processing request

[Michael Deal]

I told Ankur that it seems that we can consider his films to be semi-cleanB 
and thus go into the LTO, but that we need a consensus of specmat.   He 
would appreciate it if we could decide this before the next specmat 
meeting, as he has already gone through 1 or 2 of the specmat cycles.
                                                 -mike


At 01:15 PM 4/5/2005, Ankur Jain wrote:
>Hello SpecMat members,
>  Following my request to allow processing of my wafers containing a Ni-Ti
>film in the LTO furnace, I had a brief meeting with Mike discussing my
>process flow. TiNi Alloy Company, the vendor that sputters these Ni-Ti
>films for me uses a Perkin-Elmer 4450 sputterer that is used exclusively
>for depositing Ni-Ti, and no other metals. They have done Auger
>spectroscopy on their films in the past and the only significant surface
>contamination observed was elemental carbon, which they say is normal for
>anything exposed to air.
>  Following my discussion with Mike, who agreed in principle to let me use
>the LTO tube, I am sending this email to SpecMat with a request to kindly
>expedite a final decision on my request. I would appreciate it very much
>if I can get started on my microfabrication soon.
>
>thanks,
>
>Ankur
>
>
>On Mon, 4 Apr 2005, Michael Deal wrote:
>
> > LTO is semicleanB, so it's okay to put Ni and Ti in there as long as the Ni
> > and Ta are not contaminated from somewhere else.  (We allow Ni and Ta
> > deposited in the new SCT sputterer to go into semiclean tools now, for
> > example.)     Ankur, where was the NiTi deposited and how clean is
> > it?   (Was it deposited in a system that also does gold or iron?)
> >                                                  0mike
> >
> >
> > At 01:13 PM 4/4/2005, Ankur Jain wrote:
> > >Hello SpecMat members,
> > >  I have six 4-inch Si wafers. It has a sandwich of 2 micron thermal oxide
> > >and 2 micron layer of Nickel-Titanium alloy on one side. The other side
> > >has only 2 micron thermal oxide. I would like to deposit about 0.5 microns
> > >of LTO on the Nickel-Titanium side. I understand that Ni is not one of the
> > >standard metals allowed on the metal side of the LTO tube.  However,
> > >Maurice suggested that I write to SpecMat and find out if it might be
> > >possible to do a one-time deposition just before the LTO tube is scheduled
> > >for pull and clean. Please let me know if that would be possible.
> > >  If you have any other suggestions for depositing an electrically
> > >passivating layer that will still let my wafers be processed in clean
> > >equipment after deposition, I would welcome them.
> > >
> > >thanks,
> > >
> > >Ankur.
> > >
> > >*************************************************************************
> > >ANKUR JAIN
> > >Graduate Student
> > >Microscale Heat Transfer Laboratories         Residence:
> > >Room 201, Building 530                        126 Blackwelder Ct, Apt 902
> > >Stanford, CA-94305                            Stanford, CA - 94305
> > >Ph: 650-736-0044                              Cell Ph: 650-799-8986
> > >http://www.stanford.edu/~ankurjn
> >
>
>*************************************************************************
>ANKUR JAIN
>Graduate Student
>Microscale Heat Transfer Laboratories         Residence:
>Room 201, Building 530                        126 Blackwelder Ct, Apt 902
>Stanford, CA-94305                            Stanford, CA - 94305
>Ph: 650-736-0044                              Cell Ph: 650-799-8986
>http://www.stanford.edu/~ankurjn