silicone free heatsink compound
wibool at stanford.edu
Wed Jun 15 11:28:14 PDT 2005
Thank you very much for a quick reply. I will try to obtain more
information but I am really doubtful that they will give us any further info
because it is a trade secret.
In fact, I have used this compound in the similar applications at other
institutions e.g. UCLA and UC Berkeley before in a semi-clean STS and Unaxis
DRIE machines there. The compound is widely accepted and used there. It
has a much better thermal conduction than PR. Hence, the side walls
profile are extremely good even in an extremely long time etching. Moreover,
some of my friends who work in the industries and research labs e.g. TRW,
Hughes, Northrop Grumman, Jet Propulsion Lab, etc. have told me that they
have used this compound in their labs as well.
Please let me know if you need any further information from you.
Wibool Piyawattanametha, Ph.D.
Departments of Applied Physics, Biological Sciences, and Pediatrics
James H. Clark Center (Bio-X) - Room W080
318 Campus Drive
Stanford, CA 94305
T: (650) 725-4097
F: (650) 724-5805
From: John Shott [mailto:shott at snf.stanford.edu]
Sent: Wednesday, June 15, 2005 11:10 AM
To: Wibool Piyawattanametha
Cc: specmat at snf.stanford.edu
Subject: Re: silicone free heatsink compound
I suspect that I can speak for the entire committee on this ... the
www.techspray.com web site and the MSDS that you provided for us give no
hint that this material is either designed for or accepable for use in
vacuum systems. Moreover, all the MSDS tells us is that < 70% is zinc oxide
... with no hint as to what the other 30+ % contains other than the fact
that those materials are "Trade secrets registered with the state of New
Jersey". That's not enough information to allow us to determine how this
will behave in vacuum, much less in a plasma ...
We will need more information either from the manufacturers or from people
who've used it in similar applications.
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