nickel silicide process concern in SNF.

Michael Deal mdeal at stanford.edu
Wed Nov 3 07:56:23 PST 2004


According to the semiclean B rules, one can use all the semicleanA tools 
except the plasma etchers.  And we officially sanction semiclean B when Jim 
reports back on the wet bench issues.
                                 -mike


At 07:46 AM 11/3/2004, Mary Tang wrote:
>Hi all --
>
>Does this request relate to the SemicleanA and SemicleanB project?
>How's that going, by the way?  Jun made the first official SpecMat request 
>in July, and he and his PI have been talking with several of us about this 
>well before then...  I can't seem to find his process flow at the moment, 
>but I understand that he wants to be able to do standard backend stuff 
>(LTO, P5000 etch, anneal).  Anyway, this group is pretty active in the lab 
>and seem to be reasonably knowledgeable...  Can we work with them to get 
>any additional information that might be required to establish a system 
>for using nickel silicides?
>
>
>Mary
>
>Yuan wrote:
>
>>Dear committee:
>>I plan to use the nickel silicide process soon in this lab ( I plan to
>>deposit nickel in the new machine which is semi-clean, based on the
>>conversion with Ed Myers), but I really want to know
>>whether I can use the other clean or semiclean tools after the nickel
>>silicide process(i,e, could the nickel silicide be treated similar to
>>ti-silicide ?).
>>I do wish I can get this answer soon, so that I can plan it ACCORDINGLY.
>>Thanks.
>>
>>Jun Yuan
>>--------------------------
>>Electrical Engineering department,
>>University of California, Los Angeles
>>Tel: 1-310-206-7331 (O)
>>Tel: 1-310-313-6681 (H)
>>
>
>
>--
>Mary X. Tang, Ph.D.
>Stanford Nanofabrication Facility
>CIS Room 136, Mail Code 4070
>Stanford, CA  94305
>(650)723-9980
>mtang at stanford.edu
>http://snf.stanford.edu
>




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