processing request

Michael Deal mdeal at stanford.edu
Wed Apr 6 09:07:37 PDT 2005


Any objections in letting Ankur use the LTO for his Ni/Ti films?   If I 
don't hear by noon today, I'll assume it's okay.     -mike


At 02:01 PM 4/5/2005, Mary Tang wrote:
>Hi Mike, et al --
>
>It sounds good to me.  Is that a quorum?
>
>Mary
>
>Michael Deal wrote:
>
>>I told Ankur that it seems that we can consider his films to be 
>>semi-cleanB and thus go into the LTO, but that we need a consensus of 
>>specmat.   He would appreciate it if we could decide this before the next 
>>specmat meeting, as he has already gone through 1 or 2 of the specmat cycles.
>>                                                 -mike
>>
>>
>>At 01:15 PM 4/5/2005, Ankur Jain wrote:
>>
>>>Hello SpecMat members,
>>>  Following my request to allow processing of my wafers containing a Ni-Ti
>>>film in the LTO furnace, I had a brief meeting with Mike discussing my
>>>process flow. TiNi Alloy Company, the vendor that sputters these Ni-Ti
>>>films for me uses a Perkin-Elmer 4450 sputterer that is used exclusively
>>>for depositing Ni-Ti, and no other metals. They have done Auger
>>>spectroscopy on their films in the past and the only significant surface
>>>contamination observed was elemental carbon, which they say is normal for
>>>anything exposed to air.
>>>  Following my discussion with Mike, who agreed in principle to let me use
>>>the LTO tube, I am sending this email to SpecMat with a request to kindly
>>>expedite a final decision on my request. I would appreciate it very much
>>>if I can get started on my microfabrication soon.
>>>
>>>thanks,
>>>
>>>Ankur
>>>
>>>
>>>On Mon, 4 Apr 2005, Michael Deal wrote:
>>>
>>> > LTO is semicleanB, so it's okay to put Ni and Ti in there as long as 
>>> the Ni
>>> > and Ta are not contaminated from somewhere else.  (We allow Ni and Ta
>>> > deposited in the new SCT sputterer to go into semiclean tools now, for
>>> > example.)     Ankur, where was the NiTi deposited and how clean is
>>> > it?   (Was it deposited in a system that also does gold or iron?)
>>> >                                                  0mike
>>> >
>>> >
>>> > At 01:13 PM 4/4/2005, Ankur Jain wrote:
>>> > >Hello SpecMat members,
>>> > >  I have six 4-inch Si wafers. It has a sandwich of 2 micron thermal 
>>> oxide
>>> > >and 2 micron layer of Nickel-Titanium alloy on one side. The other side
>>> > >has only 2 micron thermal oxide. I would like to deposit about 0.5 
>>> microns
>>> > >of LTO on the Nickel-Titanium side. I understand that Ni is not one 
>>> of the
>>> > >standard metals allowed on the metal side of the LTO tube.  However,
>>> > >Maurice suggested that I write to SpecMat and find out if it might be
>>> > >possible to do a one-time deposition just before the LTO tube is 
>>> scheduled
>>> > >for pull and clean. Please let me know if that would be possible.
>>> > >  If you have any other suggestions for depositing an electrically
>>> > >passivating layer that will still let my wafers be processed in clean
>>> > >equipment after deposition, I would welcome them.
>>> > >
>>> > >thanks,
>>> > >
>>> > >Ankur.
>>> > >
>>> > >********************************************************************* 
>>> ****
>>> > >ANKUR JAIN
>>> > >Graduate Student
>>> > >Microscale Heat Transfer Laboratories         Residence:
>>> > >Room 201, Building 530                        126 Blackwelder Ct, 
>>> Apt 902
>>> > >Stanford, CA-94305                            Stanford, CA - 94305
>>> > >Ph: 650-736-0044                              Cell Ph: 650-799-8986
>>> > >http://www.stanford.edu/~ankurjn
>>> >
>>>
>>>*************************************************************************
>>>ANKUR JAIN
>>>Graduate Student
>>>Microscale Heat Transfer Laboratories         Residence:
>>>Room 201, Building 530                        126 Blackwelder Ct, Apt 902
>>>Stanford, CA-94305                            Stanford, CA - 94305
>>>Ph: 650-736-0044                              Cell Ph: 650-799-8986
>>>http://www.stanford.edu/~ankurjn
>
>
>--
>Mary X. Tang, Ph.D.
>Stanford Nanofabrication Facility
>CIS Room 136, Mail Code 4070
>Stanford, CA  94305
>(650)723-9980
>mtang at stanford.edu
>http://snf.stanford.edu
>
>




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