nickel silicide process concern in SNF.
mdeal at stanford.edu
Wed Nov 3 07:56:23 PST 2004
According to the semiclean B rules, one can use all the semicleanA tools
except the plasma etchers. And we officially sanction semiclean B when Jim
reports back on the wet bench issues.
At 07:46 AM 11/3/2004, Mary Tang wrote:
>Hi all --
>Does this request relate to the SemicleanA and SemicleanB project?
>How's that going, by the way? Jun made the first official SpecMat request
>in July, and he and his PI have been talking with several of us about this
>well before then... I can't seem to find his process flow at the moment,
>but I understand that he wants to be able to do standard backend stuff
>(LTO, P5000 etch, anneal). Anyway, this group is pretty active in the lab
>and seem to be reasonably knowledgeable... Can we work with them to get
>any additional information that might be required to establish a system
>for using nickel silicides?
>>I plan to use the nickel silicide process soon in this lab ( I plan to
>>deposit nickel in the new machine which is semi-clean, based on the
>>conversion with Ed Myers), but I really want to know
>>whether I can use the other clean or semiclean tools after the nickel
>>silicide process(i,e, could the nickel silicide be treated similar to
>>I do wish I can get this answer soon, so that I can plan it ACCORDINGLY.
>>Electrical Engineering department,
>>University of California, Los Angeles
>>Tel: 1-310-206-7331 (O)
>>Tel: 1-310-313-6681 (H)
>Mary X. Tang, Ph.D.
>Stanford Nanofabrication Facility
>CIS Room 136, Mail Code 4070
>Stanford, CA 94305
>mtang at stanford.edu
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