CMP at Cornell

Mary Tang mtang at
Fri Nov 12 15:20:38 PST 2004

Hi all --

So, this request is officially OK'ed, as per Jim.


Bipin Rajendran wrote:

> Hi,
> Regarding my earlier question regarding CMPing wafers at Cornell and 
> bringing it back to our lab ( email below), I talked to Dr. Jim 
> McVittie, and he suggested that I should do a normal RCA clean before 
> using equipments in our lab.
> Thanks
> Bipin
>     ----- Original Message -----
>     *From:* Bipin Rajendran <mailto:bipin at>
>     *To:* specmat at <mailto:specmat at>
>     *Sent:* Thursday, November 11, 2004 9:27 AM
>     *Subject:* CMP at Cornell
>     Hi,
>     I wanted to CMP an LTO layer on fully processed 410 wafers. I am
>     planning to do it at Cornell Fab, and here is what the In-Charge
>     of CMP tool there has written to me about their tool:
>     In terms of the gold contamination, we do not restrict gold from
>     the tool and in the past people have polished a gold layer on the
>     tool trying to do some gold damascene work.  The last time that
>     was done was probably 6 or more months ago.  The main parts of the
>     tool that contact the gold are the CMP pad and the carrier head
>     film, both of which are frequently changed.  We have people using
>     CMP who are making transistors here and they have not expressed
>     any issues with gold contamination.
>     I would be bonding another wafer to this CMPed LTO. Can you please
>     let me know if such a bonded wafer pair can go back to SNF for
>     normal processing. (May be atleast semi-clean instruments?)
>     Thanks
>     Bipin

Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
mtang at

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