From mtang at stanford.edu Wed Mar 1 14:53:02 2006 From: mtang at stanford.edu (Mary Tang) Date: Wed, 01 Mar 2006 14:53:02 -0800 Subject: Need permision to bringing materials In-Reply-To: <1141065379.440346a3a64c6@webmail.stanford.edu> References: <1141065379.440346a3a64c6@webmail.stanford.edu> Message-ID: <440625CE.7070904@stanford.edu> Hi all -- Mang-Mang is asking about this... I don't think it's a problem, but what do you all think? I don't know if PDMS has officially been approved for innotec before, although I think it may been approved/used in metalica by Claudia Richter. I think if the substrate temperature is kept below 200 C, we're pretty safe. My inclination is to approve this, making sure we notify Jeannie in case anything comes up. What do you all think? Mary Mang-Mang Ling wrote: >My contact Info: > >Mang-mang (mike) Ling (qualified SNF user) >650-725-3144(Lab), >mling at stanford.edu >Bao Group of Chemical Engineering > >Material: > >Si substrate with a thin film of pentacene (organic semiconductor, >stable under high vacumm and elivated substrate temperature) as active layer >for thin film transistors > >Si substrate with a layer of fully cured PDMS >(poly(dimethylsiloxane)) as dielectric layer > >Reason for request: > >Use Innotec evaporator to deposite metal (Ru) >as electrodes to complete the transistor devices > >Process flow: > >In our own lab, frist make fully cured PDMS >(poly(dimethylsiloxane)) layer ( 1 micron) on top of Si wafer; >or use SiO2 layer as dielectric layer > >Then vacuum deposite pentacene thin film (about 50 nm) in our own lab > >Finally, use Innotec Evaporator to deposite Ruthenium >as metal electrodes (about 40 nm) to complete the devices > >Amount and form: > >Pentacene: 40 nm thin film on Si wafer >PDMS: fully cured thin layer on Si wafer > >Storage: >Do not need to store pentacene or PDMS >(Need to store Ru as starter material for metal deposition) > >Disposal: >Do not need to dispose pentacene or PDMS > > > > > > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From jun-fei.zheng at yale.edu Wed Mar 1 16:20:24 2006 From: jun-fei.zheng at yale.edu (jun-fei.zheng at yale.edu) Date: Wed, 01 Mar 2006 19:20:24 -0500 Subject: Fwd: TiN on GaAs for processing in PQuest=> Re: PQust Training Message-ID: <20060301192024.ses5kicb6ogowgsg@www.mail.yale.edu> Ed, Here is the information regarding the need of process in PQuest. Jun-Fei ================================================================================ Jim, Here is more detailed informaton: I am trying to use either BCL3 or Cl2 to etch TiN which is about 1000A. The ideal is to stop it at Ga2O3 that is about 300A under the TiN. The substrate is GaAs. Thanks, Jun-Fei Quoting jz264 at pantheon.yale.edu: > Jim, > > I am trying to etching TiN on GaAs. Jim Kruger and I discussed and he > recommended PQuest. So I am thinking of getting myself trained on this. > > Do you have any existing recipe for TiN etch or if you have any > recommendation > for this? > > I am attaching a paper from AMAT for reference. > > Jun-Fei ----- End forwarded message ----- From edmyers at stanford.edu Thu Mar 2 15:50:55 2006 From: edmyers at stanford.edu (Ed Myers) Date: Thu, 02 Mar 2006 15:50:55 -0800 Subject: Belated LogSheet with comments. Message-ID: <6.0.1.1.2.20060302143807.030f8870@edmyers.pobox.stanford.edu> All, I've completed the update to the SpecMat logsheet and have added a couple more items which popped up this week. 1) Saeroonter Oh: Phosphorosilicafilm 5e20 and Borofilm 100 I've gotten a couple of revisions on her process flow, but it's still missing some detail. I owe a response to try an close the the open items. The critical steps to the process are: silicon substrate clean wet bench diffusion Pre-Diffusion Clean RTA rtaag/ag4108 Put wafer face down on to source wafer (with Si spacers) silicon substrate clean wet bench diffusion Pre-Diffusion Clean LTO deposition LPCVD 400C RECOMMENDATION: The source wafers are not mentioned in the process flow. The request is for the "Clean" RTA since the doping is for the gate level, but I'm more inclined to suggest the Semiclean / silicide AG4100. 2) Chris Earhart: Etch Si Using Polystyrene shpere mask in Drytek 2 Previously we approved the same process and tools for Chris for etching SiO2. RECOMMENDATION: I don't see any reason why this should not be approved. 3) Mang-Mang Ling: Ru evaporation on PDMS Ru is an approved metal for the Innotec. The question comes with running PDMS through the system. As Mary pointed out PDMS is approved for the Metalica. Deposition in the Innotec does not have the sputtering component and have less effect on the PDMS. RECOMMENDATION: I don't see any reason why this should not be approved. 4) Rohit S Shenoy: once the Ni is taken off, can the subsequent wet cleans be done at the wbsilicide or wbmetal (PRX-127/PRS-1000)? This is what we told a user of SemicleanB metals a year ago: "Beakers for Resist strip, PRS 1000 OK for clean wafers. WBMetal for Semiclean metals" If I translate, it seems to say PRS1000 in WBMetal is an approved process. RECOMMENDATION: Previously approved at WBmetal 5) Hideo Iwase: etch silver or aluminum film in PlasmaQuest Jim already stated there is no RIE for silver. The next question, does his sample require him to be in the PQuest for the Al etch or can he use the P5000. RECOMMENDATION: I will find out if his sample is compatible with the P5000. If it is not compatible, approve for the PQuest. Jim, do we need the PQuest communities approval or is this an already established process? 6) Jim Kruger: NanoImprint HardStamp process The request is for Quartz etching using a Cr hardmask in the AMT etcher. The Cr will come from the Innotec or possibly from the Metalica. RECOMMENDATION: This process has been ran in the past, but not fully documented by SpecMat. I feel it's something we have to do to support the Nanoimprint program. 7) Jun-Fei: BCL3 or Cl2 to etch TiN which stops on Ga2O3 in PQuest Jim is this an established Pquest process? Will we raise concern with the fact we will be stopping on Ga2O3? RECOMMENDATION: Seems like a compatible process if we can get PQuest community buy-in. 8) Colby Bellew: Mo etching in Pquest Colby stopped concerning his Mo etching. To date he has tested the CF4, SF6 and C2F6 chemistries. One recommendation was combining F22 with C2F6 (I think). Unfortunately, we do not have a system which is plumbed with both gas sources. His question was, does he put in a SpecMat request to have F22 plumbed to a system or ? RECOMMENDATION: Can we say he has done due diligence in testing fluorine etching and can we approach the PQuest community to allow him to run his Mo etch test. There was a couple of PQuest community members who approved Colby's initial request. -------------- next part -------------- A non-text attachment was scrubbed... Name: SpecMat Logsheet.xls Type: application/octet-stream Size: 148992 bytes Desc: not available URL: From mtang at stanford.edu Fri Mar 3 08:03:13 2006 From: mtang at stanford.edu (Mary Tang) Date: Fri, 03 Mar 2006 08:03:13 -0800 Subject: Belated LogSheet with comments. In-Reply-To: <6.0.1.1.2.20060302143807.030f8870@edmyers.pobox.stanford.edu> References: <6.0.1.1.2.20060302143807.030f8870@edmyers.pobox.stanford.edu> Message-ID: <440868C1.90605@stanford.edu> Sounds good to me. I take it then, that #2, 3, and 6 are now officially approved by SpecMat and #7 by the Pquest community (and now fully logged and documented by SpecMat)? M Ed Myers wrote: > All, > > I've completed the update to the SpecMat logsheet and have added a > couple more items which popped up this week. > > 1) Saeroonter Oh: Phosphorosilicafilm 5e20 and Borofilm 100 > I've gotten a couple of revisions on her process flow, but it's still > missing some detail. I owe a response to try an close the the open > items. The critical steps to the process are: > > silicon substrate clean wet bench diffusion Pre-Diffusion Clean > RTA rtaag/ag4108 Put wafer face down on to source wafer (with Si spacers) > silicon substrate clean wet bench diffusion Pre-Diffusion Clean > LTO deposition LPCVD 400C > > RECOMMENDATION: The source wafers are not mentioned in the process > flow. The request is for the "Clean" RTA since the doping is for the > gate level, but I'm more inclined to suggest the Semiclean / silicide > AG4100. > > 2) Chris Earhart: Etch Si Using Polystyrene shpere mask in Drytek 2 > Previously we approved the same process and tools for Chris for > etching SiO2. > RECOMMENDATION: I don't see any reason why this should not be approved. > > 3) Mang-Mang Ling: Ru evaporation on PDMS > Ru is an approved metal for the Innotec. The question comes with > running PDMS through the system. As Mary pointed out PDMS is approved > for the Metalica. Deposition in the Innotec does not have the > sputtering component and have less effect on the PDMS. > RECOMMENDATION: I don't see any reason why this should not be approved. > > 4) Rohit S Shenoy: once the Ni is taken off, can the subsequent wet > cleans be done at the wbsilicide or wbmetal (PRX-127/PRS-1000)? > This is what we told a user of SemicleanB metals a year ago: "Beakers > for Resist strip, PRS 1000 OK for clean wafers. WBMetal for Semiclean > metals" If I translate, it seems to say PRS1000 in WBMetal is an > approved process. > RECOMMENDATION: Previously approved at WBmetal > > 5) Hideo Iwase: etch silver or aluminum film in PlasmaQuest > Jim already stated there is no RIE for silver. The next question, > does his sample require him to be in the PQuest for the Al etch or can > he use the P5000. > RECOMMENDATION: I will find out if his sample is compatible with the > P5000. If it is not compatible, approve for the PQuest. Jim, do we > need the PQuest communities approval or is this an already established > process? > > 6) Jim Kruger: NanoImprint HardStamp process > The request is for Quartz etching using a Cr hardmask in the AMT > etcher. The Cr will come from the Innotec or possibly from the Metalica. > RECOMMENDATION: This process has been ran in the past, but not fully > documented by SpecMat. I feel it's something we have to do to support > the Nanoimprint program. > > 7) Jun-Fei: BCL3 or Cl2 to etch TiN which stops on Ga2O3 in PQuest > Jim is this an established Pquest process? Will we raise concern with > the fact we will be stopping on Ga2O3? > RECOMMENDATION: Seems like a compatible process if we can get PQuest > community buy-in. > > 8) Colby Bellew: Mo etching in Pquest > Colby stopped concerning his Mo etching. To date he has tested the > CF4, SF6 and C2F6 chemistries. One recommendation was combining F22 > with C2F6 (I think). Unfortunately, we do not have a system which is > plumbed with both gas sources. His question was, does he put in a > SpecMat request to have F22 plumbed to a system or ? > RECOMMENDATION: Can we say he has done due diligence in testing > fluorine etching and can we approach the PQuest community to allow him > to run his Mo etch test. There was a couple of PQuest community > members who approved Colby's initial request. -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at stanford.edu Mon Mar 6 09:54:23 2006 From: mtang at stanford.edu (Mary Tang) Date: Mon, 06 Mar 2006 09:54:23 -0800 Subject: Belated LogSheet with comments. In-Reply-To: <6.0.1.1.2.20060302143807.030f8870@edmyers.pobox.stanford.edu> References: <6.0.1.1.2.20060302143807.030f8870@edmyers.pobox.stanford.edu> Message-ID: <440C774F.8060400@stanford.edu> Hi all -- Mang-Mang would like an official seal of approval, so that he can justify ordering the Ru target, as per his boss' request. So, is it official, and if so, could we send him a note to this effect? Mary Ed Myers wrote: > All, > > I've completed the update to the SpecMat logsheet and have added a > couple more items which popped up this week. > > 1) Saeroonter Oh: Phosphorosilicafilm 5e20 and Borofilm 100 > I've gotten a couple of revisions on her process flow, but it's still > missing some detail. I owe a response to try an close the the open > items. The critical steps to the process are: > > silicon substrate clean wet bench diffusion Pre-Diffusion Clean > RTA rtaag/ag4108 Put wafer face down on to source wafer (with Si spacers) > silicon substrate clean wet bench diffusion Pre-Diffusion Clean > LTO deposition LPCVD 400C > > RECOMMENDATION: The source wafers are not mentioned in the process > flow. The request is for the "Clean" RTA since the doping is for the > gate level, but I'm more inclined to suggest the Semiclean / silicide > AG4100. > > 2) Chris Earhart: Etch Si Using Polystyrene shpere mask in Drytek 2 > Previously we approved the same process and tools for Chris for > etching SiO2. > RECOMMENDATION: I don't see any reason why this should not be approved. > > 3) Mang-Mang Ling: Ru evaporation on PDMS > Ru is an approved metal for the Innotec. The question comes with > running PDMS through the system. As Mary pointed out PDMS is approved > for the Metalica. Deposition in the Innotec does not have the > sputtering component and have less effect on the PDMS. > RECOMMENDATION: I don't see any reason why this should not be approved. > > 4) Rohit S Shenoy: once the Ni is taken off, can the subsequent wet > cleans be done at the wbsilicide or wbmetal (PRX-127/PRS-1000)? > This is what we told a user of SemicleanB metals a year ago: "Beakers > for Resist strip, PRS 1000 OK for clean wafers. WBMetal for Semiclean > metals" If I translate, it seems to say PRS1000 in WBMetal is an > approved process. > RECOMMENDATION: Previously approved at WBmetal > > 5) Hideo Iwase: etch silver or aluminum film in PlasmaQuest > Jim already stated there is no RIE for silver. The next question, > does his sample require him to be in the PQuest for the Al etch or can > he use the P5000. > RECOMMENDATION: I will find out if his sample is compatible with the > P5000. If it is not compatible, approve for the PQuest. Jim, do we > need the PQuest communities approval or is this an already established > process? > > 6) Jim Kruger: NanoImprint HardStamp process > The request is for Quartz etching using a Cr hardmask in the AMT > etcher. The Cr will come from the Innotec or possibly from the Metalica. > RECOMMENDATION: This process has been ran in the past, but not fully > documented by SpecMat. I feel it's something we have to do to support > the Nanoimprint program. > > 7) Jun-Fei: BCL3 or Cl2 to etch TiN which stops on Ga2O3 in PQuest > Jim is this an established Pquest process? Will we raise concern with > the fact we will be stopping on Ga2O3? > RECOMMENDATION: Seems like a compatible process if we can get PQuest > community buy-in. > > 8) Colby Bellew: Mo etching in Pquest > Colby stopped concerning his Mo etching. To date he has tested the > CF4, SF6 and C2F6 chemistries. One recommendation was combining F22 > with C2F6 (I think). Unfortunately, we do not have a system which is > plumbed with both gas sources. His question was, does he put in a > SpecMat request to have F22 plumbed to a system or ? > RECOMMENDATION: Can we say he has done due diligence in testing > fluorine etching and can we approach the PQuest community to allow him > to run his Mo etch test. There was a couple of PQuest community > members who approved Colby's initial request. -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mahnaz at stanford.edu Tue Mar 7 08:38:41 2006 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Tue, 07 Mar 2006 08:38:41 -0800 Subject: [Fwd: Re: lab chemicals] Message-ID: <440DB711.5070504@stanford.edu> -------- Original Message -------- Subject: Re: lab chemicals Date: Mon, 6 Mar 2006 14:25:44 -0800 From: Bo.Liu at Seagate.com To: mahnaz at stanford.edu Mahnaz, Thank you for reminding. Attached please find the MSDS for this chemical. Bob Mahnaz Mansourpour No Phone Info Available 03/06/2006 02:14 PM To Bo.Liu at Seagate.com cc Subject Re: lab chemicals Bo.Liu at Seagate.com wrote: Dear Mahnaz, I have a AZ photoresist P4330-RS. It is just the same as P4620 (you mentioned that I can use it in the lab on the Headway spinner) but thinner and has a surfactant in it to reduce striations in the coat.Would you please to check and make sure that I can use it in the lab? Also, we talked about the chemical cyclotene (BCB), and you need to put a yellow tag on it. I found that we have bottle with yellow tag from you. I will visit the lab tomorrow, and bring the bottle to you. Roughly, I may get to the lab around 9-10AM. Will you be in office at that time? Best regards, Bob Hello Well regarding the resist, you need to send me the MSDS so I can check it out and what will be the process meaning where the wafers will go after the headway. I will in the office tomorrow if not in the office call me to the lab. mahnaz -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: msds-AZ4330-RS.pdf Type: application/octet-stream Size: 437293 bytes Desc: not available URL: From mtang at stanford.edu Tue Mar 7 09:15:19 2006 From: mtang at stanford.edu (Mary Tang) Date: Tue, 07 Mar 2006 09:15:19 -0800 Subject: [Fwd: Re: lab chemicals] In-Reply-To: <440DB711.5070504@stanford.edu> References: <440DB711.5070504@stanford.edu> Message-ID: <440DBFA7.3020404@stanford.edu> Hi Bo -- Mahnaz forwarded your MSDS to the SpecMat committee. Although you may have spoken with Mahnaz about your use of this chemical, I don't think other SpecMat members are up to speed -- and I have a question... This chemical contains glycol ethers, which we would like to minimize in our lab wherever possible. Is there a reason why you need this particular resist instead of, say, the SPR-220-3 or similar formulations which replaced the AZ4620 in our lab? Thanks, Mary Mahnaz Mansourpour wrote: > > > -------- Original Message -------- > Subject: Re: lab chemicals > Date: Mon, 6 Mar 2006 14:25:44 -0800 > From: Bo.Liu at Seagate.com > To: mahnaz at stanford.edu > > > > > Mahnaz, > Thank you for reminding. Attached please find the MSDS for this chemical. > > Bob > > > > > > *Mahnaz Mansourpour * > No Phone Info Available > > 03/06/2006 02:14 PM > > > To > Bo.Liu at Seagate.com > cc > > Subject > Re: lab chemicals > > > > > > > > > > Bo.Liu at Seagate.com wrote: > > Dear Mahnaz, > I have a AZ photoresist P4330-RS. It is just the same as P4620 (you > mentioned that I can use it in the lab on the Headway spinner) but > thinner and has a surfactant in it to reduce striations in the > coat.Would you please to check and make sure that I can use it in the > lab? > Also, we talked about the chemical cyclotene (BCB), and you need to > put a yellow tag on it. I found that we have bottle with yellow tag > from you. I will visit the lab tomorrow, and bring the bottle to you. > Roughly, I may get to the lab around 9-10AM. Will you be in office at > that time? > Best regards, > Bob > Hello > > Well regarding the resist, you need to send me the MSDS so I can check > it out and what will be the process meaning where the wafers will go > after the headway. > > I will in the office tomorrow if not in the office call me to the lab. > > mahnaz > > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mahnaz at stanford.edu Tue Mar 7 10:40:29 2006 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Tue, 07 Mar 2006 10:40:29 -0800 Subject: [Fwd: Re: lab chemicals] In-Reply-To: <440DBFA7.3020404@stanford.edu> References: <440DB711.5070504@stanford.edu> <440DBFA7.3020404@stanford.edu> Message-ID: <440DD39D.9060808@stanford.edu> Mary Tang wrote: > Hi Bo -- > > Mahnaz forwarded your MSDS to the SpecMat committee. Although you may > have spoken with Mahnaz about your use of this chemical, I don't think > other SpecMat members are up to speed -- and I have a question... > This chemical contains glycol ethers, which we would like to minimize > in our lab wherever possible. Is there a reason why you need this > particular resist instead of, say, the SPR-220-3 or similar > formulations which replaced the AZ4620 in our lab? > > Thanks, > > Mary > > Mahnaz Mansourpour wrote: > >> >> >> -------- Original Message -------- >> Subject: Re: lab chemicals >> Date: Mon, 6 Mar 2006 14:25:44 -0800 >> From: Bo.Liu at Seagate.com >> To: mahnaz at stanford.edu >> >> >> >> >> Mahnaz, >> Thank you for reminding. Attached please find the MSDS for this >> chemical. >> >> Bob >> >> >> >> >> >> *Mahnaz Mansourpour * >> No Phone Info Available >> >> 03/06/2006 02:14 PM >> >> >> To >> Bo.Liu at Seagate.com >> cc >> >> Subject >> Re: lab chemicals >> >> >> >> >> >> >> >> >> >> Bo.Liu at Seagate.com wrote: >> >> Dear Mahnaz, >> I have a AZ photoresist P4330-RS. It is just the same as P4620 (you >> mentioned that I can use it in the lab on the Headway spinner) but >> thinner and has a surfactant in it to reduce striations in the >> coat.Would you please to check and make sure that I can use it in the >> lab? >> Also, we talked about the chemical cyclotene (BCB), and you need to >> put a yellow tag on it. I found that we have bottle with yellow tag >> from you. I will visit the lab tomorrow, and bring the bottle to you. >> Roughly, I may get to the lab around 9-10AM. Will you be in office at >> that time? >> Best regards, >> Bob >> Hello >> >> Well regarding the resist, you need to send me the MSDS so I can >> check it out and what will be the process meaning where the wafers >> will go after the headway. >> >> I will in the office tomorrow if not in the office call me to the lab. >> >> mahnaz >> >> > > I am writing this from Bob's behalf , He will take about 40 ml of the P4330-RS resist in the lab . He will use headway and will take the rest of the chemicals including the cyclotene family back to his lab. Mary and I explained to him why we have eliminated glycol ether from lab. mahnaz From amf at amfitzgerald.com Tue Mar 7 11:47:28 2006 From: amf at amfitzgerald.com (Alissa M. Fitzgerald) Date: Tue, 7 Mar 2006 11:47:28 -0800 Subject: have any SOGs been approved for use in SNF? Message-ID: <001401c6421f$f7eb7320$6401a8c0@minicat> Hello SpecMat, I was wondering, have any spin-on-glasses or dielectrics been approved for use at SNF? If so, which brands, and in which pieces of equipment? Thanks and Best regards, Alissa -------------- next part -------------- An HTML attachment was scrubbed... URL: From kevhuang at stanford.edu Tue Mar 7 13:37:22 2006 From: kevhuang at stanford.edu (Huang Kevin) Date: Tue, 7 Mar 2006 13:37:22 -0800 Subject: PVDF allowed? Message-ID: <93586f8c0603071337o41bf1d0frd87748a86a60027b@mail.gmail.com> Hi, Is PVDF (Polyvinylidene fluoride) allowed in the clean equipments or any equipments at all? Thanks. Kevin -- ================================== Kevin Huang Ph.D. Student, Peumans Group Stanford Organic Electronics Lab Dept. of Electrical Engineering Email: kevhuang at stanford.edu Phone: (650) 725-6924 ================================== -------------- next part -------------- An HTML attachment was scrubbed... URL: From mtang at stanford.edu Wed Mar 8 15:03:46 2006 From: mtang at stanford.edu (Mary Tang) Date: Wed, 08 Mar 2006 15:03:46 -0800 Subject: PVDF allowed? In-Reply-To: <93586f8c0603071337o41bf1d0frd87748a86a60027b@mail.gmail.com> References: <93586f8c0603071337o41bf1d0frd87748a86a60027b@mail.gmail.com> Message-ID: <440F62D2.10005@stanford.edu> Hi Kevin -- I think it would be helpful to have a SpecMat request describing what you'd like to do. PVDF has been used in the lab before, but as it's a polymer, there's a limited set of equipment that it can be used in (we don't want it in furnaces, for example.) The equipment would depend on cleanliness level in terms of metal contaminants. Medical grade PVDF, for example, is sterile, but has metal contaminants which make it unacceptable for electronics. If you have a process flow in mind and a spec sheet for the material you'd like to use, we can help you build a compatible process from there. Does that help? Mary Huang Kevin wrote: > Hi, > Is PVDF ( Polyvinylidene fluoride) allowed in the clean equipments > or any equipments at all? > > Thanks. > > Kevin > > -- > ================================== > Kevin Huang > Ph.D. Student, Peumans Group > Stanford Organic Electronics Lab > Dept. of Electrical Engineering > Email: kevhuang at stanford.edu > Phone: (650) 725-6924 > ================================== -- Mary X. 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Thanks, Christy S. - Currently 186 lbs Order online securely from our website http://008.sharphoodia.com (A sample is available at no cost to you) keep out of this promotional campaign? pls click the remove link at our website, and enter your id there From mahnaz at stanford.edu Mon Mar 13 11:28:48 2006 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Mon, 13 Mar 2006 11:28:48 -0800 Subject: Chem label In-Reply-To: References: Message-ID: <4415C7F0.9030304@stanford.edu> Xu, Hong wrote: > Hi Mahnaz, > > I'm going go to be in SNF this afternoon for the SEM training. I'd > like to know if you get a chance to check out the JSR NFR107 resist I > left for your approval last week. As I mentioned that I used this one > in SNF three years ago. When I could get the chem label to bring it in? > > Let me know if you need more info. > > Thanks, > Hong > 650-864-7371 Hi Hong, Sorry for the delay. Yes, you are approved, please use headway and follow all the instruction you recently have been trained for. If you do have the MSDS in email format please send i a copy of it to specmat or me. mahnaz -------------- next part -------------- An HTML attachment was scrubbed... URL: From edmyers at stanford.edu Mon Mar 13 15:46:21 2006 From: edmyers at stanford.edu (Ed Myers) Date: Mon, 13 Mar 2006 15:46:21 -0800 Subject: SpecMat Logsheet, March 14,02006 Message-ID: <6.0.1.1.2.20060313153306.034f07c0@edmyers.pobox.stanford.edu> SpecMat Members, There is a conflict between the SpecMat meeting and Paul's All hands meeting for tomorrow. Between the meeting conflicts and the open SpecMat items, I don't think we need to meet. This is a little risky, since I only heard from one member concerning the items from two weeks ago. By default, I went with the recommendations. I will do the same with these items, if I don't hear any complaints by the end of the week. Carry Over Items. >1) Saeroonter Oh: Phosphorosilicafilm 5e20 and Borofilm 100 >I've gotten a couple of revisions on her process flow, but it's still >missing some detail. I owe a response to try an close the the open >items. The critical steps to the process are: > >silicon substrate clean wet bench diffusion Pre-Diffusion Clean >RTA rtaag/ag4108 Put wafer face down on to source wafer (with Si spacers) >silicon substrate clean wet bench diffusion Pre-Diffusion Clean >LTO deposition LPCVD 400C > >RECOMMENDATION: The source wafers are not mentioned in the process >flow. The request is for the "Clean" RTA since the doping is for the gate >level, but I'm more inclined to suggest the Semiclean / silicide AG4100. RECOMMENDATION 2: Approve the process flow for the AG4100 or the rtaag, but no the 4108. This was proposed to the user earlier, but I did not get a response. New Items 1) Colby Bellow: Mo etch in PQuest using Cl. I never received a response from you about the fluorine etch suggestions that you made. Again, I noticed that F-22 is available to the Dryteks but I could not find F-124 available on any gold contaminated machines. Is this correct? Is it somewhere available? Can you recommend some etch chemistries? CF4 is not currently available to drytek4. Should we try CF4 with F-22? RECOMMENDATION: Approve one session on the PQuest for testing the Cl etch. Jim, will this meet with the PQuest communities approval? 3) Kevin Huang: Is PVDF (Polyvinylidene fluoride) allowed in the clean equipments or any equipments at all? 3/8/06: Mary requested process flow information. RECOMMENDATION: Waiting on more specific process information, since the request was to vague. 4) Ben Chui: Enclosed is a report for a TXRF analysis recently done at Charles Evans (aka Evans Analytical Group) for a material that we'd like to get approved for use inside SNF. The material in question is aluminum nitride (AlN); the wafer that was analyzed also had a layer of Molybdenum (Mo). Since we are trying to develop etches for the AlN, we can't predict exactly which pieces of equipment we're going to want to use in SNF yet. My best guess at this point on a possible equipment set is drytek1/2, P5000 and the MRC; and one of the wetbenches (wbmetal; wbsilicide; or wbgeneral). Maybe you can advise us as to which of the equipment is suitable based on your evaluation of the TXRF report. 3/16/06, email: From your data you have one Copper reading of 156?9 E-10and an iron reading of 97?6 E10, which is just above the Semiclean threshold. If your samples can go through a pre-diffusion type clean we maybe able to lower the metal contamination levels to get your samples in to the P500 and Drytek 1 and the WBsilicide and WBmetal. Of course your samples can go in to any of the gold contaminated equipment. RECOMMENDATION: I emailed our cleanliness guidelines. We should wait for Ben's response and or concerns. -------------- next part -------------- A non-text attachment was scrubbed... Name: SpecMat Logsheet.xls Type: application/octet-stream Size: 153088 bytes Desc: not available URL: From mtang at stanford.edu Mon Mar 13 16:15:49 2006 From: mtang at stanford.edu (Mary Tang) Date: Mon, 13 Mar 2006 16:15:49 -0800 Subject: material In-Reply-To: <1142269471.4415a61f7e485@webmail.stanford.edu> References: <1140801487.43ff3fcf41957@webmail.stanford.edu> <6.2.5.6.2.20060224132600.01d68488@stanford.edu> <1140824383.43ff993f426de@webmail.stanford.edu> <43FF9F25.1070003@stanford.edu> <1142269471.4415a61f7e485@webmail.stanford.edu> Message-ID: <44160B35.3050701@stanford.edu> Hi Mike -- Sorry for the delay. I believe it was just officially approved, but there may be a couple of things you will probably want to consider before proceeding. I was just speaking with Jim Kruger, another labmember here who has worked with Ru and who is also embarking on a project with pentacene... He says that his handbook indicates that ebeam evaporation of Ru is probably not a good idea. He has experience with sputtering in Metalica, however, and says it works, but that the nonuniformity is about 30%. He suggests that it's probably better to use metalica anyway, since it's likely to run at a lower dep temperature than innotec, which might be important for pentacene. Jim says he'd be glad to talk with you about Ru (especially its toxiic oxides, which you have to watch for in your processing.) And as he's just starting to work with pentacene, he would appreciate information on this material as well. Jeannie Perez, I'm sure, also has some specific info about Ru processing from her notes. Could you please speak with both of them before you decide what kind of target or source to order? And please do let us (Jeannie and SpecMat) know what you find. Thanks, Mary Mang-Mang Ling wrote: >Hi Mary: > > Any words from the committee yet? Thanks. > > --- Sincerely, Mike > >Quoting Mary Tang : > > > >>Hi Mike -- >> >>As we discussed, please do send a SpecMat request, just to make sure we >>close the loop on this. In my own, personal opinion, these things >>should be fine -- pentacene is fine, as long as any solvents have been >>removed; cured PDMS is generally fine, as long as temperatures don't get >>too hot. (I'm afraid I don't know and can't say anything about Ru in >>the innotec.) But other SpecMat committee members should weigh in on >>this as well. Please submit a standard SpecMat request, using the >>questions here as a guideline: >>http://snf.stanford.edu/Materials/NewMatProc.html >> >>Do you plan to deposit pentacene in your own lab? >> >>Mary >> >>Mang-Mang Ling wrote: >> >> >> >>>Hi Jeannie: >>> >>>I've just talked with Dr. Mary Tang. She told me that organic >>>semiconductors such is pentacene is fine for Innotech, so is cured PDMS. >>>Just want to get your opionion, too. If it were OK with you, then I'll >>>order Ru (7cc) as starter material, and get help from you to be trained. >>>Thanks. >>> >>>--- Sincerely, Mike >>> >>>Quoting Jeannie Perez : >>> >>> >>> >>> >>> >>>>Hi, >>>>Give me a specific name of the organic film. You can use photo resist >>>>as long as it is hardbaked prior to deposition, you can use >>>>polyimide tape (single sided paste) or Kapton tape ( double sided >>>>paste). >>>>Let me know if you have any question or just stop by my office. >>>>Regards, >>>>Jeannie >>>>At 09:18 AM 2/24/2006, you wrote: >>>> >>>> >>>> >>>> >>>>>Hi Jeannie: >>>>> >>>>>For Ru metal deposition,can we use substrates with organic >>>>>semiconductor films or PDMS in the Innotec >>>>>evaporator? Thanks. >>>>> >>>>>--- Sincerely, Mike >>>>> >>>>> >>>>> >>>>> >>>> >>>> >>> >>> >>> >>> >>-- >>Mary X. Tang, Ph.D. >>Stanford Nanofabrication Facility >>CIS Room 136, Mail Code 4070 >>Stanford, CA 94305 >>(650)723-9980 >>mtang at stanford.edu >>http://snf.stanford.edu >> >> >> >> >> > > > > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From zhiyuz at slac.stanford.edu Tue Mar 14 14:13:20 2006 From: zhiyuz at slac.stanford.edu (Zhang, Zhiyu) Date: Tue, 14 Mar 2006 14:13:20 -0800 Subject: TiO2 coating in PQuest Message-ID: Hi, I am planning etching TiO2 thim film coating on Silicon using PQuest. The coating was conducted by Lance Goddard Associates. The sputtering target is TiO2 provided by Process Materials Inc. Please find attahced target spec sheet. Could you please let me know if I can use PQuest with this coating? Thank you very much. ++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++ Zhiyu ZHANG (Jack) Stanford Linear Accelerator Center, M/S 26, Menlo Park, CA 94025 Tel: 650-861-7575 (M) 650-926-3202 (Office) E-mail: ZHIYUZ at SLAC.STANFORD.EDU ++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++ -------------- next part -------------- A non-text attachment was scrubbed... Name: TiO2 cert..pdf Type: application/octet-stream Size: 1771567 bytes Desc: TiO2 cert..pdf URL: From mtang at stanford.edu Wed Mar 15 09:26:06 2006 From: mtang at stanford.edu (Mary Tang) Date: Wed, 15 Mar 2006 09:26:06 -0800 Subject: Prof. Saraswat and nitride? Message-ID: <44184E2E.4080700@stanford.edu> Hi everyone -- I heard vague comments about a request from Krishna about running wafers with nitride... Not that I really need to know the details if there was a quorum that approved this, but could we get the details of the request/what-was-done in writing for our Specmat records? (i.e., where the film was from, cleans done here, process staff notified, equipment used, and post-equipment cleanup, if any, or any other considerations...) Thanks, Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From chaseonline at chaseonline.chase.com Fri Mar 17 16:55:33 2006 From: chaseonline at chaseonline.chase.com (Chase Card Services Online Services Team) Date: 18 Mar 2006 00:55:33 -0000 Subject: Unlock and renew your account Message-ID: <20060318005533.16340.qmail@host369.ipowerweb.com> An HTML attachment was scrubbed... URL: From praveen at arri.uta.edu Fri Mar 17 19:15:06 2006 From: praveen at arri.uta.edu (Praveen P.S.) Date: Fri, 17 Mar 2006 21:15:06 -0600 Subject: Gold-Tin Alloy Message-ID: <000501c64a3a$283af970$429f6e2a@praveenps> Dear Sir/Madam, Following is request to use Gold-Tin Alloy in metallica sputter system: Name: Praveen Pandojirao-Sunkojirao Coral: praveen Phone: 817-368-2747 Email: praveen at arri.uta.edu PI: Woo Ho Lee Material: Gold-Tin alloy Vendor: Indium Corporation (www.indium.com) Reason for request: This is an alloy for the sputtering system. Direct alloy deposition can be best done through sputtering. This is not available in SNF. Process flow: Sputter the Gold-Tin alloy using metallica. Amount of material: 1 inch diameter by 0.125 inch thick solid target Storage: Will not store at SNF Disposal: Will dispose back in The University of Texas at Arlington Please email me if you need more information. Thanks, Praveen -------------- next part -------------- An HTML attachment was scrubbed... URL: From tony8392 at tom.com Sun Mar 19 10:24:50 2006 From: tony8392 at tom.com (tony) Date: Mon, 20 Mar 2006 02:24:50 +0800 Subject: tooling mold Message-ID: Dear lady/sir , I'm Tony Tang/marketing manager,from centermold company. I am very glad to visit your web site ,I think your company is a leader in this field,by taking this chance,I would like introduce our service to you,we are very interest in cooperating with you. We are a mold maker and molding parts provider in shenzhen of china,we have very strict ISO9001 quality control system,It insure the mold and products'quality.Our engineer and artificer have rich experience on mold designing and mold making,we always make mold flow analysis for the product before designing and making,and we send the mold drawing to customer for approve. 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Very sincerely yours Centermold co. Tony Tang/Marketing Manager Tel: 86755-83925476 Fax: 86755-83925476 E-mail:centermold at 163.com www.centermold.com From fjaeckel at stanford.edu Mon Mar 20 10:09:11 2006 From: fjaeckel at stanford.edu (Frank Jaeckel) Date: Mon, 20 Mar 2006 10:09:11 -0800 Subject: material approval Message-ID: <1142878150.441eefc70116b@webmail.stanford.edu> Dear SpecMat-Commitee, as I understand from the SNF webpage I do need approval for ITO substrates as well as for quartz cover slips not obtained from the SNF stockroom. Therefore, please find attached a pdf file of my approval request. Please let me know if you wish further documentation or information. I would be happy if a decision could be made very soon. Sincerely, Frank Jaeckel -- Dr. rer. nat. Frank J?ckel mail address: Department of Chemistry, M/C 5080 333 Campus Drive mailbox #74 Stanford University, Stanford, CA 94305-5080 street address: 369 North-South Mall, Stauffer I, Room 15 Stanford University, Stanford, CA 94305-5080 phone: +1-650-724-4052/51 (office/lab) fax: +1-650-725-0259 (indicate mailbox #74) e-mail: fjaeckel at stanford.edu and frank_jaeckel at web.de internet: http://www.stanford.edu/~fjaeckel/ -------------- next part -------------- A non-text attachment was scrubbed... Name: ProcessRequestJaeckel.pdf Type: application/pdf Size: 13336 bytes Desc: not available URL: From mtang at stanford.edu Mon Mar 20 10:22:11 2006 From: mtang at stanford.edu (Mary Tang) Date: Mon, 20 Mar 2006 10:22:11 -0800 Subject: material approval In-Reply-To: <1142878150.441eefc70116b@webmail.stanford.edu> References: <1142878150.441eefc70116b@webmail.stanford.edu> Message-ID: <441EF2D3.3000508@stanford.edu> Hi Frank -- I'm afraid we do need to update our SNF web pages... What you propose is already approved, since you are using "gold" equipment (I take it you'll be using metalica or innotec for Cr/Au deposition) and ITO is an approved film. Thanks for following through! Mary Frank Jaeckel wrote: >Dear SpecMat-Commitee, > >as I understand from the SNF webpage I do need approval for ITO substrates >as well as for quartz cover slips not obtained from the SNF stockroom. >Therefore, please find attached a pdf file of my approval request. > >Please let me know if you wish further documentation or information. > >I would be happy if a decision could be made very soon. > >Sincerely, >Frank Jaeckel > > > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mahnaz at stanford.edu Mon Mar 20 14:00:25 2006 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Mon, 20 Mar 2006 14:00:25 -0800 Subject: material approval In-Reply-To: <1142878150.441eefc70116b@webmail.stanford.edu> References: <1142878150.441eefc70116b@webmail.stanford.edu> Message-ID: <441F25F9.6020105@stanford.edu> Frank Jaeckel wrote: >Dear SpecMat-Commitee, > >as I understand from the SNF webpage I do need approval for ITO substrates >as well as for quartz cover slips not obtained from the SNF stockroom. >Therefore, please find attached a pdf file of my approval request. > >Please let me know if you wish further documentation or information. > >I would be happy if a decision could be made very soon. > >Sincerely, >Frank Jaeckel > > > Hi Frank I see that you have headway in your process flow , just you know I do have a chuck especially designed for Laurell another manual dispenser. You can always try that if you, I think you will get much better uniformity. mahnaz From eric.pop at intel.com Mon Mar 20 18:44:02 2006 From: eric.pop at intel.com (Pop, Eric) Date: Mon, 20 Mar 2006 18:44:02 -0800 Subject: Etching of TiX Message-ID: <5E53FC6F589F414D8A951F3B5E5DE2D106797504@scsmsx403.amr.corp.intel.com> Dear SpecMat: I'm a new user here, so this may be a na?ve question (please forgive me). I'm an Intel Researcher-in-Residence working with Profs. Saraswat and Philip Wong. I need to bring in films of Ti alloys from Intel and etch them within SNF -- these are thin (~100nm) blanket Ti alloys on thick (~500nm) thermal oxide on square pieces from Intel's 8" wafers. Pretty simple, so far. One of the films is TiN, which should be no problem in SNF. The other is "TiX", a Titanium alloy with element "X" which unfortunately I cannot disclose. I can say that "X" is a material commonly found in SNF, and it's not Au. Could you advise on how to proceed about bringing this film and patterning it on wafer pieces in SNF (Intel tells me that TiX will etch with the same process as TiN). I'm sorry this is such an odd request, but I'm sure (or I hope) you've heard worse! Thanks in advance. -Eric epop at snf 650.387.3501 From alex at ar-int.com Mon Mar 20 17:30:19 2006 From: alex at ar-int.com (Alex Steele) Date: Mon, 20 Mar 2006 17:30:19 -0800 Subject: New system added and more info for the Agilent liquidation! Message-ID: <08f101c64c98$00e3d8f0$6401a8c0@Alex> Agilent liquidation EQUIPMENT ADDED Asset Reliance International, LLC in conjunction with Cowan Alexander LLC Agilent Technologies Liquidation of 340,000 sq. ft. Micro and Nanoscale Molecular Technologies Lab in Palo Alto, California A SECOND MOCVD SYSTEM HAS JUST BEEN ADDED TO THE LIQUIDATION SALE! Liquidation: Going on now through April 30th** Auction: May 2006 (date to be announced) Just added! OMSW vertical MOCVD reactor - click the link below to see more http://www.ar-int.com/Agilent_liquidation_photos_1.htm Items also available immediately include (descriptions have been updated, please check photo pages for more information) : a.. Kurt Lesker Sputter Deposition System b.. Varian MBE Generation II Systems c.. Karl Suss MA56 Mask Aligner d.. Suss Microtec MJB4 Mask Aligner (2005 vintage) e.. CHA SE1000 RAP Evaporator (2003 vintage) f.. Hitachi S800 SEM g.. Swancore/Emcore 3200 GaN MOCVD System h.. Jeol JEM 200CX TEM/SEM i.. Cameca IMS 4F SIMS j.. ASML PAS 2500/40 i Line Stepper k.. Oxford ECR/Plasma RIE System l.. OMSW MOCVD reactor system Inspection / Preview: By appointment only. Only 24 hours notice required for inspection! Contact Asset Reliance Intl., ph: 888 505-0755, Alex Steele - ext. 1 or Joe Samaripa - ext. 2 **Please note terms of sale recently posted. All offers must be submitted by April 7th for items offered at the pre-auction liquidation sale. Please see website for complete details. (All Items Subject to Availability and Prior Sale) Please check our website at www.ar-int.com/auction_calendar.htm for all updated information and photos. Asset Reliance International, LLC 888 505-0755 888-505-0755 e fax email: info at ar-int.com website: www.ar-int.com Offices in Northern and Southern California, Colorado and Texas, affiliates in Europe and Asia ARI respects your online time and privacy. If you do not want to receive emails from ARI in the future, please click here or reply to this message with REMOVE in the subject line. -------------- next part -------------- An HTML attachment was scrubbed... URL: From nordlund at slac.stanford.edu Mon Mar 20 20:00:43 2006 From: nordlund at slac.stanford.edu (Dennis Nordlund) Date: Mon, 20 Mar 2006 20:00:43 -0800 Subject: In deposition in metallica Message-ID: Dear SpecMat contact person(s), I would like to request to use In in metallica. I have been in contact with Jeannie Perez and Jim McVittie and they have indicated that, although In can be considered to be on the borderline of material in terms of Vapor-Pressure, deposition using low power at Metallica should be permitted. If you want me to supply more information about the request, please let me know. Thank you for your consideration, Best Regards, Dennis Dennis Nordlund (Coral:nordlund) Wenner-Gren Postdoctoral Fellow Stanford Synchrotron Radiation Laboratory +1 650 451 8325 From fengj at stanford.edu Wed Mar 22 16:13:13 2006 From: fengj at stanford.edu (Jia Feng) Date: Wed, 22 Mar 2006 16:13:13 -0800 Subject: Gallium Nitride Message-ID: <02de01c64e0e$93d8b780$22b60c80@FENG> Special Material Committee: I am writing to you to get your approval to use Gallium Nitride in SNF. The information you require is provided as follows. 1. Your contact information: Name, Coral login, phone number, email address and who you work for (your PI or company.) Name: Jia Feng Coral login: fengj Phone number: 650-725-4549 Email address: fengj at stanford.edu PI: James D Plummer 2. The chemical or material. Material: Gallium Nitride Please see the MSDS in the attachment 3. Vendor/manufacturer info: address and phone number, website URL. Technologies and Devices International, Inc. 12214 Plum Orchard Dr., Silver Spring, MD 20904 USA TEL: +1 301 572 7834; FAX: +1 301 572 6435; www.tdii.com 4. Reason for request We are planning to do RF sputtering of Gallium Nitride onto 4-inch Silicon wafers and investigate its crystallization. 5. Process Flow. (1) RF sputtering in metallica, thickness: ~ 0.1 um (2) Deposit 0.02-um SiO2 in sts PECVD (3) Optical lithography in nikon, using 3612 photoresist (4) Photoresist descum in drytek4 (5) Dry etch in pquest (6) Photoresist removal in matrix (7) Clean in PRS-1000 (heated to 40 C) in wbgaas (8) Deposit 0.1-um SiO2 in sts PECVD (9) Heating to 800 C for 1 second in rtagaas (10) Cut the Silicon substrate using wafersaw. The GaN has already been etch into 1-um wide and 10-um long stripes and covered with SiO2. With visible marks etched on the wafer, the wafersaw blade will only cut into the Silicon substrate without contacting or exposing any GaN. 6.. Amount and form. The Gallium Nitride we will bring into the lab is 1-inch poly-crystalline target for RF sputtering. 7. Storage: Will you be storing your chemical/material at SNF? If so, please note any potential reactivities (this should be on the MSDS). We will store the Gallium Nitride target in vacuum sealed bags. 8. DIsposal The Gallium Nitride will either be dry etched or stay on the wafer. Thanks, Jia Feng -------------- next part -------------- A non-text attachment was scrubbed... Name: CCOHS MSDS Record Number 4173028.pdf Type: application/pdf Size: 53287 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: CCOHS MSDS Record Number 4168791.pdf Type: application/pdf Size: 54899 bytes Desc: not available URL: From natarajanslc at yahoo.com Fri Mar 24 10:42:48 2006 From: natarajanslc at yahoo.com (Sriram Natarajan) Date: Fri, 24 Mar 2006 10:42:48 -0800 (PST) Subject: Chemical use Message-ID: <20060324184248.63259.qmail@web54312.mail.yahoo.com> Material Request Name: Sriram Natarajan Coral: sriramnat e-mail: natarajanslc at yahoo.com University of Utah Chemical name: Glycerol, 1,2,3-propanetriol; glycerin; glycol alcohol; glycerol, anhydrous MSDS: http://www.jtbaker.com/msds/englishhtml/g4774.htm Glycerol is similar to Isopropyl Alcohol (IPA) except it has two more -OH groups. All hazard classifications, use and disposal are the same as IPA. Quantity: 250 ml Process Flow: It will be used and disposed of only in the litho solvent wet bench. Thanks. Sriram.N. --------------------------------- Yahoo! Messenger with Voice. PC-to-Phone calls for ridiculously low rates. -------------- next part -------------- An HTML attachment was scrubbed... URL: From mahnaz at stanford.edu Fri Mar 24 15:56:37 2006 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Fri, 24 Mar 2006 15:56:37 -0800 Subject: [Fwd: MSDS for SOG 1513EL, second try] Message-ID: <44248735.9010409@stanford.edu> Hi Ed, The chemical has been ok already. I am forwarding you the MSDS so you can update your data base. mahnaz -------- Original Message -------- Subject: MSDS for SOG 1513EL, second try Date: Fri, 24 Mar 2006 15:13:08 -0800 (PST) From: jim kruger To: Mahnaz MSDS for SOG 1513EL, second try __________________________________________________ Do You Yahoo!? Tired of spam? Yahoo! Mail has the best spam protection around http://mail.yahoo.com -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: MSDS 1513el.pdf Type: application/pdf Size: 28672 bytes Desc: not available URL: From memberservice at chase.com Mon Mar 27 00:22:56 2006 From: memberservice at chase.com (Chase Online Banking) Date: Mon, 27 Mar 2006 08:22:56 GMT Subject: New Message from Chase Online(SM) Message-ID: <200603270822.k2R8Mu5U018164@cosmos.bluenet.co.nr> An HTML attachment was scrubbed... URL: From edmyers at stanford.edu Mon Mar 27 13:40:05 2006 From: edmyers at stanford.edu (Ed Myers) Date: Mon, 27 Mar 2006 13:40:05 -0800 Subject: March 28, 2006 Logsheet Message-ID: <6.0.1.1.2.20060327133622.02de53b0@edmyers.pobox.stanford.edu> All, Here is the latest update to the SpecMat logsheet. Let's plan on holding our meeting this week, Tuesday 3/28 at 1:30 in room CIS201. Ed -------------- next part -------------- A non-text attachment was scrubbed... Name: SpecMat Logsheet.xls Type: application/octet-stream Size: 160256 bytes Desc: not available URL: From gca at vsnl.com Tue Mar 28 11:37:51 2006 From: gca at vsnl.com (Justin) Date: Wed, 29 Mar 2006 05:37:51 +1000 Subject: I burned sixty calories Message-ID: My name is Bobby MXXX and I am 27 years old. I currently weigh 171 lbs thanks to the help of HOODIA. I was a long time ephedra user and was suffering from major with drawl when it was taken off the market. My symptoms were horrible and I had heavy depression and fatigue when I stopped using it. Nothing was helping me and I gained my weight back (despite working hard at the gym) til I was up to 212 lbs and 20% body fat. At that time my girlfriend of 4 years had left me and I was having severe mental issues and my confidence was zero. Bobby MXXX - Currently 171 lbs My name is Christy S. and I am writing you this testimonial in reference to the incredible positive effect your product HOODIA has had on my life. I began taking it in November of 2004 and at that time weighed 243 lbs. I have been overweight all my life and considered gastric bypass surgery and other options Your product was the final shot before I would give up and try surgery. Since then I have forgotton all about gastric bypass and have lost 57 lbs! I'm still taking the product and losing weight today with no signs of slowing down. I have also taken your advice and eliminated all sugars and heavy starches in my diet and feel so much better. With all the many diet pills out there HOODIA has truly lived up to it's expectations. I'll stay in touch and keep you updated on my progress. Thanks, Christy S. - Currently 186 lbs Order online securely from our website http://008.dietdieets.com (A sample is available at no cost to you) keep out of this promotional campaign? pls click the remove link at our website, and enter your id there From chaseonline at chaseonline.chase.com Wed Mar 29 23:53:59 2006 From: chaseonline at chaseonline.chase.com (Chase Card Services Online Services Team) Date: 30 Mar 2006 07:53:59 -0000 Subject: Notification of Limited Account Access Message-ID: <20060330075359.21530.qmail@216-55-169-169.dedicated.abac.net> An HTML attachment was scrubbed... URL: From chaseonline at chaseonline.chase.com Thu Mar 30 01:03:12 2006 From: chaseonline at chaseonline.chase.com (Chase Card Services Online Services Team) Date: 30 Mar 2006 09:03:12 -0000 Subject: Chase Bank Notification Message-ID: <20060330090312.2615.qmail@216-55-169-169.dedicated.abac.net> An HTML attachment was scrubbed... URL: From tsphei at hathway.net Thu Mar 30 07:01:51 2006 From: tsphei at hathway.net (Stephenson) Date: Fri, 31 Mar 2006 01:01:51 +1000 Subject: Whatever will satisfy hunger is good food Message-ID: <7e8201c6545e$b1befa60$2d8a0e1c@tsphei> My name is Bobby MXXX and I am 27 years old. I currently weigh 171 lbs thanks to the help of HOODIA. I was a long time ephedra user and was suffering from major with drawl when it was taken off the market. My symptoms were horrible and I had heavy depression and fatigue when I stopped using it. Nothing was helping me and I gained my weight back (despite working hard at the gym) til I was up to 212 lbs and 20% body fat. At that time my girlfriend of 4 years had left me and I was having severe mental issues and my confidence was zero. Bobby MXXX - Currently 171 lbs My name is Christy S. and I am writing you this testimonial in reference to the incredible positive effect your product HOODIA has had on my life. I began taking it in November of 2004 and at that time weighed 243 lbs. I have been overweight all my life and considered gastric bypass surgery and other options Your product was the final shot before I would give up and try surgery. Since then I have forgotton all about gastric bypass and have lost 57 lbs! I'm still taking the product and losing weight today with no signs of slowing down. I have also taken your advice and eliminated all sugars and heavy starches in my diet and feel so much better. With all the many diet pills out there HOODIA has truly lived up to it's expectations. I'll stay in touch and keep you updated on my progress. Thanks, Christy S. - Currently 186 lbs Order online securely from our website http://008.dietrecordz.com (A sample is available at no cost to you) keep out of this promotional campaign? pls click the remove link at our website, and enter your id there