[Fwd: Thin film sputtered aluminum nitride wafer processing]

Ed Myers edmyers at stanford.edu
Thu Feb 3 08:46:15 PST 2005


All,

This is Gary's original email concerning AlN processing.  The notes 
indicate we would consider semiclean tools, but not clean 
tools.  Considering the proposed process flow, is there any reason to 
change this stance?

Ed




>-------- Original Message --------
>Subject:        Thin film sputtered aluminum nitride wafer processing
>Date:   Tue, 18 Jan 2005 17:37:05 -0800
>From:   Gary Yama (RTC) <gary.yama at rtc.bosch.com>
>To:     specmat at snf.stanford.edu
>
>
>
>I'm interested in processing sputtered piezoelectric aluminum nitride.
>Film would be deposited at a vendor, photolith, dry etching, wet cleaning, 
>and other processing in CMOS clean equipment.  Assuming the aluminum 
>nitride sputtering tool is CMOS clean, are there any other restrictions on 
>which CMOS clean tool I can use at Stanford?
>
>Are these compatible:
>
>wbdiff
>wbnonmetal
>tylan oxidation
>thermco
>svgcoat, svgdev
>ultratech
>evalign
>drytek2
>p5000
>lampoly
>stsetch
>epi
>gasonics
>
>Thanks - Gary
>
>
>--
>Mary X. Tang, Ph.D.
>Stanford Nanofabrication Facility
>CIS Room 136, Mail Code 4070
>Stanford, CA  94305
>(650)723-9980
>mtang at stanford.edu
>http://snf.stanford.edu





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