FW: TXRF on 100 mm wafers

Paul Rissman rissman at stanford.edu
Wed Jan 25 14:21:50 PST 2006


Hi All,

I want to have a decision on whether we are going to let Phil into 
the ALD system.  Can we get a consensus?  Do we have a standard 
response to his questions?

Paul

>X-Sieve: CMU Sieve 2.2
>Subject: FW: TXRF on 100 mm wafers
>Date: Wed, 25 Jan 2006 11:19:55 -0700
>X-MS-Has-Attach:
>X-MS-TNEF-Correlator:
>Thread-Topic: TXRF on 100 mm wafers
>thread-index: AcYdTh+CxOsgXznbTQuFlfdAaIUtpgAAV7nAAANR8RAALKQokADy+dMw
>From: <phil_barth at agilent.com>
>To: <rissman at stanford.edu>
>X-OriginalArrivalTime: 25 Jan 2006 18:19:56.0236 (UTC) 
>FILETIME=[F1A5B0C0:01C621DB]
>
>Hi Paul.
>
>Evans Analytical is quoting $400 per wafer for TXRF as per below and 
>would like an unpatterned wafer rather than the patterned wafers 
>which we want to use for ALD. Will an unpatterned platinum layer 
>deposited in the same chamber as our patterned wafer do the job? Or 
>do you need TXRF on each wafer which goes through the ALD system? 
>What elements do you want to check for?
>
>Best regards,
>Phil
>
>
>
>----------
>From: Operations Desk at EAG [mailto:Operations.Desk at eaglabs.com]
>Sent: Friday, January 20, 2006 2:20 PM
>To: phil_barth at agilent.com
>Subject: RE: TXRF on 100 mm wafers
>
>Are you looking for the usual transition metals?  The detection limits
>are going to be poor because we have to reduce power and incident 
>angle to deal
>with the patterning. Generally blanket films with no pattern are 
>appropriate for this technique.
>
>The turnaround time is going to be 3-4 working days from receipt of 
>the sample.
>
>Jim
>
>
>James C. Norberg
>Operations Coordinator, SIMS - OEM Services
>Evans Analytical Group LLC
>810 Kifer Road
>Sunnyvale, CA 94086-5203
>Phone: 408 530 3758
>Fax: 408-530-3501
><mailto:info at cea.com>info at eaglabs.com
><mailto:operations.desk at cea.com>operations.desk at eaglabs.com
>
>
>
>----------
>From: phil_barth at agilent.com [mailto:phil_barth at agilent.com]
>Sent: Thursday, January 19, 2006 5:02 PM
>To: Operations Desk at EAG
>Subject: RE: TXRF on 100 mm wafers
>Hi Jim.
>
>The surface metal is patterned platinum (200 nm) on a titanium 
>adhesion layer (2 nm).
>
>I'll check to see if Stanford will be satisfied with one wafer.
>
>What's your turnaround time?
>
>Best regards,
>Phil Barth
>Agilent Labs
>3500 Deer Creek Road
>Palo Alto, CA 94304
>650-485-5804
>
>
>
>----------
>From: Operations Desk at EAG [mailto:Operations.Desk at eaglabs.com]
>Sent: Thursday, January 19, 2006 3:27 PM
>To: phil_barth at agilent.com
>Cc: Cynthia Gonsalves
>Subject: RE: TXRF on 100 mm wafers
>
>200mm and smaller wafers are $400 each.  What is the surface metal 
>composition and thickness?  Is there a pattern?
>
>Please reply with your complete address and phone numbers.
>
>Jim
>
>
>James C. Norberg
>Operations Coordinator, SIMS - OEM Services
>Evans Analytical Group LLC
>810 Kifer Road
>Sunnyvale, CA 94086-5203
>Phone: 408 530 3758
>Fax: 408-530-3501
><mailto:info at cea.com>info at eaglabs.com
><mailto:operations.desk at cea.com>operations.desk at eaglabs.com
>
>
>
>----------
>From: phil_barth at agilent.com [mailto:phil_barth at agilent.com]
>Sent: Thursday, January 19, 2006 3:15 PM
>To: info
>Subject: TXRF on 100 mm wafers
>Hi folks.
>
>I'm at Agilent Technologies. I want to do some work in the Stanford 
>Nanofab Facility with some wafers which we've prepared at Agilent 
>Labs, and Stanford wants TXRF done on those wafers for cleanliness 
>assurance before they go into the Stanford facility.
>
>Can you please quote me price and timing on doing TXRF on 5 each 100 
>mm diameter silicon wafers with surface metallization?
>
>Thanks,
>Phil Barth
>Agilent Laboratories
>




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