Putting Cr contaminated wafers in StsEtcher
mtang at snf.stanford.edu
Tue Oct 12 14:39:09 PDT 2004
Jim, Mike --
What do you gentlemen think? Is this OK?
Amir Ali Haj Hossein Talasaz wrote:
> I need to do E-Beam lithography step followed by silicon nitride RIE
>etching. Then do the backside etching in Stsetcher.
> Since E-beam works fine on conductive surfaces (not thick SiN layer that I
>have), I have to coat the front side of my wafer with Cr. After front side
>pattering and etching the Cr film will be completely removed.
> Now I am wondering if I can load the wafer in stsetcher to etch backside of
>the wafer. Unfortunately I cannot exchange the order of these two steps.
> Thanks for your time,
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
mtang at stanford.edu
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