Fwd: Spin-on low-K dielectric material ...

Paul Rissman rissman at stanford.edu
Fri Apr 22 07:45:36 PDT 2005


In general this shouldn't be a problem.  We need to go through the exact 
chemistry list though.  Also, should be done in aluminum foil since it will 
probably dry to silicon dioxide.

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>Date: Thu, 21 Apr 2005 15:25:21 -0700
>From: John Shott <shott at snf.stanford.edu>
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>To: specmat at snf.stanford.edu
>Subject: Spin-on low-K dielectric material ...
>
>SpecMat members:
>
>Attached is a request for some material to be spun on some 6" wafers in 
>our lab.  This request comes from Mark Phillips in Santa Barbara who is 
>the CTO of a small company named SBA materials in Santa Barbara.  SBA 
>Materials was founded by 3 Santa Barbara faculty membes (including Galen 
>Stuckey).
>Thier website is <http://www.sbamaterials.com>www.sbamaterials.com.
>
>They are characterizing a spin-on low-K dielectric material.
>
>They are mixing this material in their own facility and would like to 
>bring it up to spin coat and maybe bake in our facility.  Because they 
>plan to bring the material with them and take it when they leave, there is 
>no storage issue.  Because this is not yet being manufactured ... they are 
>still developing the material ... there is no MSDS for the 
>mixture.  They've offered to send of MSDS sheets for each of the 
>components, but I think that you'll agree that we likely have most of them 
>already.  Any that we don't have, however, we can get them to send to us.
>
>Initially, because they would like to get a couple of wafers coated before 
>they can get through the next training session, they would like a staff 
>member to coat the wafers for them ... but, after that, are happy to be 
>trained to do the coating themselves and are also happy to perform any 
>post-spin cleanup that may be required.
>
>Finally, they'd like to be able to do a 350 degree C bake ... similar, I 
>think, to what some of the polyimide folks use.
>
>Comments, concerns, questions?  Like most requests, they are in a 
>hurry.  This request, however, does seem simpler in that it is for a tool 
>for which we already allow a pretty wide range of stuff ... and they don't 
>really need to take their any further than spin coat and bake in our facility.
>
>Thanks,
>
>John
>
>
>Return-Path: <mlfphillips at yahoo.com>
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>Apr 2005 11:34:02 PDT
>Date: Thu, 21 Apr 2005 11:34:02 -0700 (PDT)
>From: Mark Phillips <mlfphillips at yahoo.com>
>Subject: Re: forms
>To: John Shott <shott at snf.stanford.edu>
>In-Reply-To: 6667
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>
>Hi John,
>
>here's the info requested on the SNF website for
>bringing in new chemicals:
>
>1. Contact info: Mark Phillips, mlfphillips at yahoo.com,
>SBA Materials, Inc., Goleta, CA, (805) 683-6102 (ofc.)
>(510) 469-7742 (cell).
>
>2. The material is a spin-on dielectric layer that is
>a mixture of:
>
>Si(OEt)4 "TEOS" CAS # 78-10-4
>
>CH3Si(OEt)3  CAS# 2031-67-6
>
>ethanol CAS# 64-17-5
>
>poly(ethylene oxide)-block-poly(propylene oxide)-
>block-poly(ethylene oxide), MW = 5800 CAS# 9003-11-6
>
>dilute nitric acid (HNO3 CAS# 7697-37-2, H2O
>CAS # 7732-18-5)
>
>ethyl lactate CAS# 97-64-3
>
>propylene glycol monomethyl ether acetate "PGMEA" CAS
># 108-65-6
>
>I'll be bringing this stuff into SNF pre-mixed and I
>won't be storing it at SNF. However, the storage group
>identifier is L, and the Main Hazard Class is 6
>(flammable).
>
>3. Manufacturer: SBA Materials, Inc.,
>www.sbamaterials.com
>
>4. Reason for request: I need to prepare samples of
>this dielectric layer on Si wafers for physical
>characterization.
>
>5. Process flow: SRD, plasma ash, silanize, spin, hot
>plate bake.
>
>6. Amount and form: about 100 mL, liquid.
>
>7. Storage: I won't be storing the material at SNF.
>
>8. Disposal: I'm taking unused material with me. I'll
>clean the spin coater with PGMEA.
>
>I can e-mail you the MSDSs of the components of the
>spin-on material but I suspect you may have most or
>all of them already. Please let me know which MSDSs
>you need.
>
>Thanks again,
>
>Mark
>
>PS
>I'm faxing the Agreement form and PO to you now.
>
>
>
>--- John Shott <shott at snf.stanford.edu> wrote:
> > Mark:
> >
> > OK ... I've got what you FAXed me.  I will still
> > need a few other things:
> >
> > 1.  We need a signed user agreement form:
> > http://snf.stanford.edu/Access/AgreementForm.pdf
> >
> > 2. We need a FAXed or hard copy of the PO so that we
> > can set up the
> > account for you within the university billing
> > system.
> >
> > 3. I need significantly more information about this
> > proposed Low-K
> > material including MSDS of the material itself,
> > details of the process
> > flow so that we can determine what tools you plan to
> > use it with, purity
> > levels so that we can determine whether there are
> > any
> > cross-contamination issues, etc.  The full details
> > of what we need are
> > listed at:
> > http://snf.stanford.edu/Materials/NewMatProc.html
> > ... because
> > we are responsible for everything in our facility,
> > we need to know all
> > of those things and I need to be able to provide
> > clear and convincing
> > evidence that this stuff is OK if we're going to
> > bypass the normal
> > biweekly meeting of the Special Materials Committee
> > ...
> >
> > 4. For you most immediate need, am I correct that
> > all you need is spin
> > coating?  Any bake?  If so, what are the bake
> > conditions that you need?
> > How many wafers do you need?
> >
> > Talk to you later
> >
> > John
> >
> >
> > Mark Phillips wrote:
> >
> > >Hi John,
> > >
> > >I have faxed the Project proposal and billing forms
> > to
> > >you. please call me at 510-469-7742 if you have any
> > >questions.
> > >
> > >Thanks,
> > >
> > >Mark
> > >
> > >
> >
> >





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