processing request

Mary Tang mtang at snf.stanford.edu
Tue Apr 5 14:01:10 PDT 2005


Hi Mike, et al --

It sounds good to me.  Is that a quorum?

Mary

Michael Deal wrote:

> I told Ankur that it seems that we can consider his films to be 
> semi-cleanB and thus go into the LTO, but that we need a consensus of 
> specmat.   He would appreciate it if we could decide this before the 
> next specmat meeting, as he has already gone through 1 or 2 of the 
> specmat cycles.
>                                                 -mike
>
>
> At 01:15 PM 4/5/2005, Ankur Jain wrote:
>
>> Hello SpecMat members,
>>  Following my request to allow processing of my wafers containing a 
>> Ni-Ti
>> film in the LTO furnace, I had a brief meeting with Mike discussing my
>> process flow. TiNi Alloy Company, the vendor that sputters these Ni-Ti
>> films for me uses a Perkin-Elmer 4450 sputterer that is used exclusively
>> for depositing Ni-Ti, and no other metals. They have done Auger
>> spectroscopy on their films in the past and the only significant surface
>> contamination observed was elemental carbon, which they say is normal 
>> for
>> anything exposed to air.
>>  Following my discussion with Mike, who agreed in principle to let me 
>> use
>> the LTO tube, I am sending this email to SpecMat with a request to 
>> kindly
>> expedite a final decision on my request. I would appreciate it very much
>> if I can get started on my microfabrication soon.
>>
>> thanks,
>>
>> Ankur
>>
>>
>> On Mon, 4 Apr 2005, Michael Deal wrote:
>>
>> > LTO is semicleanB, so it's okay to put Ni and Ti in there as long 
>> as the Ni
>> > and Ta are not contaminated from somewhere else.  (We allow Ni and Ta
>> > deposited in the new SCT sputterer to go into semiclean tools now, for
>> > example.)     Ankur, where was the NiTi deposited and how clean is
>> > it?   (Was it deposited in a system that also does gold or iron?)
>> >                                                  0mike
>> >
>> >
>> > At 01:13 PM 4/4/2005, Ankur Jain wrote:
>> > >Hello SpecMat members,
>> > >  I have six 4-inch Si wafers. It has a sandwich of 2 micron 
>> thermal oxide
>> > >and 2 micron layer of Nickel-Titanium alloy on one side. The other 
>> side
>> > >has only 2 micron thermal oxide. I would like to deposit about 0.5 
>> microns
>> > >of LTO on the Nickel-Titanium side. I understand that Ni is not 
>> one of the
>> > >standard metals allowed on the metal side of the LTO tube.  However,
>> > >Maurice suggested that I write to SpecMat and find out if it might be
>> > >possible to do a one-time deposition just before the LTO tube is 
>> scheduled
>> > >for pull and clean. Please let me know if that would be possible.
>> > >  If you have any other suggestions for depositing an electrically
>> > >passivating layer that will still let my wafers be processed in clean
>> > >equipment after deposition, I would welcome them.
>> > >
>> > >thanks,
>> > >
>> > >Ankur.
>> > >
>> > 
>> >************************************************************************* 
>>
>> > >ANKUR JAIN
>> > >Graduate Student
>> > >Microscale Heat Transfer Laboratories         Residence:
>> > >Room 201, Building 530                        126 Blackwelder Ct, 
>> Apt 902
>> > >Stanford, CA-94305                            Stanford, CA - 94305
>> > >Ph: 650-736-0044                              Cell Ph: 650-799-8986
>> > >http://www.stanford.edu/~ankurjn
>> >
>>
>> ************************************************************************* 
>>
>> ANKUR JAIN
>> Graduate Student
>> Microscale Heat Transfer Laboratories         Residence:
>> Room 201, Building 530                        126 Blackwelder Ct, Apt 
>> 902
>> Stanford, CA-94305                            Stanford, CA - 94305
>> Ph: 650-736-0044                              Cell Ph: 650-799-8986
>> http://www.stanford.edu/~ankurjn
>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu





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