Putting Cr contaminated wafers in StsEtcher
Amir Ali Haj Hossein Talasaz
atalasaz at stanford.edu
Fri Oct 1 12:06:45 PDT 2004
I need to do E-Beam lithography step followed by silicon nitride RIE
etching. Then do the backside etching in Stsetcher.
Since E-beam works fine on conductive surfaces (not thick SiN layer that I
have), I have to coat the front side of my wafer with Cr. After front side
pattering and etching the Cr film will be completely removed.
Now I am wondering if I can load the wafer in stsetcher to etch backside of
the wafer. Unfortunately I cannot exchange the order of these two steps.
Thanks for your time,
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