Laser Annealing outside SNF
mtang at snf.stanford.edu
Thu Mar 3 09:55:23 PST 2005
Thanks Mike --
Since Ed isn't here, I am going to take the liberty of letting Bipin
know that this is OK, with those caveats.
Michael Deal wrote:
> Mary's recommendation sounds fine to me. -mike
> At 09:42 AM 3/3/2005, Mary Tang wrote:
>> Hi all --
>> Bipin is really anxious to get going on this and would like an
>> answer, as he is trying to determine whether he can send his wafers
>> out for processing.... I am not sure how, but I think we missed this
>> in our meeting on Tuesday (at least this wasn't discussed while I was
>> there...) Was this covered afterward? Mahnaz does not have any notes
>> on this.
>> My feeling on this is that the risk of cross-contamination in the
>> gryphon, P5000 and FGA anneal is very low. The only possible risk is
>> at any of the wet station cleans prior to any of these steps. My
>> suggestion is that we ask that all cleans be done at wbgeneral in
>> dedicated labware or at wbsilicide, provided all acids are
>> drained/changed. Does anyone else have any strong opinions on this?
>> Bipin Rajendran wrote:
>>> Dear Specmat Members,
>>> I am trying to do a modified 410 process, that use laser annealing
>>> for activating the source drain regions. I am planning to send my
>>> wafers out to a company called AMBP Tech, and below is an email from
>>> them telling me about their laser machine.
>>> My question is this: After I do the annealing, will I be allowed to
>>> come back to the lab and continue with the remaining 410 processing
>>> ie. Al deposition in gryphon, P5000 etch and FGA anneal? Or will I
>>> have to look for alternate set of non-semi-clean equipments to do
>>> AMBP Tech's core discipline is in thin film equipment and services
>>> and we have used our thin film equipment, located in the same lab as
>>> the excimer laser, to deposit various thin films that have been
>>> subsequently processed in a clean room to yield working devices.
>>> Our applications laboratory environment is relatively clean (no
>>> industrial processes are ongoing to produce large amounts of
>>> particles), but it is not clean room controlled and the processing
>>> will be done under normal conditions. We have not had any customers
>>> that have wished to do further processing on the wafers after the
>>> laser annealing, only material analysis.
>>> We have laser processed partially gold coated die previously, the
>>> presence of the gold will not affect our ability to process the
>>> wafers, though the gold coated part will not absorb many of the
>>> 248nm photons and phase transformations of the gold or underlying
>>> layers of the gold will have a phase change affected.
>>> Thanks very much,
>> Mary X. Tang, Ph.D.
>> Stanford Nanofabrication Facility
>> CIS Room 136, Mail Code 4070
>> Stanford, CA 94305
>> mtang at stanford.edu
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
mtang at stanford.edu
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