nickel silicide

Ed Myers edmyers at stanford.edu
Fri Sep 2 11:26:37 PDT 2005


Ritesh, Ahmet and Venatagirish,

SpecMat has reviewed your request for Ni processing.  Since you have 
withdrawn your request for poly deposition on Ni silicide we can approve 
the remainder of your request.

Nickel has been and will remain under the SemicleanB material classification.

Regards,


  At 03:00 PM 8/2/2005, Ritesh J wrote:
>Hello
>
>Currently we 3 labmates from UCLA (riteshj, nvgirish, tura) use nickel
>silicided wafers (deposition of nickel and then silicide in AG4108) for
>the follwoing processes:
>1) After nickel silicide, deposit LTO (~5000A)
>2) Etch LTO (contact etch, stop at nickel silicide) in AMT etcher
>3) Etch Nitride ((stop at nickel silicide) in AMT etcher
>4) Deposit Poly (nickel silicide covered with 5000A LTO (right after
>LTO)) (?)
>5) Poly etch in P5000 after the previous step (silicide is covered)
>6) Deposit Aluminum in Gryphon
>
>The first three processes had been previously approved for a labmate who had
>worked with nickel silicide. If possible, Can you add Nickel to the
>standard metal list ? THank you,
>
>riteshj , tura , nvgirish
>(UCLA)






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