mcvittie at snf.stanford.edu
Tue Aug 1 12:27:31 PDT 2006
Considering that we are getting rid of the P5000 PECVD system and the STS dep
tool is hassel to get to a clean state, I think we should look more careful at
why cured polyimide can't go into the LTO. Although the quality of LTO is not
great at 300C, you can deposit layers good enough for masking at these low
temperatures. Actually polymid layers should good for 400C depositions if fully
cured. Does anyone have data on why cured polymide can not go into a LTO tube.
Ed Myers wrote:
> No poyimide is not allowed in the LTO tube.
> At 02:55 AM 8/1/2006, Rishi Kant wrote:
> >We are in ME342 and we have a question about our process. We have a sandwich
> >of Al-Cured Polyimid-Al and we need to deposit an oxide layer on top of it
> >and then take it to P5000.
> >Is it okay to put these wafers in the LTO tube? The polyimide is fully
> >covered with Al.
> >If this is going to cause too much trouble, we can deposit our oxide using
> >PECVD method. However, we need to do our etches in the P5000 chamber. Will
> >it be okay to do so after coming from the PECVD tube?
> >We are running very close to our class deadline, and would like to run these
> >wafers as soon as possible. A quick response would be very much appreciated.
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