Putting Cr contaminated wafers in StsEtcher

Mary Tang mtang at snf.stanford.edu
Tue Oct 12 14:39:09 PDT 2004

Jim, Mike --

What do you gentlemen think?  Is this OK?


Amir Ali Haj Hossein Talasaz wrote:

> Hello,
> I need to do E-Beam lithography step followed by silicon nitride RIE
>etching. Then do the backside etching in Stsetcher.
> Since E-beam works fine on conductive surfaces (not thick SiN layer that I
>have), I have to coat the front side of my wafer with Cr. After front side
>pattering and etching the Cr film will be completely removed.
> Now I am wondering if I can load the wafer in stsetcher to etch backside of
>the wafer. Unfortunately I cannot exchange the order of these two steps.
> Thanks for your time,

Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
mtang at stanford.edu

More information about the specmat mailing list