Thank you!! Re: processing request, semicleanB Ni-Ti

Ankur Jain ankurjn at stanford.edu
Wed Apr 6 15:09:42 PDT 2005


Thanks a lot for the expedited decision. I truly appreciate it.

regards,

Ankur

On Wed, 6 Apr 2005, Michael Deal wrote:

>
> Ankur,
>       The specmat committee has decided that your Ni-Ti samples can be
> considered semicleanB materials, and hence can go into the LTO
> (tylanbpsg).   The guidelines for semicleanB materials is:
>
> - Semiclean B class wafers (i.e. those deposited in the SCT system) can be
> processed in all semiclean equipment (i.e. tylanbpsg, tylanfga, etc.) as
> well as the litho equipment, with the following IMPORTANT restrictions:
>          a. Semiclean B class wafers can only be cleaned or wet-etched at
> wbgeneral in dedicated clean beakers. (exception: WBmetal - Semiclean A and
> B metals and Ge can be cleaned here, but only in the PRS-1000 pot.)
>          b. Dry-etching of these films will be allowed on a case-by-case
> basis.  (Etching oxide down to these SCT metals will be allowed in oxide
> etchers in the semiclean equipment set, ie. AMTetcher and P5000.)
>          c. When annealing semiclean B class wafers in the AG4108 RTA, the
> silicide tray must be used, which from now on will be referred to as the
> "semiclean tray".  (Once the AG4100 comes on line, it will be classified as
> a semiclean tool and will be used for all semiclean materials including SCT
> metals and Ge.  The AG4108 will be dedicated to clean materials only.)
>          d. Semiclean B materials (as with semiclean A materials) should
> use the metal-side of tylanfga.
>
>                                                          -mike
>
> At 01:15 PM 4/5/2005, Ankur Jain wrote:
> >Hello SpecMat members,
> >  Following my request to allow processing of my wafers containing a Ni-Ti
> >film in the LTO furnace, I had a brief meeting with Mike discussing my
> >process flow. TiNi Alloy Company, the vendor that sputters these Ni-Ti
> >films for me uses a Perkin-Elmer 4450 sputterer that is used exclusively
> >for depositing Ni-Ti, and no other metals. They have done Auger
> >spectroscopy on their films in the past and the only significant surface
> >contamination observed was elemental carbon, which they say is normal for
> >anything exposed to air.
> >  Following my discussion with Mike, who agreed in principle to let me use
> >the LTO tube, I am sending this email to SpecMat with a request to kindly
> >expedite a final decision on my request. I would appreciate it very much
> >if I can get started on my microfabrication soon.
> >
> >thanks,
> >
> >Ankur
> >
> >
> >On Mon, 4 Apr 2005, Michael Deal wrote:
> >
> > > LTO is semicleanB, so it's okay to put Ni and Ti in there as long as the Ni
> > > and Ta are not contaminated from somewhere else.  (We allow Ni and Ta
> > > deposited in the new SCT sputterer to go into semiclean tools now, for
> > > example.)     Ankur, where was the NiTi deposited and how clean is
> > > it?   (Was it deposited in a system that also does gold or iron?)
> > >                                                  0mike
> > >
> > >
> > > At 01:13 PM 4/4/2005, Ankur Jain wrote:
> > > >Hello SpecMat members,
> > > >  I have six 4-inch Si wafers. It has a sandwich of 2 micron thermal oxide
> > > >and 2 micron layer of Nickel-Titanium alloy on one side. The other side
> > > >has only 2 micron thermal oxide. I would like to deposit about 0.5 microns
> > > >of LTO on the Nickel-Titanium side. I understand that Ni is not one of the
> > > >standard metals allowed on the metal side of the LTO tube.  However,
> > > >Maurice suggested that I write to SpecMat and find out if it might be
> > > >possible to do a one-time deposition just before the LTO tube is scheduled
> > > >for pull and clean. Please let me know if that would be possible.
> > > >  If you have any other suggestions for depositing an electrically
> > > >passivating layer that will still let my wafers be processed in clean
> > > >equipment after deposition, I would welcome them.
> > > >
> > > >thanks,
> > > >
> > > >Ankur.
> > > >
> > > >*************************************************************************
> > > >ANKUR JAIN
> > > >Graduate Student
> > > >Microscale Heat Transfer Laboratories         Residence:
> > > >Room 201, Building 530                        126 Blackwelder Ct, Apt 902
> > > >Stanford, CA-94305                            Stanford, CA - 94305
> > > >Ph: 650-736-0044                              Cell Ph: 650-799-8986
> > > >http://www.stanford.edu/~ankurjn
> > >
> >
> >*************************************************************************
> >ANKUR JAIN
> >Graduate Student
> >Microscale Heat Transfer Laboratories         Residence:
> >Room 201, Building 530                        126 Blackwelder Ct, Apt 902
> >Stanford, CA-94305                            Stanford, CA - 94305
> >Ph: 650-736-0044                              Cell Ph: 650-799-8986
> >http://www.stanford.edu/~ankurjn
>

*************************************************************************
ANKUR JAIN
Graduate Student
Microscale Heat Transfer Laboratories         Residence:
Room 201, Building 530                        126 Blackwelder Ct, Apt 902
Stanford, CA-94305                            Stanford, CA - 94305
Ph: 650-736-0044                              Cell Ph: 650-799-8986
http://www.stanford.edu/~ankurjn




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