Low Temperature Process for SOI CMOS

Bipin Rajendran bipin at stanford.edu
Mon Oct 31 14:05:15 PST 2005

In response to Mary's email, I have added a figure at the end of my process 
file, briefly showing what I intend to do. Hope that this will help.

----- Original Message ----- 
From: "Mary Tang" <mtang at stanford.edu>
To: "Ed Myers" <edmyers at stanford.edu>
Cc: "Bipin Rajendran" <bipin at stanford.edu>; <specmat at snf.stanford.edu>; 
<mcvittie at cis.Stanford.EDU>
Sent: Monday, October 31, 2005 11:58 AM
Subject: Re: Low Temperature Process for SOI CMOS

> Hi Ed --
> I guess I'm less concerned with the CMP compatibility (since we take 
> wafers
> from Berkeley and San Jose State CMP systems -- which are mixed use --
> although we do require a physical scrubbing and decontamination clean
> before putting back into any clean systems) than the presence of Al wires
> that are underneath the LTO in his devices...  Or did I misread his
> request?
> It seems to me that if there is Al present, we may not want any processing
> at wbsilicide, unless the pots are decontaminated afterward.
> Mary
> Quoting Ed Myers <edmyers at stanford.edu>:
>> SpecMat Members,
>> Bipin is at my office asking questions about Cornell's CMP compatibility
>> with our Clean equipment group.  He is ready to send the wafers out and
>> wants to make sure he can continue processing once they return.  Also, he
>> will be getting wafers thinned at Aptek Industries.  Do we have any
>> history
>> with this company with regards to contamination?
>> I head out on vacation on Wednesday and he is anxious to get a
>> response.  Please voice your opinions.
>> Ed
>> At 11:09 AM 10/31/2005, Bipin Rajendran wrote:
>> >Dear SpecMat Members,
>> >I am attaching a detailed process flow of the Low Temperature CMOS
>> >fabrication steps. I will be happy to answer any further questions.
>> >Thanks
>> >Bipin
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