Belated LogSheet with comments.

Mary Tang mtang at stanford.edu
Fri Mar 3 08:03:13 PST 2006


Sounds good to me.  I take it then, that #2, 3, and 6 are now officially 
approved by SpecMat and #7 by the Pquest community (and now fully logged 
and documented by SpecMat)? 

M

Ed Myers wrote:

> All,
>
> I've completed the update to the SpecMat logsheet and have added a 
> couple more items which popped up this week.
>
> 1) Saeroonter Oh: Phosphorosilicafilm 5e20 and Borofilm 100
> I've gotten a couple of revisions on her process flow, but it's still 
> missing some detail.  I owe a response to try an close the the open 
> items.  The critical steps to the process are:
>
> silicon substrate clean wet bench diffusion Pre-Diffusion Clean
> RTA rtaag/ag4108 Put wafer face down on to source wafer (with Si spacers)
> silicon substrate clean wet bench diffusion Pre-Diffusion Clean
> LTO deposition LPCVD 400C
>
> RECOMMENDATION: The source wafers are not mentioned in the process 
> flow.  The request is for the "Clean" RTA since the doping is for the 
> gate level, but I'm more inclined to suggest the Semiclean / silicide 
> AG4100.
>
> 2) Chris Earhart: Etch Si Using Polystyrene shpere mask in Drytek 2
> Previously we approved the same process and tools for Chris for 
> etching SiO2.
> RECOMMENDATION: I don't see any reason why this should not be approved.
>
> 3) Mang-Mang Ling: Ru evaporation on PDMS
> Ru is an approved metal for the Innotec.  The question comes with 
> running PDMS through the system.  As Mary pointed out PDMS is approved 
> for the Metalica.  Deposition in the Innotec does not have the 
> sputtering component and have less effect on the PDMS.
> RECOMMENDATION: I don't see any reason why this should not be approved.
>
> 4) Rohit S Shenoy: once the Ni is taken off, can the subsequent wet 
> cleans be done at the wbsilicide or wbmetal (PRX-127/PRS-1000)?
> This is what we told a user of SemicleanB metals a year ago: "Beakers 
> for Resist strip, PRS 1000 OK for clean wafers. WBMetal for Semiclean 
> metals"  If I translate, it seems to say PRS1000 in WBMetal is an 
> approved process.
> RECOMMENDATION: Previously approved at WBmetal
>
> 5) Hideo Iwase: etch silver or aluminum film in PlasmaQuest
> Jim already stated there is no RIE for silver.  The next question, 
> does his sample require him to be in the PQuest for the Al etch or can 
> he use the P5000.
> RECOMMENDATION: I will find out if his sample is compatible with the 
> P5000.  If it is not compatible, approve for the PQuest.  Jim, do we 
> need the PQuest communities approval or is this an already established 
> process?
>
> 6) Jim Kruger: NanoImprint HardStamp process
> The request is for Quartz etching using a Cr hardmask in the AMT 
> etcher.  The Cr will come from the Innotec or possibly from the Metalica.
> RECOMMENDATION: This process has been ran in the past, but not fully 
> documented by SpecMat.  I feel it's something we have to do to support 
> the Nanoimprint program.
>
> 7) Jun-Fei: BCL3 or Cl2 to etch TiN which stops on Ga2O3 in PQuest
> Jim is this an established Pquest process?  Will we raise concern with 
> the fact we will be stopping on Ga2O3?
> RECOMMENDATION: Seems like a compatible process if we can get PQuest 
> community buy-in.
>
> 8) Colby Bellew: Mo etching in Pquest
> Colby stopped concerning his Mo etching.  To date he has tested the 
> CF4, SF6 and C2F6 chemistries.  One recommendation was combining F22 
> with C2F6 (I think).  Unfortunately, we do not have a system which is 
> plumbed with both gas sources.  His question was, does he put in a 
> SpecMat request to have F22 plumbed to a system or ?
> RECOMMENDATION: Can we say he has done due diligence in testing 
> fluorine etching and can we approach the PQuest community to allow him 
> to run his Mo etch test.  There was a couple of PQuest community 
> members who approved Colby's initial request.



-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu





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