New Material registering request [MB300, SK-9]

Jim McVittie mcvittie at snf.stanford.edu
Tue May 4 08:52:11 PDT 2004


Hiro,

Since your meterials have no metals in them, you can go ahead and use
them in the AMTetcher and P5000.   Jim

"Tetsuhiro (Hiro) Hatogai" wrote:

> Dear Jim McVittie:
>
> Thank you for having a brief talk on SpecMat today.This is a reminder
> email that you asked me.
>
> Since I am planning to graduate this June with Engineer Degree, I
> really appreciate a quick approval of these two materials.
>
> P5000 and AMT8100 were to be used in the final step of the experiment
> that is planed to be made for my Engineer degree thesis.
>
> Sincerely,
>
> Hiro (Tetsuhiro Hatogai)
>
> -----Original Message-----
> From: Tetsuhiro (Hiro) Hatogai [mailto:hatogai at stanford.edu]
> Sent:Wednesday, April 28, 20046:21 PM
> To: 'Jim McVittie'
> Cc: 'Charles D Schaper'; 'R. Fabian W. Pease'
> Subject: RE: New Material registering request [MB300, SK-9]
>
> Dear Jim McVittie:
>
> Thank you very much for taking your time this morning.
>
> I made sure that MB300 and SK-9 do not contain any metal. I hope that
> these two materials are approved to be used in P5000, AMT 8100 Plasma
> Etcher (amtetcher), Drytek2, and wbmetal soon.
>
> FYI, here is my question to the manufactures and reply from each
> manufacture of two materials, SK-9 and MB300.
>
> My question to them:
>
> We are going to put the material that MB-300 (or SK9) is applied in
> Experimentalequipment that need to be away from metal contamination.
> We would like to choose an adhesive that does not contain Au, Cu, Na,
> Liand Li in it.If you could say that there are no metal in MB-300(or
> SK-9), that would be so nice.
>
> 1. Reply from SK-9 manufacturer, Summers Optical
>
> No it does not
>
> Thank you so much and if we can be of further assistance to you please
> do not hesitate to contact me. I look forward to hearing from you.
> All of the very best,
>
> Stacie kirsch
> Summers Optical
> 1560 Industry Road
> PO Box 380
> 1560 Industry Road
> HatfieldPa19440
> Tel:215-412-8380
> Fax: 215-412-8450
> E-mail: sgkcck at aol.com
> www.emsdiasum.com
>
> 2. Reply from MB300 manufacturer, Master Bond Inc.
>
> There are no metallic fillers in MB300. To purchase new material call
> Anne or
>
> Lori for assistance
>
> Rich Maurici
>
> Tech Sales
>
> Master Bond Inc.
>
> 154 Hobart Street
>
> Hackensack, NJ07601
>
> phone: 201-343-8983
>
> fax: 201-343-2132
>
> web: www.masterbond.com
>
> email: main at masterbond.com
>
> Best Regard,
>
> Hiro (Tetsuhiro Hatogai)
>
> -----Original Message-----
> From: Tetsuhiro (Hiro) Hatogai [mailto:hatogai at stanford.edu]
> Sent: Tuesday, April 27, 20042:37 AM
> To: 'Jim McVittie'
> Cc: 'specmat at snf.stanford.edu'; 'Charles D Schaper'; 'R. Fabian W.
> Pease'
> Subject: RE: New Material registering request [MB300]
>
> Dear Jim McVittie,
>
> Thanks for the reply and I really appreciate your offering advice to
> us.
>
> Here is the brief explanation of our process.
>
> First we use Drytek1 (Recipe: Resistsstrip) to reduce the thickness of
> the residual layer of the pattern (made of SK-9: silicone contained UV
> curable material) to be printed by back etching.
>
> Then we place the pattern on top of Aluminum or Oxide layer using very
> thin (about 0.5-3um) adhesive (MB300 or use SK-9 again) layer. These
> patterns are used as an etching mask for patterning (i) Aluminum or
> (ii) Oxide layer.
>
> (i) For Patterning Aluminum layer (20nm in thickness), we are thinking
> about using AMT 8100 Plasma Etcher (amtetcher). Another way for
> patterning Aluminum is using wet etcher (wbmetal). Just before using
> wbmetal, Wafer is gone through Drytek2 (Ultra Plasma) to attract
> etchant effectively.
>
> (ii) For Patterning Oxide, we are thinking about using Applied
> Materials Precision 5000 Etcher: p5000etch.
>
> Finally, fabricated structures are observed using hitachisem.
>
> For more detail, please see attached files. I added the size such as
> film thickness to the process flow I sent before.
>
> Although we are using Drytek1 for thinning the residual layer, we are
> going to use Drytek2 instead of Drytek1 to avoid sample contaminations
> after the approval.
>
> I heard you are very busy these days. But if you have a time to meet,
> please let me know. I am happy to drop you by and explain our process
> more and have your advice.
>
> Thank you,
>
> Hiro
>
> -----Original Message-----
>
> From: Jim McVittie [mailto:mcvittie at snf.stanford.edu]
>
> Sent: Monday, April 26, 20048:37 PM
>
> To: hatogai at stanford.edu
>
> Cc: specmat at snf.stanford.edu; 'Charles D Schaper'; 'R. Fabian W.
> Pease'
>
> Subject: Re: New Material registering request [MB300]
>
> Hiro,
>
> Drytek1 is a gold contaminated etcher while the P5000 is a clean tool.
> You either need to switch
>
> your Drytek1 process to a clean etcher orswitch your P5000 to a
> "dirty" etcher. Please tell me
>
> what you what to do in Drytek1 and in the P5000, so I can advise you
> on a solution.
>
> Thanks,Jim
>
> "Tetsuhiro (Hiro) Hatogai" wrote:
>
> > Special Materials Committee:
>
> >
>
> > Here is the application for new material, MB300.
>
> > Mainly we are going to use these materials in "Drytek1", "P5000" and
>
> > "semhitachi". I attached the scanned MSDS for the material.
>
> >
>
> > Here is the information for the material required by following
> website.
>
> > http://snf.stanford.edu/Materials/NewMatProc.html
>
> >
>
> > 1.Requestor name: Tetsuhiro Hatogai
>
> > 2.Phone number: 650-799-5366
>
> > 3.Email address: hatogai at stanford.edu
>
> > 4.Requestors PI: Professor R. Fabian W. Pease
>
> > 5.Name of new chemical: MB300
>
> > 6.No other materials
>
> > 7.Name of vendor: Master Bond Inc.
>
> > 8.http://www.masterbond.com
>
> > 9. 154 Hobart StreetHackensack, New Jersey07601
>
> > 10. We would like to find materials that suit well to fabricate
> small
>
> > structures
>
> > 11. Find other material that is comparable with MB300.
>
> > 12. Drytek1, semhitachi
>
> > 13. 100ml
>
> > 14. Liquid
>
> > 15. No chemical is needed to mix it
>
> > 16. Please see attached
>
> > 17. Will not be used in the clean area
>
> > 18. Storage group identifier = L, Main Hazard Class = 6
>
> > 19. Should be enough room
>
> > 20. It can be disposed as usual trash.
>
> > 21. Process Flow:Detail is shown in attached file.
>
> >Spin-coat on a silicon wafer and bond a thin film that has small
>
> > structures on it.
>
> >(Spincoat will be made using spin coater that our group owns in
>
> > Packard 076)
>
> >
>
> > Sincerely,
>
> > Tetsuhiro Hatogai (Hiro)
>
> >
>
>
> ------------------------------------------------------------------------
>
> >Name: MB300 MSDS p2.JPG
>
> >MB300 MSDS p2.JPGType: JPEG Image (image/jpeg)
>
> >Encoding: base64
>
> >
>
> >Name: MB300 MSDS p1.JPG
>
> >MB300 MSDS p1.JPGType: JPEG Image (image/jpeg)
>
> >Encoding: base64
>
> >
>
> >Name: Process flow Al.ppt
>
> >Process flow Al.pptType: Microsoft PowerPoint Show
> (application/vnd.ms-powerpoint)
>
> >Encoding: base64
>
> >Download Status: Not downloaded with message
>
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