From edmyers at stanford.edu  Mon Aug  1 15:21:54 2005
From: edmyers at stanford.edu (Ed Myers)
Date: Mon, 01 Aug 2005 15:21:54 -0700
Subject: SpecMat Worksheet, 8/2/05
Message-ID: <6.2.1.2.2.20050801151312.041fe718@edmyers.pobox.stanford.edu>

SpecMat Members,

We have another light agenda for this week, which means we probably don't 
need a meeting.

Old Business:  Abijit has requested Ge processing in the Gasonics, Tylan 
SiGe and AMT etcher.  This was on the last, but I don't have any responses 
to his request.  I've labeled this item as approved, so if there is a 
concern this is the last chance to voice your opinion.

New Business:
1) BCB spinning and curing.  This has been approved in the past.  The new 
portion of the request is dry etching the BCB stopping on gold.  Jim is 
aware of the request and is working on a solution.  Jim, let us know what 
is decided so we can document and approve (or reject the request).

2) Etch InP/InGaAsP/InGaAs with gold in HBr/HNO3/HCl.

If I can get email responses, we won't need to meet tomorrow.

Regards




From riteshj at ee.ucla.edu  Tue Aug  2 15:00:52 2005
From: riteshj at ee.ucla.edu (Ritesh J)
Date: Tue, 2 Aug 2005 15:00:52 -0700 (PDT)
Subject: nickel silicide 
Message-ID: <Pine.GSO.4.58.0508021446431.19525@eelab01.ee.ucla.edu>

Hello

Currently we 3 labmates from UCLA (riteshj, nvgirish, tura) use nickel
silicided wafers (deposition of nickel and then silicide in AG4108) for
the follwoing processes:
1) After nickel silicide, deposit LTO (~5000A)
2) Etch LTO (contact etch, stop at nickel silicide) in AMT etcher
3) Etch Nitride ((stop at nickel silicide) in AMT etcher
4) Deposit Poly (nickel silicide covered with 5000A LTO (right after
LTO)) (?)
5) Poly etch in P5000 after the previous step (silicide is covered)
6) Deposit Aluminum in Gryphon

The first three processes had been previously approved for a labmate who had
worked with nickel silicide. If possible, Can you add Nickel to the
standard metal list ? THank you,

riteshj , tura , nvgirish
(UCLA)


From edmyers at stanford.edu  Fri Aug  5 09:08:04 2005
From: edmyers at stanford.edu (Ed Myers)
Date: Fri, 05 Aug 2005 09:08:04 -0700
Subject: Fwd: nickel silicide 
Message-ID: <6.2.1.2.2.20050805084729.0203e900@edmyers.pobox.stanford.edu>

SpecMat,

I looked up Jun's requested process flow, which occurred before I started 
the Excel file.  It's similar, but not identical to the current group of 
users.  Jun's process is as follows:

Ni dep in SCT - Approved
Anneal AG4108 - Approved using Silicide Tray
Wet Etch of Un-reacted Ni - Approved for WBGeneral in his own 
decontaminated labware
LTO Dep - Approved for the metal side
Contact Opening Etch - AMTETCHER
Al Deposition - Approved for Gryphon with no pre-sputter etch
Al Etch - Approved P5000
Forming Gas Anneal - Approved Tylan forming gas anneal tube

The new components of this process is the introduction of doped poly after 
the contact etches.  Jun's process does not indicate any nitride etches.

I will follow up with Ritesh to get a clearer definition of his process.

Ed


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>Date: Tue, 2 Aug 2005 15:00:52 -0700 (PDT)
>From: Ritesh J <riteshj at ee.ucla.edu>
>To: specmat at snf.stanford.edu
>cc: Ahmet Tura <tura at ee.ucla.edu>, Venkatagirish Nagavarapu <envy at ee.ucla.edu>
>Subject: nickel silicide
>X-Virus-Scanned: by AMaViS Sophie/Sophos
>
>Hello
>
>Currently we 3 labmates from UCLA (riteshj, nvgirish, tura) use nickel
>silicided wafers (deposition of nickel and then silicide in AG4108) for
>the follwoing processes:
>1) After nickel silicide, deposit LTO (~5000A)
>2) Etch LTO (contact etch, stop at nickel silicide) in AMT etcher
>3) Etch Nitride ((stop at nickel silicide) in AMT etcher
>4) Deposit Poly (nickel silicide covered with 5000A LTO (right after
>LTO)) (?)
>5) Poly etch in P5000 after the previous step (silicide is covered)
>6) Deposit Aluminum in Gryphon
>
>The first three processes had been previously approved for a labmate who had
>worked with nickel silicide. If possible, Can you add Nickel to the
>standard metal list ? THank you,
>
>riteshj , tura , nvgirish
>(UCLA)





From pzhang at arri.uta.edu  Tue Aug  9 11:22:51 2005
From: pzhang at arri.uta.edu (Ping Zhang)
Date: Tue, 9 Aug 2005 13:22:51 -0500
Subject: Is Tin(Sn) an approved material?
Message-ID: <200508091828.j79IS9G01468@arrimail2.uta.edu>

Dear SNF staff:

  I checked the materials list but didn't find it.I wonder if Tin is approved to use in the cleanroom,such as evaporation or sputting. 

Thanks.



Best regards, 
  
Ping Zhang
pzhang at arri.uta.edu
2005-08-09




From edmyers at stanford.edu  Tue Aug  9 16:58:17 2005
From: edmyers at stanford.edu (Ed Myers)
Date: Tue, 09 Aug 2005 16:58:17 -0700
Subject: Is Tin(Sn) an approved material?
In-Reply-To: <200508091828.j79IS9G01468@arrimail2.uta.edu>
References: <200508091828.j79IS9G01468@arrimail2.uta.edu>
Message-ID: <6.2.1.2.2.20050809164858.02026e90@edmyers.pobox.stanford.edu>

Ping,

Tin (Sn) is an approved material within SNF.  It falls within the gold 
contaminated material and equipment set.  If you chose to use tin, please 
make sure all your processing (following Sn dep.) is carried out in the 
gold contaminated equipment set.

Regards,
Ed


At 11:22 AM 8/9/2005, you wrote:
>Dear SNF staff:
>
>   I checked the materials list but didn't find it.I wonder if Tin is 
> approved to use in the cleanroom,such as evaporation or sputting.
>
>Thanks.
>
>
>
>Best regards,
>
>Ping Zhang
>pzhang at arri.uta.edu
>2005-08-09





From pbriant at stanford.edu  Fri Aug 12 10:05:14 2005
From: pbriant at stanford.edu (Paul Briant)
Date: Fri, 12 Aug 2005 10:05:14 -0700
Subject: Studying cartilage in SEM
Message-ID: <1123866314.42fcd6ca1ac25@webmail.stanford.edu>

Dear SpecMat committee,
I am interested in using the SEM (S-800) to study pig cartilage samples.  I
am fixing the samples in my own lab, and then critical point drying and
sputter coating them at the medical school.  I would then like to use the
S-800 at your facility to study the samples.  I spoke with James Conway
about the project and he said that using the SEM would be fine, but I was
told I should also email your committee.

Thank you very much for your time,
Paul Briant

-- 
Paul Briant
PhD Student
Stanford University
Durand Bldg. 204, MC: 4038
Stanford, CA 94305
650-736-0808 (lab)
650-814-2882 (cell)


From mtang at snf.stanford.edu  Fri Aug 12 10:23:43 2005
From: mtang at snf.stanford.edu (Mary Tang)
Date: Fri, 12 Aug 2005 10:23:43 -0700
Subject: Studying cartilage in SEM
In-Reply-To: <1123866314.42fcd6ca1ac25@webmail.stanford.edu>
References: <1123866314.42fcd6ca1ac25@webmail.stanford.edu>
Message-ID: <42FCDB1F.6080702@snf.stanford.edu>

Hi Paul --

I'm so glad you wrote!  -- I meant to get back to you much sooner, but 
had lost your contact info.

Not that I really want to turn customers away, but I was wondering if 
you had considered using the Beckman Cell Sciences Imaging Facility  
instead (http://taltos.stanford.edu/).  Although we do have a critical 
point dryer and SEM that would suffice for your needs, we really are 
designed to be a fabrication lab, not an analytical lab.  We completely 
lack the expertise to help you with your samples -- we could train you 
on the tools, but then sample prep (which is, as you probably know, 98% 
of the success in SEMming a biological sample) would be completely up to 
you.  And, you would be sharing with people making devices, so the 
systems are really not set up for biological analysis.  Beckman has a 
critical point dryer and SEM -- and most importantly, experts who know 
how to prep and image your samples.

If there is a reason that you would rather not use the Beckman center, I 
would really like to know, as we generally refer people with biological 
samples there. 

Mary

Paul Briant wrote:

>Dear SpecMat committee,
>I am interested in using the SEM (S-800) to study pig cartilage samples.  I
>am fixing the samples in my own lab, and then critical point drying and
>sputter coating them at the medical school.  I would then like to use the
>S-800 at your facility to study the samples.  I spoke with James Conway
>about the project and he said that using the SEM would be fine, but I was
>told I should also email your committee.
>
>Thank you very much for your time,
>Paul Briant
>
>  
>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




From mtang at snf.stanford.edu  Fri Aug 12 11:30:14 2005
From: mtang at snf.stanford.edu (Mary Tang)
Date: Fri, 12 Aug 2005 11:30:14 -0700
Subject: Studying cartilage in SEM
In-Reply-To: <6.2.1.2.2.20050812103547.03ccb810@rissman.pobox.stanford.edu>
References: <1123866314.42fcd6ca1ac25@webmail.stanford.edu> <42FCDB1F.6080702@snf.stanford.edu> <6.2.1.2.2.20050812103547.03ccb810@rissman.pobox.stanford.edu>
Message-ID: <42FCEAB6.2020405@snf.stanford.edu>

I just spoke with this fellow -- he says that he will be doing the CPD 
at Beckman (good) and SEM here.  He needs a field emission system for 
his work and they do not have one there (??)  Sounds like a valid reason 
to me.  He plans to be using the SEM for only a few weeks and has 
scheduled to be in the next SNF Training class.  I would think that if 
the sample has undergone critical point drying and sputter coating, that 
there's little likelihood of contaminating the SEM, so this should be 
SpecMat-approved.  Sound OK to everyone?

Mary

Paul Rissman wrote:

> thanks, I was going to say it was ok. . .
>
> At 10:23 AM 8/12/2005, you wrote:
>
>> Hi Paul --
>>
>> I'm so glad you wrote!  -- I meant to get back to you much sooner, 
>> but had lost your contact info.
>>
>> Not that I really want to turn customers away, but I was wondering if 
>> you had considered using the Beckman Cell Sciences Imaging Facility
>> instead (http://taltos.stanford.edu/).  Although we do have a 
>> critical point dryer and SEM that would suffice for your needs, we 
>> really are designed to be a fabrication lab, not an analytical lab.  
>> We completely lack the expertise to help you with your samples -- we 
>> could train you on the tools, but then sample prep (which is, as you 
>> probably know, 98% of the success in SEMming a biological sample) 
>> would be completely up to you.  And, you would be sharing with people 
>> making devices, so the systems are really not set up for biological 
>> analysis.  Beckman has a critical point dryer and SEM -- and most 
>> importantly, experts who know how to prep and image your samples.
>>
>> If there is a reason that you would rather not use the Beckman 
>> center, I would really like to know, as we generally refer people 
>> with biological samples there.
>> Mary
>>
>> Paul Briant wrote:
>>
>>> Dear SpecMat committee,
>>> I am interested in using the SEM (S-800) to study pig cartilage 
>>> samples.  I
>>> am fixing the samples in my own lab, and then critical point drying and
>>> sputter coating them at the medical school.  I would then like to 
>>> use the
>>> S-800 at your facility to study the samples.  I spoke with James Conway
>>> about the project and he said that using the SEM would be fine, but 
>>> I was
>>> told I should also email your committee.
>>>
>>> Thank you very much for your time,
>>> Paul Briant
>>>
>>>
>>
>>
>> -- 
>> Mary X. Tang, Ph.D.
>> Stanford Nanofabrication Facility
>> CIS Room 136, Mail Code 4070
>> Stanford, CA  94305
>> (650)723-9980
>> mtang at stanford.edu
>> http://snf.stanford.edu
>>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




From edmyers at stanford.edu  Mon Aug 15 09:41:50 2005
From: edmyers at stanford.edu (Ed Myers)
Date: Mon, 15 Aug 2005 09:41:50 -0700
Subject: SpecMat Logsheet, 8/15/05
Message-ID: <6.2.1.2.2.20050815093352.048db188@edmyers.pobox.stanford.edu>

SpecMat Members,

Again we have very limited number of requests to cover.  If I can get email 
responses, we will not need to hold a meeting.

Here are the three items:

1) Etching BCB on InP/InGaAsP/InGaAs with gold in the PQuest.  Jim is aware 
of the request, but I have not heard anything back so it is still and open 
item and he can not do any processing.  Spinning and curing of BCB has been 
approved in the past.

2) Wet etching of InP/InGaAsP/InGaAs with gold in HBr/HNO3/HCl 
solution.  This is probably OK in the wet bench general, but I don't know 
if there is any solution handling requirements.

3) UCLA's request to extend the nickel processing in to the LTO, AMT 
etcher, poly deposition and P5000 etcher.  I am concerned about the poly 
deposition, especially since we are down to one tube.  Once the second poly 
tube comes up, we could have a clean and a semi-cleanB tube.

Please give me your feedback,

Ed
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From beinnmuir at gmail.com  Mon Aug 15 20:09:22 2005
From: beinnmuir at gmail.com (Beinn Muir)
Date: Mon, 15 Aug 2005 20:09:22 -0700
Subject: SpecMat -- Hydrogel Project Chemicals
Message-ID: <43a49bc805081520092ffb2e14@mail.gmail.com>

Dear Sir / Madam,

I would be very grateful if you could look over my application to use
new chemicals in the SNF. You will find the following documents
attached as PDF files:

SpecMat Hydrogel Application (main application text)
SNF Hydrogel Project Detailed Description 03Aug05 (detailed process
flow with illustrations)
Thioxanthone MSDS
Cyclohexanone MSDS
Relevant literature (four papers)

If you have any further questions then do not hesitate to contact me
at my stanford email address (beinnmuir at stanford.edu). I look forward
to hearing from you soon.

Best regards,
Beinn Muir
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From artyjamo at comcast.net  Tue Aug 16 11:26:25 2005
From: artyjamo at comcast.net (artyjamo at comcast.net)
Date: Tue, 16 Aug 2005 18:26:25 +0000
Subject: MSDS for new photoresists
Message-ID: <081620051826.23834.43022FC7000601DD00005D1A220076018001030E06979B9D0E@comcast.net>

Hello Specmat Committee,


     I would like to bring in three new positive photoresists made by Shin-etsu Micro-science.   They are high viscosity photoresists for doing 30 - 80 um thick lithography.    I am planning on bringing the samples in in 8 oz brown bottles (like we have in the store room)  and storing them in the Flammables cabinet that we have (shelf L)   along with the other photo-resist samples.   My intention is to use these resists to coat my substrates on the Headway spinner   (40 - 80 um thick) and soft bake the resist on the hotplates that are adjacent to the Headway.    I am planning on using the Karl Seuss aligners to expose the wafers,  and then I will develop the patterns at the develp bench using LDD-26W.   

    Disposal and clean up of these materials should follow the standard procedures for most of the positive photoresists - bagging contaminated clean room wipes, foil & empty bottles and putting them in the designated chemical trash bins.  The resists themselves can be dispensed in the chemical carboys for organics in the solvent hoods for disposal.   The used LDD-26W developer containing the resist will go down the drain at the develop bench.   


I'm attaching the MSDS sheets for each of the following resists

SIPR 7120M 20
SIPR 7120M 5
SIPR 9332 BEM 10

Please let me know ASAP if these can be approved for my use at SNF

Much Thanks,

Aleta Jamora

artyjamo at comcast.net
510 378 1602
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From srim at stanford.edu  Tue Aug 16 13:42:19 2005
From: srim at stanford.edu (Seung Rim)
Date: Tue, 16 Aug 2005 13:42:19 -0700
Subject: cured plastic materials
Message-ID: <6.2.1.2.2.20050816133407.01f33770@srim.pobox.stanford.edu>

Hi,

I'll do some jobs with cured plastics on silicon pieces in the lab.
I have pdms, polyurethane, and polyimide in mind but I want to check 
compatibility with machines before my process starting.
First of all, I'll cure all plastics out of the lab and will use only cured 
ones in the lab.
I'll coat Cr on plastics with innotec.
And on top of that, I'll do patterning with yes oven, headway, evalign and 
wetbench in litho area.
After that, I'll etch Cr with Cr-14S in general wetbench.
And I'll etch plastics using drytek1.
So, I need to get confirmation of usng cured pdms, polyurethane and polyimide
with innotec, yes, headway, evalign, wetbench in litho, general wetbench 
and drytek1.
If one or two out of three materials can be used, please let me know.

Thanks,
Seung Rim



From ginel at stanford.edu  Wed Aug 17 11:22:56 2005
From: ginel at stanford.edu (Ginel Hill)
Date: Wed, 17 Aug 2005 11:22:56 -0700 (PDT)
Subject: SU-8 and polyimide in the STS
Message-ID: <Pine.OSX.4.58.0507112010221.3390@Sylla.local>


1.  Contact information:  Ginel Hill, coral login: ginel, 650-387-8208,
ghill at stanford.edu, PI for project: Prof. Beth Pruitt.

2.  Material:  We would like to fabricate and compare pressure-sensing
diaphragms made with two different materials: SU-8 and polyimide.  SU-8 is
an epoxidized bisphenol-A/formaldehyde novolac copolymer that is available
in two different formulations from Microchem.  The original SU-8 series
formulation uses gamma butyrolacetone as a solvent, while the newer SU-8
2000 series uses cyclopentanone as a solvent.

We are interested in using PI-2610, a polyimide manufactured by HD
microsystems in their LX series; SU-8 2, an original series Microchem
formulation; SU-8 2002, a 2000-series Microchem formulation; VM652, a
propylene glycol methyl ether sold as a polyimide adhesion promoter by HD
Microsystems;  and SU-8 developer from Microchem.

Both SU-8 and polyimide are currently allowed in the SNF. However, we
would like permission to use the materials in the process flow attached.

3.  SU-8 Manufacturer: Microchem, 1254 Chestnut Street, Newton MA 02464,
(617)965-5511, http://www.microchem.com.
Polyimide manufacturer: HD Microsystems, Parlin Plant, Cheesecake Rd,
Parlin NJ 08859.  732-613-2278

4.  Reason for request:  We have previously fabricated and tested a
pressure-sensing device constructed from SU-8.  (Please see attached MEMS
paper.)  A 2 um SU-8 layer was used to form a diaphragm that deflects
under pressure, and a 50 um SU-8 layer set the cavity length of a
fabry-perot interferometer formed between the diaphragm and the end of a
fiber optic cable.  The interferometer measures cavity length, which is
affected by pressure-induced deflections of the diaphragm, as well as by
length changes in the 50 um cavity length layer from absorbtion or thermal
expansion.  While retaining a flexible polymer diaphragm in device to
maximize its sensitivity, the device could be improved by use of a
non-polymer material for the cavity length layer that does not swell from
water absorbtion.  Our proposed design incorporates a 50 um Silicon wafer
as the cavity length and fiber sleeve layers but retains a polymer
diaphragm.

5.  Process flow:  See attached run sheet.  Note that the process would
EITHER use sheet 2A for SU-8 OR sheet 2B for polyimide, but not both.
The overall outline is:
1 - Etch alignment marks into a standard Silicon wafer
2 - Deposit an Aluminum release layer
  - Spin and pattern a polymer diaphragm layer of SU-8 OR polyimide
3 - Clean and grow Si02 for hard mask on a separate 50 um Si wafer
  - Bond 50 um wafer to handle wafer using thermocompression bonding
4 - Etch holes through 50 um wafer to see alignment marks on handle wafer
  - Etch 10 um Si in the 50 um wafer to form sleeve layer
5 - Etch cavity holes through 50 um wafer
  - Deposit metal reflector (Cr-Au) on polymer diaphram
6 - Insert fiber, glue, and release devices outside of snf

6.  Amount and Form:  Presumably, one to several 100 mL bottles of each
polymer in a solvent as formulated by the manufacturer.  It is possible we
might experiment with several different formulations.  Additionally, a
bottle of a polyimide adhesion promoter.

7. Storage: polyimide in the freezer in the back area of the clean room;
SU-8, and polyimide adhesion promoter in the solvent storage cabinet in
the clean room.



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From mtang at snf.stanford.edu  Tue Aug 23 11:39:46 2005
From: mtang at snf.stanford.edu (Mary Tang)
Date: Tue, 23 Aug 2005 11:39:46 -0700
Subject: New chemicals
In-Reply-To: <200508231753.j7NHrRRZ002050@smtp1.Stanford.EDU>
References: <200508231753.j7NHrRRZ002050@smtp1.Stanford.EDU>
Message-ID: <430B6D72.2010207@snf.stanford.edu>

Hi Sora --

Thanks, this is pretty much the info we need, in addition to MSDS for 
each of the chemicals.

Although your process is generally do-able, I would strongly recommend 
several changes. The octadecyltrichloroethoxysilane or methoxysilane 
versions of OTS are much safer and less chemically reactive than the 
trichlorosilane version. There are several good, documented processes 
for assembling monolayers using these (the process window is actually 
quite wide.) You don't need to control the moisture in the solvent as 
rigorously, and it lasts a lot longer (when you've opened the bottle of 
the trichlorosilane, you've pretty much ruined what's left.) Also, if we 
could avoid the use of chlorinated solvents (carbon tet and chloroform) 
it would be a lot safer. We don't typically allow chloroform in our lab 
because the TLV's is quite low. 90% ethanol (for the ethoxy- or 
methoxy-silane versions of OTS) works quite well for SAM's.

The safer versions of OTS are available through United Chemical 
Technologies. It's a little more expensive than the trichlorosilane, but 
a lot safer and more reproducible. If you would like to try out the 
safer protocols let me know and we can provide them. Or, you can contact 
UCT -- the technical service people are extremely knowledgeable about SAM's.

If you really need this specific version, let's discuss it.

Thanks,

Mary

Sora Kim wrote:

> Dear Mary,
>
> I am the student who asked how to bring in new chemicals from outside 
> last week.
>
> I am writing up a proposal, but I don ? t know what kind of 
> information that I need to add for storage and disposal sections.
>
> Also, I don ? t know how much I have to describe in detail.
>
> You are much more experienced than I am, so I want to ask you some help.
>
> Can I see you this afternoon? I am available from 1pm to 4:30pm . If 
> you let me know when you are free, I can drop by your office.
>
> Thanks!
>
> Sora Kim
>
> p.s. The attached file is the proposal that I am writing up.
>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




From riteshj at ee.ucla.edu  Thu Aug 25 15:27:51 2005
From: riteshj at ee.ucla.edu (Ritesh Jhaveri)
Date: Thu, 25 Aug 2005 15:27:51 -0700 (PDT)
Subject: Request regarding WbDiff
Message-ID: <Pine.GSO.4.58.0508251523440.6748@eelab01.ee.ucla.edu>

Hello,
	I have wafers which have gone thru  AMTetcher - LAMpoly -
AMTetcher - wbnonmetal (to remove PR). I plan to into tylan nitride next.
During diffusion clean, I cannot go into HF (due to very thin gate oxides
under the gate) and I do not want to oxidise the rest of the exposed
silicon by dipping in H2O2:HCl clean. Is there some way to use
tylannitride by using only piranha clean in wbdiff, or is there another
way ?
thank you,
Ritesh J



From mtang at snf.stanford.edu  Thu Aug 25 16:03:14 2005
From: mtang at snf.stanford.edu (Mary Tang)
Date: Thu, 25 Aug 2005 16:03:14 -0700
Subject: [Fwd: Request regarding WbDiff]
Message-ID: <430E4E32.6000809@snf.stanford.edu>

Hi all --

Ritesh asked this question and I asked him to email SpecMat.  My two 
cents' -- I've no problem with losing the HF dip, but am a little 
uncomfortable about dispensing with the HCL dip...   I wonder...  is 
there is actually any more oxidation of silicon following two piranha 
cleans than there is following a 5:1:1 H2O:HCl:H2O2 dip?  Does anyone 
know?  Think it's worth asking Ritesh to check?

Mary

-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu

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Subject: Request regarding WbDiff
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From shott at snf.stanford.edu  Thu Aug 25 17:21:58 2005
From: shott at snf.stanford.edu (John Shott)
Date: Thu, 25 Aug 2005 17:21:58 -0700
Subject: [Fwd: Request regarding WbDiff]
In-Reply-To: <430E4E32.6000809@snf.stanford.edu>
References: <430E4E32.6000809@snf.stanford.edu>
Message-ID: <430E60A6.1050208@snf.stanford.edu>

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From edmyers at stanford.edu  Mon Aug 29 15:52:25 2005
From: edmyers at stanford.edu (Ed Myers)
Date: Mon, 29 Aug 2005 15:52:25 -0700
Subject: SpecMat Logsheet, 8/29/05
Message-ID: <6.2.1.2.2.20050829155049.04c45818@edmyers.pobox.stanford.edu>

SpecMat Member,

Do to poor response trying to run SpecMat by email, the list has 
grown.  Since I will not be in the office on Tuesday, I hope someone will 
lead Tuesday's meeting.

Regards,
Ed
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From nmehenti at stanford.edu  Tue Aug 30 11:32:43 2005
From: nmehenti at stanford.edu (Neville Mehenti)
Date: Tue, 30 Aug 2005 11:32:43 -0700
Subject: New Chemical Request: V-40000 (Silicone and xylene mixture)
Message-ID: <6.2.1.2.2.20050830083401.036b3260@nmehenti.pobox.stanford.edu>

Hello,
I would like to make a request to bring a new chemical into the cleanroom 
for use in a process.
Below this email is the requested information for this new chemical 
request, as outlined on the SNF website.
Please let me know if there is a problem or if you would like any more 
information.
Thanks very much and hope to hear from you soon.
Regards,
Neville

1.  Name: Neville Mehenti; Coral: mehenti; Tel: (650)723-1669; Email: 
nmehenti at stanford.edu, PI: Prof. Stacey F. Bent

2.  Trade name: V-40000; Common name: Silicone and xylene mixture
Composition: Xylene (52-65%, CAS 1330-20-7), Ethylbenzene (<13%, CAS 
100-41-4), Silicone Elastomer (35%)
The MSDS is attached with this email as a pdf file.

3.  Manufacturer:  Rhodia Silicones
320 West Stanley Avenue, Ventura, CA 93001; Tel: (805)653-5638; url: 
http://www.rhodia-silicones.com
Vendor: Factor II, Inc.
P.O. Box 1339, Lakeside, AZ 85929; Tel: (928)537-8387; url: 
http://www.factor2.com/

4.  The reason I am requesting to bring this material into the lab is 
because I am looking to spin thin (10-20 microns) silicone membranes on a 
silicon-photoresist mold, and then peel them off to serve as components for 
microfluidic devices.  I have been using standard polydimethylsiloxane 
(PDMS), but the membranes are not strong enough to resist tearing during 
later processing steps.  I tried curing a more rigid PDMS by increasing the 
crosslinker/polymer ratio, but I will be later culturing neurons on the 
membrane, and this non-stoichiometric ratio results in cell death through 
the exposed dangling bonds.  This new material (V-40000) has superior 
physical properties (tensile strenght, tear strength, etc.) when compared 
to the PDMS, and is also supplied as a medical-grade product, which should 
render it biocompatible with cell culture.  This new material would allow 
me to make the key component in my integrated microfluidic device for 
neurophysiological studies.

5.  I plan on using this chemical only at the Headway to spin membranes on 
top of my silicon-photoresist molds.  I will pour about 3 milliliters of 
the liquid chemical on each silicon-photoresist mold and spin for 60 
seconds at the desired spin speed.  The molds will then be baked on a hot 
plate for 20 minutes at 75 degrees C.  These wafers will undergo no further 
processing at SNF.

6.  I am requesting to bring in 8 fluid ounces (~240 ml) of the chemical, 
which is a clear, viscous liquid.  Unlike PDMS, the silicone comes in one 
part, so no mixing is required.

7.  I would like to store my chemical at SNF, but would be willing to bring 
in a small vial of the liquid each time I go in the fab if local storage is 
denied for any reason by the Committee.  The material is flammable and 
should not be stored with strong acids, bases, or oxidizing agents.  The 
chemical should be stored with Storage Group L in the yellow solvent cabinet.

8.  There will be excess material collected on aluminum foil at the bottom 
of the Headway after spin coating.  This foil will be wrapped up and sealed 
in a ziploc bag, and like other flammable organics, will then be placed in 
the carboy underneath the Litho wet bench
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From mtang at snf.stanford.edu  Tue Aug 30 12:40:26 2005
From: mtang at snf.stanford.edu (Mary Tang)
Date: Tue, 30 Aug 2005 12:40:26 -0700
Subject: [Fwd: Spec. Mat. request - Chrome mask use at the AMT etcher]
Message-ID: <4314B62A.1020005@snf.stanford.edu>

Hi --

Just forwarding this to SpecMat...

M

-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu

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From: Ofer Levi <levi at snowmass.stanford.edu>
Subject: Spec. Mat. request - Chrome mask use at the AMT etcher
Date: Tue, 30 Aug 2005 12:39:16 -0700
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From eap at gloworm.Stanford.EDU  Wed Aug 31 14:18:58 2005
From: eap at gloworm.Stanford.EDU (Eric Perozziello)
Date: Wed, 31 Aug 2005 14:18:58 -0700 (PDT)
Subject: Request for SpecMat:  Transene Pd etchant
Message-ID: <Pine.GSO.4.44.0508311214300.11194-200000@gloworm.Stanford.EDU>


Hi All,

I have a request for SpecMat from Intel (Rhett Brewer).

1).  ericp at snf, rhettb at snf, for Intel
2).  Chemical is a commercially packaged etchant (MSDS attached)
     The lab uses other Transene etchants (Au, Ni). This one
     is FeCl3 and HCl.
3). TRANSENE COMPANY, INC.
    Danvers Industrial Park
    10 Electronics Avenue
    Phone: 978-777-7860
    Fax: 978-739-5640
    sales at transene.com
4). Purpose is to etch a very thin Pd layer.
    Other simpler etchants have been attempted, but resist integrity
    is problematic.  Transene claims that their etchant will
    not significantly attack resist.
5). Wafers will be in the dirty equipment set at this phase.
    as these are "device" wafers, etching will be performed in
    dedicated quartzware, but the wafers will not return to
    clean equipment.
6). Approximately 1 gallon (or 1 liter) in liquid form.  No mixing
    required.  Light heating (30-40C) may be required, per manufacturer.
7). Storage would be in the Acid chemical passthrough, along with the
    other Transene etchants.
8). Disposal would be similar to Ni etchant:  Collected and tagged
    in a hazardous waste bottle.

Thanks,
-Eric


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\par \hich\af0\dbch\af16\loch\f0 BAKER}{\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0  }{\b\fs24\ul\cgrid0 \hich\af0\dbch\af16\loch\f0 SAF-T-DATA SYSTEM}{\b\fs24\cgrid0 

\par \tab \hich\af0\dbch\af16\loch\f0                                      }{\b\fs16\cgrid0 \hich\af0\dbch\af16\loch\f0 HEALTH          FLAMMABILITY          REACTIVITY             CONTACT

\par }{\b\fs80\cgrid0 \hich\af0\dbch\af16\loch\f0                 }{\b\fs40\cgrid0 \hich\af0\dbch\af16\loch\f0 3           0              2            3

\par }{\b\fs16\cgrid0 \hich\af0\dbch\af16\loch\f0                    \hich\af0\dbch\af16\loch\f0                                                        SEVERE                   NONE                       MODERATE                SEVERE

\par }{\b\fs24\cgrid0 

\par }{\b\fs26\ul\cgrid0 \sect }\sectd \psz1\sbknone\linex0\headery0\colsx221\sectdefaultcl \pard\plain \nowidctlpar\adjustright \fs20\cgrid {\b\fs26\ul\cgrid0 \hich\af0\dbch\af16\loch\f0 Laboratory Protective Equipment: }{\fs26\cgrid0 

\hich\af0\dbch\af16\loch\f0 Goggles & Shield, Lab Coat & Apron, Vent Hood, Proper Gloves.}{\b\fs28\cgrid0 \sect }\sectd \psz1\sbknone\linex0\headery0\sectdefaultcl \pard\plain \nowidctlpar\adjustright \fs20\cgrid {\b\fs26\ul\cgrid0 \sect }\sectd 

\psz1\sbknone\linex0\headery0\sectdefaultcl \pard\plain \nowidctlpar\adjustright \fs20\cgrid {\b\fs26\ul\cgrid0 \hich\af0\dbch\af16\loch\f0 Precautionary Label}{\fs26\ul\cgrid0 \hich\af0\dbch\af16\loch\f0  }{\b\fs26\ul\cgrid0 \hich\af0\dbch\af16\loch\f0 

Statements: }{\b\fs26\cgrid0 \hich\af0\dbch\af16\loch\f0 POISON! DANGER! CAUSES BURNS!

\par 

\par }{\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 MAY BE FATAL IF SWALLOWED OR INHALED }{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Do not get in eyes, on skin, on clothing.

\par \hich\af0\dbch\af16\loch\f0 Do}{\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0  }{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 not breathe vapor. Keep in tightly closed container. Use with adequate}{\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0  }{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 ventilation. Wash thoroughly after handling.

\par 

\par }{\b\fs28\ul\cgrid0 \hich\af0\dbch\af16\loch\f0 SECTION II- HAZARDOUS COMPONENTS

\par }{\fs28\ul\cgrid0 

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls15\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls15\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Components: }{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0                                      }{\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 %                                                  CAS#}{\fs24\cgrid0 

\par }\pard \nowidctlpar\adjustright {\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0         Ferric Chloride FeCl}{\fs24\sub\cgrid0 \hich\af0\dbch\af16\loch\f0 3}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 

:                              30%                                             7705080

\par \hich\af0\dbch\af16\loch\f0         Hydrogen Chloride:                                 3-4%                                            7647-01-0}{\fs28\cgrid0 

\par }{\fs24\cgrid0 

\par \sect }\sectd \psz1\sbknone\linex0\headery0\sectdefaultcl \pard\plain \nowidctlpar\adjustright \fs20\cgrid {\b\fs28\ul\cgrid0 \hich\af0\dbch\af16\loch\f0 SECTION III- PHYSICAL DATA

\par }{\fs24\cgrid0 \sect }\sectd \psz1\sbknone\linex0\headery0\sectdefaultcl {\footer \pard\plain \qc\sl-240\slmult0\nowidctlpar\tqr\tx9927\adjustright \fs20\cgrid {\cgrid0 \hich\af0\dbch\af16\loch\f0 

                                                                                                                                Palladium Etchant TFP         PAGE }{\field{\*\fldinst {\cs17 \hich\af0\dbch\af16\loch\f0  PAGE }}{\fldrslt {\cs17\lang1024 

\hich\af0\dbch\af16\loch\f0 3}}}{\cgrid0 \hich\af0\dbch\af16\loch\f0  

\par }}{\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}\pard\plain \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls14\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls14\adjustright \fs20\cgrid {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Boiling Point}{

\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : N/A                               }{\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Melting Po\hich\af0\dbch\af16\loch\f0 int}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : N/A

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls14\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls14\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Vapor Pressure (mmHg):}{

\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0  N/A           }{\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Vapor Density(air=l):}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0  1.3

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls14\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls14\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Specific Gravity:}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0  1.33

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls14\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls14\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Evaporation Rate}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : N/A

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls14\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls14\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Solubility (H}{\b\fs24\sub\cgrid0 

\hich\af0\dbch\af16\loch\f0 2}{\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 O)}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : Complete (in all portions)

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls14\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls14\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 % Volatiles by Volume}{

\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : 100

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls14\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls14\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Appearance & Odor}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Dark amber-brown liquid with hydrogen chloride odor.}{\fs24\cgrid0 

\par }\pard \nowidctlpar\adjustright {\b\fs28\ul\cgrid0 

\par \hich\af0\dbch\af16\loch\f0 SECTION IV- FIRE AND EXPLOSION HAZARD DATA

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls13\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls13\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Flash Point}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 :  N/A                                                    }{\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 NFPA 704M Rating}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : 3-0-0

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls13\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls13\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Flammable Limits}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Upper - N/A%     Lower- N/A%

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls13\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls13\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Fire Ext

\hich\af0\dbch\af16\loch\f0 inguishing Media}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : Use extinguishing media appropriate for surrounding fire.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls13\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls13\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Special Fire Fighting Procedures}{

\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : Firefighters should wear proper protective equipment and self-contained (positive pressure if available) breathing apparatus with full-face pie\hich\af0\dbch\af16\loch\f0 

ce. Move exposed containers from fire area, if it can be done without risk. Use water to keep  exposed containers cool; do not get water inside containers.  

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls13\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls13\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Unusual Fire & Explosion Hazards}{

\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : Closed containers exposed to heat may explode.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls13\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls13\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Toxic Gases Produced}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Hydrogen chloride, Hydrogen gas.

\par }\pard \nowidctlpar\adjustright {\b\fs24\ul\cgrid0 

\par \hich\af0\dbch\af16\loch\f0 SECTION V- HEALTH HAZARD DATA}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 :

\par \hich\af0\dbch\af16\loch\f0 PEL and TLV listed denote ceiling limit.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls12\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls12\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Threshold Limit Value (TLV/TWA):



\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls12\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls12\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Ferric Chloride (TLV/TWA)}{

\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0  900 mg/M}{\fs24\super\cgrid0 \hich\af0\dbch\af16\loch\f0 3}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0         (FeCl}{\fs24\sub\cgrid0 \hich\af0\dbch\af16\loch\f0 3 }{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 )



\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls10\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls10\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Hydrochloric Acid (TLV/TWA)}{

\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0  7 mg/M}{\fs24\super\cgrid0 \hich\af0\dbch\af16\loch\f0 3 }{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0   (5ppm)  (HCl)

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls10\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls10\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Permissible Exposure Limit (PEL}{

\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 ): 7 mg/M}{\fs24\super\cgrid0 \hich\af0\dbch\af16\loch\f0 3 }{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0   (5ppm)   (HCl)

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls11\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls11\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Toxicity}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 :  LD}{\fs24\sub\cgrid0 \hich\af0\dbch\af16\loch\f0 50 }{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 (ipr-mouse)  (mg/kg)              -40 (HCl)

\par }\pard \nowidctlpar\adjustright {\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0                         LD}{\fs24\sub\cgrid0 \hich\af0\dbch\af16\loch\f0 50 }{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0  (oral-rabbit) (mg/kg)             -900 (HCl)

\par \hich\af0\dbch\af16\loch\f0                         LC}{\fs24\sub\cgrid0 \hich\af0\dbch\af16\loch\f0 50 }{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 (inhl-rat\hich\af0\dbch\af16\loch\f0 -lH) (ppm)                 -3124 (HCl)

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls9\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls9\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Carcinogenicity}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : NTP: No  IARC: No   Z List: No    OSHA reg: No

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls9\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls9\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Effects of Overexposure}{

\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : Inhalation of vapors may cause pulmonary edema, circulatory system collapse, damage to upper respiratory system, \hich\af0\dbch\af16\loch\f0 

collapse. Inhalation of vapors may cause coughing and difficult breathing. Liquid may cause severe burns to skin and eyes.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls9\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls9\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Effects of Ingestion}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Ingestion is harmful and may be fatal. May cause severe burning to mouth and stomach. May cause nausea and v\hich\af0\dbch\af16\loch\f0 omiting.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls9\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls9\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 

Medical Conditions Generally Aggravated By Exposure}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : None identified.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls9\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls9\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Routes of Entry}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Ingestion, inhalation, skin contact and eye contact.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls9\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls9\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Emergency and First Aid Procedures}{

\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : CALL A PHYSICIAN. If swallowed do not induce vomiting; If conc\hich\af0\dbch\af16\loch\f0 ious, give water, milk or milk of magnesia.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls9\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls9\adjustright {\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 

If inhaled remove to fresh air. If not breathing give artificial respiration. If breathing is difficult give oxygen.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls9\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls9\adjustright {\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 

In case of contact immediately flush eyes or skin with plenty of water for at least 15 mi\hich\af0\dbch\af16\loch\f0 nutes while removing contaminated clothing and shoes. Wash clothing before re-use.

\par }\pard \nowidctlpar\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Toxicity test results and safety and health effects are based on the solute}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 .

\par }{\b\fs24\ul\cgrid0 

\par \hich\af0\dbch\af16\loch\f0 SECTION VI- REACTIVITY DATA:

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls7\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls7\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Stability}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Stable                                         }{\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Hazar\hich\af0\dbch\af16\loch\f0 dous Polymerization}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : Will not occur

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls8\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls8\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Incompatibles}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Most common metals, strong bases, metal oxides, amines and carbonates.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls8\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls8\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Decomposition Products}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Hydrogen chloride.

\par }\pard \nowidctlpar\adjustright {\b\fs24\ul\cgrid0 

\par \hich\af0\dbch\af16\loch\f0 SECTION VII- SPILL AND DISPOSAL PROCEDURES}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 :

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls6\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls6\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Steps to be taken in event of spill o

\hich\af0\dbch\af16\loch\f0 r discharge}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 

: Wear self-contained breathing apparatus and full protective clothing. Stop leak if you can do so without risk. Ventilate area. Neutralize spill with soda ash or lime. With clean shovel, carefully place material into clean, dry container and co

\hich\af0\dbch\af16\loch\f0 ver; remove from area. Flush spill area with water.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls5\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls5\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Disposal Procedure}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Dispose in accordance with all applicable federal, state and local environmental regulations. EPP Hazardous waste number: D002 (corrosive waste).

\par }\pard \nowidctlpar\adjustright {\b\fs24\ul\cgrid0 

\par \hich\af0\dbch\af16\loch\f0 SECTION VIII: INDUSTRIAL PROTECTIV\hich\af0\dbch\af16\loch\f0 E EQUIPMENT

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls4\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls4\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Ventilation:}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0  Use general or local exhaust ventilation to meet TLV requirements.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls4\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls4\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Respiratory Protection}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Respiratory required if airborne concentration exceeds TLU. Pt concentrations up to 100 ppm, a chemi\hich\af0\dbch\af16\loch\f0 

cal cartridge respirator with acid cartridge is recommended. Above this level, a self-contained breathing apparatus is recommended.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls4\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls4\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Eye/Skin Protection}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Safety goggles and face shield, uniform, protective suit and acid-resistant gloves are recommended.

\par }\pard \nowidctlpar\adjustright {\b\fs24\ul\cgrid0 

\par \hich\af0\dbch\af16\loch\f0 SECTION IX- STORAGE AND HANDLING PRECAUTIONS 

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls1\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls1\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 SAF-T-DATA}{\b\fs24\super\cgrid0 

\hich\af0\dbch\af16\loch\f0 TM }{\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0  Storage Color Code}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : White

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls1\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls1\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Special Precautions}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Keep container tightly closed. Store on corrosion-proof area.

\par }\pard \nowidctlpar\adjustright {\b\fs24\ul\cgrid0 

\par \hich\af0\dbch\af16\loch\f0 SECTION X- TRANSPORTATION DATA AND ADDITIONAL INFORMATION

\par \hich\af0\dbch\af16\loch\f0 DOMESTIC D.O.T.

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls2\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls2\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Pr\hich\af0\dbch\af16\loch\f0 

oper Shipping Name}{\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 : Ferric Chloride Solution

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls2\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls2\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Hazard Class}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : 8

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls2\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls2\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 UN/NA}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : UN2582

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls2\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls2\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Labels}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Corrosive

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls2\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls2\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Reportable Quantity}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : 5000 lbs.

\par }\pard \nowidctlpar\adjustright {\b\fs24\ul\cgrid0 \hich\af0\dbch\af16\loch\f0 INTERNATIONAL (I.M.O.)

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls3\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls3\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Proper Shipping Name}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : Ferric Chloride Solution

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls3\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls3\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Hazard Class}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : 8

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls3\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls3\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 UN/NA}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 : UN 2582

\par {\pntext\pard\plain\loch\af3\dbch\af16\hich\f3 \'b7\tab}}\pard \nowidctlpar{\*\pn \pnlvlblt\ilvl0\ls3\pnrnot0\pnf3\pnstart1\pnindent360\pnhang{\pntxtb \'b7}}\ls3\adjustright {\b\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 Labels}{\fs24\cgrid0 

\hich\af0\dbch\af16\loch\f0 :\hich\af0\dbch\af16\loch\f0  Corrosive

\par }\pard \nowidctlpar\adjustright {\fs24\cgrid0 \hich\af0\dbch\af16\loch\f0 N/A- Not Applicable or Not Available

\par \hich\af0\dbch\af16\loch\f0 The information published in this Material Safety Data Sheet has been compiled from our experience and data presented in various technical publications. It is the user's responsibility to determine the suitab

\hich\af0\dbch\af16\loch\f0 ility of this information for the adoption of necessary safety precautions. We reserve the right to revise Material Safety Data Sheets periodically as new information becomes available.

\par \hich\af0\dbch\af16\loch\f0                                                                       \hich\af0\dbch\af16\loch\f0                                      M.E. Hecht        June 2002

\par 

\par 

\par 

\par 

\par 

\par }{\cgrid0 

\par }}

From mtang at snf.stanford.edu  Wed Aug 31 16:58:15 2005
From: mtang at snf.stanford.edu (Mary Tang)
Date: Wed, 31 Aug 2005 16:58:15 -0700
Subject: HBr request from John Choi
Message-ID: <43164417.5010204@snf.stanford.edu>

Hi everyone --

We just had a chat with John Choi about the HBr.  I believe it was 
somewhat approved in yesterday's meeting, but thought we should clarify 
some of the previous concerns that have come up with using this stuff.

1.  Storage:  John will have a 500 ml bottle.  It should not come into 
contact with other oxidizing acids, or Br2 gas will result.  The last 
time this was requested, we had EH&S come and take a look at our 
passthrough and give us the official word.  They said that the 
individual slots (where we allow personal chemicals storage) were 
sufficiently isolated so that we could store what would normally be 
considered chemically incompatible materials in adjacent slots.  The 
risk of spillage mixing was nonexistent.  John has agreed to provide 
additional secondary containment that is enclosed and shatterproof, just 
to be sure that no one inadvertently places another small bottle into 
the same storage slot.  He'll also label the slot.  I think these 
precautions should make the storage of HBr reasonably safe.

2.  Use at the bench:  John will be doing this only at the wbgaas 
station.  The usage there is lower and he can be reasonably assured of 
being the only person working there.  Although he is mixing HB2 with a 
strong oxidizer, he is using a strict protocol whereby there is 
sequential dilution before and after mixing.  He will be providing us 
with this protocol and references, so that we can have it for our records.

This dilute HBr/nitric solution is the only mixture that delivers the 
crystal-dependent etch that he needs.  He has already examined a number 
of other etchants, but not found anything that performs to his 
specifications like this mix.  I think this is sufficient grounds to say 
that he doesn't really have an alternative chemistry that would work for 
him.

In summary, I think John can be trusted to use HBr responsibly.  I think 
we should approve his process (with the caveats listed above).  But I 
also think that we should continue to approve use of HBr acid in the lab 
each time it is brought into the lab.

Does anyone have objections to approval?

Thanks,

Mary

-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




From shott at snf.stanford.edu  Wed Aug 31 17:38:13 2005
From: shott at snf.stanford.edu (John Shott)
Date: Wed, 31 Aug 2005 17:38:13 -0700
Subject: HBr request from John Choi
In-Reply-To: <43164417.5010204@snf.stanford.edu>
References: <43164417.5010204@snf.stanford.edu>
Message-ID: <43164D75.6040706@snf.stanford.edu>

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From mtang at snf.stanford.edu  Wed Aug 31 22:54:18 2005
From: mtang at snf.stanford.edu (Mary Tang)
Date: Wed, 31 Aug 2005 22:54:18 -0700 (PDT)
Subject: HBr request from John Choi
In-Reply-To: <43164D75.6040706@snf.stanford.edu>
Message-ID: <Pine.LNX.4.04.10508312250320.15427-100000@snf.stanford.edu>

Hi John --

The waste will be collected locally, as he's etching InP.  The Hbr and
nitric are diluted by 30X and reacted by the time he uses it.  He'll
provide an exact procedure for our reference, but apparently, the mixture
is stable.  If he's collecting localy, it won't be mixed with anything
else.

Mary

On Wed, 31 Aug 2005, John Shott wrote:

> Mary:
> 
> This sounds fine to me ... my only remaining question is related to
> disposal:? Will this go down a "normal" acid drain and into the normal
> neutralizer system?? Is there any chance that this could get dumped into
> the HF tank?? Because that often has a higher percentage of nitric ...
> and sits there for up to 90 days, this would seem to be less than
> wonderful.
> 
> Thanks,
> 
> John
> 
> 
>