Charles D Schaper'; 'R. Fabian W. > Pease' > > Subject: Re: New Material registering request [MB300] > > Hiro, > > Drytek1 is a gold contaminated etcher while the P5000 is a clean tool. > You either need to switch > > your Drytek1 process to a clean etcher orswitch your P5000 to a > "dirty" etcher. Please tell me > > what you what to do in Drytek1 and in the P5000, so I can advise you > on a solution. > > Thanks,Jim > > "Tetsuhiro (Hiro) Hatogai" wrote: > > > Special Materials Committee: > > > > > > Here is the application for new material, MB300. > > > Mainly we are going to use these materials in "Drytek1", "P5000" and > > > "semhitachi". I attached the scanned MSDS for the material. > > > > > > Here is the information for the material required by following > website. > > > http://snf.stanford.edu/Materials/NewMatProc.html > > > > > > 1.Requestor name: Tetsuhiro Hatogai > > > 2.Phone number: 650-799-5366 > > > 3.Email address: hatogai at stanford.edu > > > 4.Requestors PI: Professor R. Fabian W. Pease > > > 5.Name of new chemical: MB300 > > > 6.No other materials > > > 7.Name of vendor: Master Bond Inc. > > > 8.http://www.masterbond.com > > > 9. 154 Hobart StreetHackensack, New Jersey07601 > > > 10. We would like to find materials that suit well to fabricate > small > > > structures > > > 11. Find other material that is comparable with MB300. > > > 12. Drytek1, semhitachi > > > 13. 100ml > > > 14. Liquid > > > 15. No chemical is needed to mix it > > > 16. Please see attached > > > 17. Will not be used in the clean area > > > 18. Storage group identifier = L, Main Hazard Class = 6 > > > 19. Should be enough room > > > 20. It can be disposed as usual trash. > > > 21. Process Flow:Detail is shown in attached file. > > >Spin-coat on a silicon wafer and bond a thin film that has small > > > structures on it. > > >(Spincoat will be made using spin coater that our group owns in > > > Packard 076) > > > > > > Sincerely, > > > Tetsuhiro Hatogai (Hiro) > > > > > > ------------------------------------------------------------------------ > > >Name: MB300 MSDS p2.JPG > > >MB300 MSDS p2.JPGType: JPEG Image (image/jpeg) > > >Encoding: base64 > > > > > >Name: MB300 MSDS p1.JPG > > >MB300 MSDS p1.JPGType: JPEG Image (image/jpeg) > > >Encoding: base64 > > > > > >Name: Process flow Al.ppt > > >Process flow Al.pptType: Microsoft PowerPoint Show > (application/vnd.ms-powerpoint) > > >Encoding: base64 > > >Download Status: Not downloaded with message > -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From pease at cis.stanford.edu Tue May 4 08:55:28 2004 From: pease at cis.stanford.edu (Fabian Pease) Date: Tue, 04 May 2004 08:55:28 -0700 Subject: New Material registering request [MB300, SK-9] In-Reply-To: <4097BC2A.A30A622D@snf.stanford.edu> References: <000001c4318a$dc6aef60$6500a8c0@toshibauser> Message-ID: <5.1.0.14.2.20040504085518.01c204e0@cis.stanford.edu> Thx Jim fp At 08:52 AM 5/4/2004 -0700, Jim McVittie wrote: >Hiro, > >Since your meterials have no metals in them, you can go ahead and use >them in the AMTetcher and P5000. Jim > >"Tetsuhiro (Hiro) Hatogai" wrote: > > > Dear Jim McVittie: > > > > Thank you for having a brief talk on SpecMat today.This is a reminder > > email that you asked me. > > > > Since I am planning to graduate this June with Engineer Degree, I > > really appreciate a quick approval of these two materials. > > > > P5000 and AMT8100 were to be used in the final step of the experiment > > that is planed to be made for my Engineer degree thesis. > > > > Sincerely, > > > > Hiro (Tetsuhiro Hatogai) > > > > -----Original Message----- > > From: Tetsuhiro (Hiro) Hatogai [mailto:hatogai at stanford.edu] > > Sent:Wednesday, April 28, 20046:21 PM > > To: 'Jim McVittie' > > Cc: 'Charles D Schaper'; 'R. Fabian W. Pease' > > Subject: RE: New Material registering request [MB300, SK-9] > > > > Dear Jim McVittie: > > > > Thank you very much for taking your time this morning. > > > > I made sure that MB300 and SK-9 do not contain any metal. I hope that > > these two materials are approved to be used in P5000, AMT 8100 Plasma > > Etcher (amtetcher), Drytek2, and wbmetal soon. > > > > FYI, here is my question to the manufactures and reply from each > > manufacture of two materials, SK-9 and MB300. > > > > My question to them: > > > > We are going to put the material that MB-300 (or SK9) is applied in > > Experimentalequipment that need to be away from metal contamination. > > We would like to choose an adhesive that does not contain Au, Cu, Na, > > Liand Li in it.If you could say that there are no metal in MB-300(or > > SK-9), that would be so nice. > > > > 1. Reply from SK-9 manufacturer, Summers Optical > > > > No it does not > > > > Thank you so much and if we can be of further assistance to you please > > do not hesitate to contact me. I look forward to hearing from you. > > All of the very best, > > > > Stacie kirsch > > Summers Optical > > 1560 Industry Road > > PO Box 380 > > 1560 Industry Road > > HatfieldPa19440 > > Tel:215-412-8380 > > Fax: 215-412-8450 > > E-mail: sgkcck at aol.com > > www.emsdiasum.com > > > > 2. Reply from MB300 manufacturer, Master Bond Inc. > > > > There are no metallic fillers in MB300. To purchase new material call > > Anne or > > > > Lori for assistance > > > > Rich Maurici > > > > Tech Sales > > > > Master Bond Inc. > > > > 154 Hobart Street > > > > Hackensack, NJ07601 > > > > phone: 201-343-8983 > > > > fax: 201-343-2132 > > > > web: www.masterbond.com > > > > email: main at masterbond.com > > > > Best Regard, > > > > Hiro (Tetsuhiro Hatogai) > > > > -----Original Message----- > > From: Tetsuhiro (Hiro) Hatogai [mailto:hatogai at stanford.edu] > > Sent: Tuesday, April 27, 20042:37 AM > > To: 'Jim McVittie' > > Cc: 'specmat at snf.stanford.edu'; 'Charles D Schaper'; 'R. Fabian W. > > Pease' > > Subject: RE: New Material registering request [MB300] > > > > Dear Jim McVittie, > > > > Thanks for the reply and I really appreciate your offering advice to > > us. > > > > Here is the brief explanation of our process. > > > > First we use Drytek1 (Recipe: Resistsstrip) to reduce the thickness of > > the residual layer of the pattern (made of SK-9: silicone contained UV > > curable material) to be printed by back etching. > > > > Then we place the pattern on top of Aluminum or Oxide layer using very > > thin (about 0.5-3um) adhesive (MB300 or use SK-9 again) layer. These > > patterns are used as an etching mask for patterning (i) Aluminum or > > (ii) Oxide layer. > > > > (i) For Patterning Aluminum layer (20nm in thickness), we are thinking > > about using AMT 8100 Plasma Etcher (amtetcher). Another way for > > patterning Aluminum is using wet etcher (wbmetal). Just before using > > wbmetal, Wafer is gone through Drytek2 (Ultra Plasma) to attract > > etchant effectively. > > > > (ii) For Patterning Oxide, we are thinking about using Applied > > Materials Precision 5000 Etcher: p5000etch. > > > > Finally, fabricated structures are observed using hitachisem. > > > > For more detail, please see attached files. I added the size such as > > film thickness to the process flow I sent before. > > > > Although we are using Drytek1 for thinning the residual layer, we are > > going to use Drytek2 instead of Drytek1 to avoid sample contaminations > > after the approval. > > > > I heard you are very busy these days. But if you have a time to meet, > > please let me know. I am happy to drop you by and explain our process > > more and have your advice. > > > > Thank you, > > > > Hiro > > > > -----Original Message----- > > > > From: Jim McVittie [mailto:mcvittie at snf.stanford.edu] > > > > Sent: Monday, April 26, 20048:37 PM > > > > To: hatogai at stanford.edu > > > > Cc: specmat at snf.stanford.edu; 'Charles D Schaper'; 'R. Fabian W. > > Pease' > > > > Subject: Re: New Material registering request [MB300] > > > > Hiro, > > > > Drytek1 is a gold contaminated etcher while the P5000 is a clean tool. > > You either need to switch > > > > your Drytek1 process to a clean etcher orswitch your P5000 to a > > "dirty" etcher. Please tell me > > > > what you what to do in Drytek1 and in the P5000, so I can advise you > > on a solution. > > > > Thanks,Jim > > > > "Tetsuhiro (Hiro) Hatogai" wrote: > > > > > Special Materials Committee: > > > > > > > > > > Here is the application for new material, MB300. > > > > > Mainly we are going to use these materials in "Drytek1", "P5000" and > > > > > "semhitachi". I attached the scanned MSDS for the material. > > > > > > > > > > Here is the information for the material required by following > > website. > > > > > http://snf.stanford.edu/Materials/NewMatProc.html > > > > > > > > > > 1.Requestor name: Tetsuhiro Hatogai > > > > > 2.Phone number: 650-799-5366 > > > > > 3.Email address: hatogai at stanford.edu > > > > > 4.Requestors PI: Professor R. Fabian W. Pease > > > > > 5.Name of new chemical: MB300 > > > > > 6.No other materials > > > > > 7.Name of vendor: Master Bond Inc. > > > > > 8.http://www.masterbond.com > > > > > 9. 154 Hobart StreetHackensack, New Jersey07601 > > > > > 10. We would like to find materials that suit well to fabricate > > small > > > > > structures > > > > > 11. Find other material that is comparable with MB300. > > > > > 12. Drytek1, semhitachi > > > > > 13. 100ml > > > > > 14. Liquid > > > > > 15. No chemical is needed to mix it > > > > > 16. Please see attached > > > > > 17. Will not be used in the clean area > > > > > 18. Storage group identifier = L, Main Hazard Class = 6 > > > > > 19. Should be enough room > > > > > 20. It can be disposed as usual trash. > > > > > 21. Process Flow:Detail is shown in attached file. > > > > >Spin-coat on a silicon wafer and bond a thin film that has small > > > > > structures on it. > > > > >(Spincoat will be made using spin coater that our group owns in > > > > > Packard 076) > > > > > > > > > > Sincerely, > > > > > Tetsuhiro Hatogai (Hiro) > > > > > > > > > > > ------------------------------------------------------------------------ > > > > >Name: MB300 MSDS p2.JPG > > > > >MB300 MSDS p2.JPGType: JPEG Image (image/jpeg) > > > > >Encoding: base64 > > > > > > > > > >Name: MB300 MSDS p1.JPG > > > > >MB300 MSDS p1.JPGType: JPEG Image (image/jpeg) > > > > >Encoding: base64 > > > > > > > > > >Name: Process flow Al.ppt > > > > >Process flow Al.pptType: Microsoft PowerPoint Show > > (application/vnd.ms-powerpoint) > > > > >Encoding: base64 > > > > >Download Status: Not downloaded with message > > From sjo at stanford.edu Mon May 17 14:14:52 2004 From: sjo at stanford.edu (Sebastian J. Osterfeld) Date: Mon, 17 May 2004 14:14:52 -0700 Subject: New materials: poly(dimethyl siloxane) Message-ID: <40A92B4C.5010501@stanford.edu> Hello, I'd like to use poly(dimethyl siloxane) at the SNF. In particular, I'd like to: - Bring a labeled 20mL syringe filed with pre-mixed and de-aired prepolymer mixture to the SNF - Apply the prepolymer mixture to a wafer by spincoating on Headway - Cure the prepolymer mixture on a hotplate @ 150C for 10 minutes The material I want to use is Dow Corning Sylgard (R) 184. It comes as a kit of base and curing agent, which I would mix by hand and de-air by applying a vacuum for a few minutes. I was planning on doing the mixing either outside the SNF, but I could also do it inside the SNF, in which case two separate materials might need to be approved, i.e. the binder and the curing agent. Here are the MSDS sheets: Sylgard 184, CAS 68988-56-7: http://stanford.chemquik.com/default.asp?LinkNum=SIR%24CGXLH Sylgard 184 curing agent, CAS 68037-59-2: http://stanford.chemquik.com/default.asp?LinkNum=SIR%24CLMLT -- Sebastian J. Osterfeld PhD. Student / Shan X. Wang Group Dept. of Materials Science & Engineering Residential Mailing Address: 796 Escondido Rd, Apt 23B Stanford, CA 94305 Office Mailing Address: McCullough Building, Room 208A 476 Lomita Mall Stanford, CA 94305-4045 Home: (650) 498-1666 (with answering machine) Work: (650) 723-2939 Fax: (650) 736-1984 (at work) Email: Osterfeld at stanford.edu From sjo at stanford.edu Mon May 17 14:22:11 2004 From: sjo at stanford.edu (Sebastian J. Osterfeld) Date: Mon, 17 May 2004 14:22:11 -0700 Subject: Transparent wafers +dyed / anti-reflective LOL2000? Message-ID: <40A92D03.2090607@stanford.edu> I am trying to get good lift-off results on transparent substrates, and I am running into problems with feature resolution. Sometimes this is due to reflection of the UV from the lower boundary of the transparent substrate, I hear. This can be avoided by coating the substrate with a non-reflective material. Since I coat my substrates in LOL2000 anyway, wouldn't it be ideal to have a *strongly* absorbent and UV-opaque LOL2000 formulation available? Would you be able to mix some LOL2000 that would, essentially, be black? This should allow me to get good results on a.) transparent substrates and b.) reflective materials such as Aluminum. Thanks! -- Sebastian J. Osterfeld PhD. Student / Shan X. Wang Group Dept. of Materials Science & Engineering Residential Mailing Address: 796 Escondido Rd, Apt 23B Stanford, CA 94305 Office Mailing Address: McCullough Building, Room 208A 476 Lomita Mall Stanford, CA 94305-4045 Home: (650) 498-1666 (with answering machine) Work: (650) 723-2939 Fax: (650) 736-1984 (at work) Email: Osterfeld at stanford.edu From mtang at snf.stanford.edu Mon May 17 14:32:48 2004 From: mtang at snf.stanford.edu (Mary Tang) Date: Mon, 17 May 2004 14:32:48 -0700 Subject: New materials: poly(dimethyl siloxane) References: <40A92B4C.5010501@stanford.edu> Message-ID: <40A92F80.326A148A@snf.stanford.edu> Hi Sebastian -- Pre-mixed PDMS is already approved for use at the headway (using appropriate precautions: cleaning up any working areas with acetone and removing/disposing of the foil liner in the headway and on the hotplate.) If you use any solvents or approved thinners, the waste must be treated as solvent waste. If pure PDMS is used, then the waste is non-toxic and may be disposed of by placing in a plastic sealed bag (to prevent leaks) and then in the ordinary trash (it will cure and harden over a few hours.) Mixing must be done outside of the lab (the uncured monomer can easily contaminate people's material in litho, leading to resist adhesion problems.) Mixing can be done in the wafersaw room (I can show you the setup, just let me know.) Mary "Sebastian J. Osterfeld" wrote: > Hello, > > I'd like to use poly(dimethyl siloxane) at the SNF. In particular, I'd > like to: > > - Bring a labeled 20mL syringe filed with pre-mixed and de-aired > prepolymer mixture to the SNF > - Apply the prepolymer mixture to a wafer by spincoating on Headway > - Cure the prepolymer mixture on a hotplate @ 150C for 10 minutes > > The material I want to use is Dow Corning Sylgard (R) 184. It comes as a > kit of base and curing agent, which I would mix by hand and de-air by > applying a vacuum for a few minutes. I was planning on doing the mixing > either outside the SNF, but I could also do it inside the SNF, in which > case two separate materials might need to be approved, i.e. the binder > and the curing agent. > > Here are the MSDS sheets: > > Sylgard 184, CAS 68988-56-7: > http://stanford.chemquik.com/default.asp?LinkNum=SIR%24CGXLH > > Sylgard 184 curing agent, CAS 68037-59-2: > http://stanford.chemquik.com/default.asp?LinkNum=SIR%24CLMLT > > -- > Sebastian J. Osterfeld > PhD. Student / Shan X. Wang Group > Dept. of Materials Science & Engineering > > Residential Mailing Address: > 796 Escondido Rd, Apt 23B > Stanford, CA 94305 > > Office Mailing Address: > McCullough Building, Room 208A > 476 Lomita Mall > Stanford, CA 94305-4045 > > Home: (650) 498-1666 (with answering machine) > Work: (650) 723-2939 > Fax: (650) 736-1984 (at work) > > Email: Osterfeld at stanford.edu -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at snf.stanford.edu Mon May 17 14:35:59 2004 From: mtang at snf.stanford.edu (Mary Tang) Date: Mon, 17 May 2004 14:35:59 -0700 Subject: Transparent wafers +dyed / anti-reflective LOL2000? References: <40A92D03.2090607@stanford.edu> Message-ID: <40A9303F.C128295F@snf.stanford.edu> Hi Sebastian -- Are you using the AZ3617 dyed resist? I am not familiar with how this works with the LOL2000, but theoretically, this should avoid the problems with double exposure due to transparent (This resist was introduced to get around problems with transparent substrates). Mahnaz -- is that correct? Mary "Sebastian J. Osterfeld" wrote: > I am trying to get good lift-off results on transparent substrates, and > I am running into problems with feature resolution. Sometimes this is > due to reflection of the UV from the lower boundary of the transparent > substrate, I hear. This can be avoided by coating the substrate with a > non-reflective material. > > Since I coat my substrates in LOL2000 anyway, wouldn't it be ideal to > have a *strongly* absorbent and UV-opaque LOL2000 formulation available? > Would you be able to mix some LOL2000 that would, essentially, be black? > This should allow me to get good results on a.) transparent substrates > and b.) reflective materials such as Aluminum. > > Thanks! > > -- > Sebastian J. Osterfeld > PhD. Student / Shan X. Wang Group > Dept. of Materials Science & Engineering > > Residential Mailing Address: > 796 Escondido Rd, Apt 23B > Stanford, CA 94305 > > Office Mailing Address: > McCullough Building, Room 208A > 476 Lomita Mall > Stanford, CA 94305-4045 > > Home: (650) 498-1666 (with answering machine) > Work: (650) 723-2939 > Fax: (650) 736-1984 (at work) > > Email: Osterfeld at stanford.edu -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mahnaz at snf.stanford.edu Tue May 18 09:05:47 2004 From: mahnaz at snf.stanford.edu (Mahnaz Mansourpour) Date: Tue, 18 May 2004 09:05:47 -0700 Subject: Transparent wafers +dyed / anti-reflective LOL2000? References: <40A92D03.2090607@stanford.edu> <40A9303F.C128295F@snf.stanford.edu> Message-ID: <40AA345B.A0231D7F@snf.stanford.edu> Hi Sebastian, I have not tried lift off process with 3617M but I do not think would make any difference. You should use 3617m for transparent substrate the die in this resist would eliminates a lot of the reflection. I have resolved 1 um line on glass substrate with this resist. Let me know so I can give you some more details. With LoL2000 bake is very important and how much is the thickness of your metal? Come and see me when you have few minutes of time. mahnaz Mary Tang wrote: > Hi Sebastian -- > > Are you using the AZ3617 dyed resist? I am not familiar with how this works > with the LOL2000, but theoretically, this should avoid the problems with > double exposure due to transparent (This resist was introduced to get > around problems with transparent substrates). Mahnaz -- is that correct? > > Mary > > "Sebastian J. Osterfeld" wrote: > > > I am trying to get good lift-off results on transparent substrates, and > > I am running into problems with feature resolution. Sometimes this is > > due to reflection of the UV from the lower boundary of the transparent > > substrate, I hear. This can be avoided by coating the substrate with a > > non-reflective material. > > > > Since I coat my substrates in LOL2000 anyway, wouldn't it be ideal to > > have a *strongly* absorbent and UV-opaque LOL2000 formulation available? > > Would you be able to mix some LOL2000 that would, essentially, be black? > > This should allow me to get good results on a.) transparent substrates > > and b.) reflective materials such as Aluminum. > > > > Thanks! > > > > -- > > Sebastian J. Osterfeld > > PhD. Student / Shan X. Wang Group > > Dept. of Materials Science & Engineering > > > > Residential Mailing Address: > > 796 Escondido Rd, Apt 23B > > Stanford, CA 94305 > > > > Office Mailing Address: > > McCullough Building, Room 208A > > 476 Lomita Mall > > Stanford, CA 94305-4045 > > > > Home: (650) 498-1666 (with answering machine) > > Work: (650) 723-2939 > > Fax: (650) 736-1984 (at work) > > > > Email: Osterfeld at stanford.edu > > -- > Mary X. Tang, Ph.D. > Stanford Nanofabrication Facility > CIS Room 136, Mail Code 4070 > Stanford, CA 94305 > (650)723-9980 > mtang at stanford.edu > http://snf.stanford.edu From wingcat at pacbell.net Sat May 22 16:51:39 2004 From: wingcat at pacbell.net (Adrian Tymes) Date: Sat, 22 May 2004 16:51:39 -0700 (PDT) Subject: List of solvents on Web site? Message-ID: <20040522235139.66013.qmail@web80411.mail.yahoo.com> I'm trying to find a list of what solvents have been approved for use at the SNF. However, the Web site keeps pointing to http://snf.stanford.edu/Materials/MaterialsList/MaterialsList.html yet this list seems to be incomplete. For example, I do not see acetone on the list, yet I know that is one of the reccomended/standard materials. I may have just missed the page; the closest I can find is the list of MSDS sheets, but not everything with a MSDS sheet is approved for all classes of equipment. In particular, I am looking for something I can dissolve copper (or some other etchable sacrificial material) with, that will not adversely effect aluminum or silicon, and I would prefer to use materials you have already approved. Could you point me to a list of approved solvents which I can examine for the properties I desire? (Or do you happen to have a solvent you reccomend for this use?) Thank you in advance for this information. From shott at snf.stanford.edu Sat May 22 17:44:32 2004 From: shott at snf.stanford.edu (John Shott) Date: Sat, 22 May 2004 17:44:32 -0700 Subject: List of solvents on Web site? References: <20040522235139.66013.qmail@web80411.mail.yahoo.com> Message-ID: <00c801c4405f$1d1e43d0$286540ab@jds> Adrian: While I can't comment on the status of the list of solvents on the web-site, I think that you may need to look elsewhere. For starters, there are very few solvents that will dissolve metals. Secondly, copper is a pretty difficult material to etch ... either wet or dry ... and just about anything that will etch copper is going to remove aluminum. Plus, using copper merely as a sacrificial layer, seems to limit where you can do additional processing ... at least relative to the number of places where silicon and aluminum can be processed. I'd back up and try to find a more suitable sacrificial layer than copper ... and then try to find something that can remove that without touching aluminum or silicon. Without knowing more about the structure you are trying to build, I can't really suggest any alternatives. Good luck, John ----- Original Message ----- From: "Adrian Tymes" To: Sent: Saturday, May 22, 2004 4:51 PM Subject: List of solvents on Web site? > I'm trying to find a list of what solvents have been > approved for use at the SNF. However, the Web site > keeps pointing to > http://snf.stanford.edu/Materials/MaterialsList/MaterialsList.html > yet this list seems to be incomplete. For example, I > do not see acetone on the list, yet I know that is one > of the reccomended/standard materials. I may have > just missed the page; the closest I can find is the > list of MSDS sheets, but not everything with a MSDS > sheet is approved for all classes of equipment. > > In particular, I am looking for something I can > dissolve copper (or some other etchable sacrificial > material) with, that will not adversely effect > aluminum or silicon, and I would prefer to use > materials you have already approved. Could you point > me to a list of approved solvents which I can examine > for the properties I desire? (Or do you happen to > have a solvent you reccomend for this use?) > > Thank you in advance for this information. >