New Material registering request [MB300, SK-9]

Fabian Pease pease at cis.stanford.edu
Tue May 4 08:55:28 PDT 2004


Thx Jim
fp
At 08:52 AM 5/4/2004 -0700, Jim McVittie wrote:
>Hiro,
>
>Since your meterials have no metals in them, you can go ahead and use
>them in the AMTetcher and P5000.   Jim
>
>"Tetsuhiro (Hiro) Hatogai" wrote:
>
> > Dear Jim McVittie:
> >
> > Thank you for having a brief talk on SpecMat today.This is a reminder
> > email that you asked me.
> >
> > Since I am planning to graduate this June with Engineer Degree, I
> > really appreciate a quick approval of these two materials.
> >
> > P5000 and AMT8100 were to be used in the final step of the experiment
> > that is planed to be made for my Engineer degree thesis.
> >
> > Sincerely,
> >
> > Hiro (Tetsuhiro Hatogai)
> >
> > -----Original Message-----
> > From: Tetsuhiro (Hiro) Hatogai [mailto:hatogai at stanford.edu]
> > Sent:Wednesday, April 28, 20046:21 PM
> > To: 'Jim McVittie'
> > Cc: 'Charles D Schaper'; 'R. Fabian W. Pease'
> > Subject: RE: New Material registering request [MB300, SK-9]
> >
> > Dear Jim McVittie:
> >
> > Thank you very much for taking your time this morning.
> >
> > I made sure that MB300 and SK-9 do not contain any metal. I hope that
> > these two materials are approved to be used in P5000, AMT 8100 Plasma
> > Etcher (amtetcher), Drytek2, and wbmetal soon.
> >
> > FYI, here is my question to the manufactures and reply from each
> > manufacture of two materials, SK-9 and MB300.
> >
> > My question to them:
> >
> > We are going to put the material that MB-300 (or SK9) is applied in
> > Experimentalequipment that need to be away from metal contamination.
> > We would like to choose an adhesive that does not contain Au, Cu, Na,
> > Liand Li in it.If you could say that there are no metal in MB-300(or
> > SK-9), that would be so nice.
> >
> > 1. Reply from SK-9 manufacturer, Summers Optical
> >
> > No it does not
> >
> > Thank you so much and if we can be of further assistance to you please
> > do not hesitate to contact me. I look forward to hearing from you.
> > All of the very best,
> >
> > Stacie kirsch
> > Summers Optical
> > 1560 Industry Road
> > PO Box 380
> > 1560 Industry Road
> > HatfieldPa19440
> > Tel:215-412-8380
> > Fax: 215-412-8450
> > E-mail: sgkcck at aol.com
> > www.emsdiasum.com
> >
> > 2. Reply from MB300 manufacturer, Master Bond Inc.
> >
> > There are no metallic fillers in MB300. To purchase new material call
> > Anne or
> >
> > Lori for assistance
> >
> > Rich Maurici
> >
> > Tech Sales
> >
> > Master Bond Inc.
> >
> > 154 Hobart Street
> >
> > Hackensack, NJ07601
> >
> > phone: 201-343-8983
> >
> > fax: 201-343-2132
> >
> > web: www.masterbond.com
> >
> > email: main at masterbond.com
> >
> > Best Regard,
> >
> > Hiro (Tetsuhiro Hatogai)
> >
> > -----Original Message-----
> > From: Tetsuhiro (Hiro) Hatogai [mailto:hatogai at stanford.edu]
> > Sent: Tuesday, April 27, 20042:37 AM
> > To: 'Jim McVittie'
> > Cc: 'specmat at snf.stanford.edu'; 'Charles D Schaper'; 'R. Fabian W.
> > Pease'
> > Subject: RE: New Material registering request [MB300]
> >
> > Dear Jim McVittie,
> >
> > Thanks for the reply and I really appreciate your offering advice to
> > us.
> >
> > Here is the brief explanation of our process.
> >
> > First we use Drytek1 (Recipe: Resistsstrip) to reduce the thickness of
> > the residual layer of the pattern (made of SK-9: silicone contained UV
> > curable material) to be printed by back etching.
> >
> > Then we place the pattern on top of Aluminum or Oxide layer using very
> > thin (about 0.5-3um) adhesive (MB300 or use SK-9 again) layer. These
> > patterns are used as an etching mask for patterning (i) Aluminum or
> > (ii) Oxide layer.
> >
> > (i) For Patterning Aluminum layer (20nm in thickness), we are thinking
> > about using AMT 8100 Plasma Etcher (amtetcher). Another way for
> > patterning Aluminum is using wet etcher (wbmetal). Just before using
> > wbmetal, Wafer is gone through Drytek2 (Ultra Plasma) to attract
> > etchant effectively.
> >
> > (ii) For Patterning Oxide, we are thinking about using Applied
> > Materials Precision 5000 Etcher: p5000etch.
> >
> > Finally, fabricated structures are observed using hitachisem.
> >
> > For more detail, please see attached files. I added the size such as
> > film thickness to the process flow I sent before.
> >
> > Although we are using Drytek1 for thinning the residual layer, we are
> > going to use Drytek2 instead of Drytek1 to avoid sample contaminations
> > after the approval.
> >
> > I heard you are very busy these days. But if you have a time to meet,
> > please let me know. I am happy to drop you by and explain our process
> > more and have your advice.
> >
> > Thank you,
> >
> > Hiro
> >
> > -----Original Message-----
> >
> > From: Jim McVittie [mailto:mcvittie at snf.stanford.edu]
> >
> > Sent: Monday, April 26, 20048:37 PM
> >
> > To: hatogai at stanford.edu
> >
> > Cc: specmat at snf.stanford.edu; 'Charles D Schaper'; 'R. Fabian W.
> > Pease'
> >
> > Subject: Re: New Material registering request [MB300]
> >
> > Hiro,
> >
> > Drytek1 is a gold contaminated etcher while the P5000 is a clean tool.
> > You either need to switch
> >
> > your Drytek1 process to a clean etcher orswitch your P5000 to a
> > "dirty" etcher. Please tell me
> >
> > what you what to do in Drytek1 and in the P5000, so I can advise you
> > on a solution.
> >
> > Thanks,Jim
> >
> > "Tetsuhiro (Hiro) Hatogai" wrote:
> >
> > > Special Materials Committee:
> >
> > >
> >
> > > Here is the application for new material, MB300.
> >
> > > Mainly we are going to use these materials in "Drytek1", "P5000" and
> >
> > > "semhitachi". I attached the scanned MSDS for the material.
> >
> > >
> >
> > > Here is the information for the material required by following
> > website.
> >
> > > http://snf.stanford.edu/Materials/NewMatProc.html
> >
> > >
> >
> > > 1.Requestor name: Tetsuhiro Hatogai
> >
> > > 2.Phone number: 650-799-5366
> >
> > > 3.Email address: hatogai at stanford.edu
> >
> > > 4.Requestors PI: Professor R. Fabian W. Pease
> >
> > > 5.Name of new chemical: MB300
> >
> > > 6.No other materials
> >
> > > 7.Name of vendor: Master Bond Inc.
> >
> > > 8.http://www.masterbond.com
> >
> > > 9. 154 Hobart StreetHackensack, New Jersey07601
> >
> > > 10. We would like to find materials that suit well to fabricate
> > small
> >
> > > structures
> >
> > > 11. Find other material that is comparable with MB300.
> >
> > > 12. Drytek1, semhitachi
> >
> > > 13. 100ml
> >
> > > 14. Liquid
> >
> > > 15. No chemical is needed to mix it
> >
> > > 16. Please see attached
> >
> > > 17. Will not be used in the clean area
> >
> > > 18. Storage group identifier = L, Main Hazard Class = 6
> >
> > > 19. Should be enough room
> >
> > > 20. It can be disposed as usual trash.
> >
> > > 21. Process Flow:Detail is shown in attached file.
> >
> > >Spin-coat on a silicon wafer and bond a thin film that has small
> >
> > > structures on it.
> >
> > >(Spincoat will be made using spin coater that our group owns in
> >
> > > Packard 076)
> >
> > >
> >
> > > Sincerely,
> >
> > > Tetsuhiro Hatogai (Hiro)
> >
> > >
> >
> >
> > ------------------------------------------------------------------------
> >
> > >Name: MB300 MSDS p2.JPG
> >
> > >MB300 MSDS p2.JPGType: JPEG Image (image/jpeg)
> >
> > >Encoding: base64
> >
> > >
> >
> > >Name: MB300 MSDS p1.JPG
> >
> > >MB300 MSDS p1.JPGType: JPEG Image (image/jpeg)
> >
> > >Encoding: base64
> >
> > >
> >
> > >Name: Process flow Al.ppt
> >
> > >Process flow Al.pptType: Microsoft PowerPoint Show
> > (application/vnd.ms-powerpoint)
> >
> > >Encoding: base64
> >
> > >Download Status: Not downloaded with message
> >




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