Laser Annealing outside SNF
mdeal at stanford.edu
Thu Mar 3 09:44:37 PST 2005
Mary's recommendation sounds fine to me. -mike
At 09:42 AM 3/3/2005, Mary Tang wrote:
>Hi all --
>Bipin is really anxious to get going on this and would like an answer, as
>he is trying to determine whether he can send his wafers out for
>processing.... I am not sure how, but I think we missed this in our
>meeting on Tuesday (at least this wasn't discussed while I was there...)
>Was this covered afterward? Mahnaz does not have any notes on this.
>My feeling on this is that the risk of cross-contamination in the gryphon,
>P5000 and FGA anneal is very low. The only possible risk is at any of the
>wet station cleans prior to any of these steps. My suggestion is that we
>ask that all cleans be done at wbgeneral in dedicated labware or at
>wbsilicide, provided all acids are drained/changed. Does anyone else have
>any strong opinions on this?
>Bipin Rajendran wrote:
>>Dear Specmat Members,
>>I am trying to do a modified 410 process, that use laser annealing for
>>activating the source drain regions. I am planning to send my wafers out
>>to a company called AMBP Tech, and below is an email from them telling me
>>about their laser machine.
>>My question is this: After I do the annealing, will I be allowed to come
>>back to the lab and continue with the remaining 410 processing ie. Al
>>deposition in gryphon, P5000 etch and FGA anneal? Or will I have to look
>>for alternate set of non-semi-clean equipments to do these?
>>AMBP Tech's core discipline is in thin film equipment and services and we
>>have used our thin film equipment, located in the same lab as the excimer
>>laser, to deposit various thin films that have been subsequently
>>processed in a clean room to yield working devices.
>>Our applications laboratory environment is relatively clean (no
>>industrial processes are ongoing to produce large amounts of particles),
>>but it is not clean room controlled and the processing will be done under
>>normal conditions. We have not had any customers that have wished to do
>>further processing on the wafers after the laser annealing, only material
>>We have laser processed partially gold coated die previously, the
>>presence of the gold will not affect our ability to process the wafers,
>>though the gold coated part will not absorb many of the 248nm photons and
>>phase transformations of the gold or underlying layers of the gold will
>>have a phase change affected.
>>Thanks very much,
>Mary X. Tang, Ph.D.
>Stanford Nanofabrication Facility
>CIS Room 136, Mail Code 4070
>Stanford, CA 94305
>mtang at stanford.edu
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