From chris.detrick at global-fab.com  Thu Nov  2 01:09:27 2006
From: chris.detrick at global-fab.com (Chris Detrick & David Lee)
Date: Thu, 2 Nov 2006 04:09:27 -0500 (EST)
Subject: November Equipment from G-Fab
Message-ID: <1101445161587.1101401002153.9044.6.120410E5@scheduler>

Global Fab Surplus
November Key Equipment Sale
November 02, 2006


Greetings!

Global Fab Surplus (G-Fab) provides New, Used,
2nd hand, Rebuilt and Refurbished Semiconductor
Process Equipment to Integrated Device
Manufacturers, Wafer Foundries, Research and
Development Sites and to the semiconductor
refurbishing and rebuilding community. We buy and
sell used semiconductor equipment of all types
including backend, front end and special application
tools and toolsets saving our clients millions in
capital equipment costs.

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Equipment listing
We curriently have the following key equipment
available for immediate sale along with many other
tools. Please visit our website for a complete
listing. www.global-fab.com (http://rs6.net/tn.jsp?t=tty5tzbab.0.vsd6mybab.jfe8jybab.9044&ts=S0209&p=http%3A%2F%2Fwww.global-fab.com)





* ASML PAS 5000/45 (lens data available, LIKE NEW
CONDITION)

* ASML PAS 5500 / 300

* Speedfam/IPEC 676 CMP (2 available in NEW
CONDITION)

* Rudolph METAPULSE 200

* AMAT 8330 Metal

* SVG 90S Track

* Teradyne 973ST Tester

* Novellus/IPEC/Speedfam Novascan 372 CMP (2
available)

* Line of Wafer Foundry Equipment

* Hitachi S-4700 SEM

* GSI Lumonics WLI 4100

* Applied Materials Centura 5200 Super e

* Applied Materials Silicon Etch Centura II
5202

* Applied Materials Centura 5200 DPS+/ASP+/eMxP+

* Applied Materials Centura 5200 eMax

* Applied Materials PI9500 Implanter

* Nikon NSR 2205-i9, i10C, i11, i12 and i14

* LAM Research TCP9608SE

* FSI Mercury MP

* Kokusai DJ 802V

* Kokusai DJ 835V

* Kokusai DJ 853V

* Eaton NV 10-160 Implanter

* Varian E220 Implanter

* KLA-Tencor 2132

* TEL 19S

* Fein Focus FXS100.23S Wafer Inspection

* Advantest EDS Test T666AF ESD Test

* Teradyne Standalone AOI 5539Ci Tester



If any of these tools are of interest please contact
us for complete details or to set up an inspection.
We also offer a complete line
of new bellows, Ferrofluidic Seals, Spindles and
Subassemblies, and complete Clean - Repair and
Refurbishment services on ASTEX/MKS Remote Plasma
Source and the WJ heated box.

<font color=blue>For a complete list of equipment click here</font> - http://rs6.net/tn.jsp?t=tty5tzbab.0.cqtvuzbab.jfe8jybab.9044&ts=S0209&p=http%3A%2F%2Fwww.global-fab.com%2FusedsemiconductorequipmentGlobalFabSurplus.html

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Equipment Wanted
G-Fab is always looking for equipment that our
customers have a need for.  We would be happy to
help you dispose of your surplus equipment. Please
send us a listing of any equipment you have or are
considering to dispose of.


Curriently we have open RFQ's for the following
tools. 





* WJ 1000H BPSG

* Applied Materials Endura's

* Back Grinder (100mm -200mm capable with a 2 step
process)

* TEL IW 6C

* OnTrak DSS Series II 

* DNS SS-W60A - dual sided scrubber

* DNS SS-W80A - dual sided scrubber

* TEL Unity M, 85TD




Thank you for your time. I hope you find our
services and support beneficial. Please feel free to
forward this email to whom ever you feel would
benefit. Just click on the forward link below.

Sincerely,

Chris Detrick... chris.detrick at global-fab.com
David Lee... support at global-fab.com
G-Fab
------------------------------------------------------------
email: chris.detrick at global-fab.com
phone: Chris (805) 215-9188
David (719) 686-0128
web: http://www.global-fab.com
------------------------------------------------------------

Forward email
http://ui.constantcontact.com/sa/fwtf.jsp?m=1101401002153&ea=specmat%40snf.stanford.edu&a=1101445161587





This email was sent to specmat at snf.stanford.edu,
by chris.detrick at global-fab.com

Update Profile/Email Address
http://ui.constantcontact.com/d.jsp?p=oo&m=1101401002153&ea=specmat%40snf.stanford.edu&se=9044&t=1101445161587&lang=en&reason=F

Instant removal with SafeUnsubscribe(TM)
http://ui.constantcontact.com/d.jsp?p=un&m=1101401002153&ea=specmat%40snf.stanford.edu&se=9044&t=1101445161587&lang=en&reason=F

Privacy Policy:
http://ui.constantcontact.com/roving/CCPrivacyPolicy.jsp








Global Fab Surplus | 1344 Ironbark Street | San Luis Obispo | CA | 93401








-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061102/305d715a/attachment.html>

From mahnaz at stanford.edu  Thu Nov  2 09:49:43 2006
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Thu, 02 Nov 2006 09:49:43 -0800
Subject: [Fwd: FW: Message from KMBT_C351]
Message-ID: <454A2FB7.1080601@stanford.edu>



-------- Original Message --------
Subject: 	FW: Message from KMBT_C351
Date: 	Wed, 1 Nov 2006 13:59:33 -0800
From: 	Qian Wang <QWang at nano.com>
To: 	<mahnaz at snf.stanford.edu>
References: 
<D6015FB8E6767A499C4D48E0CC67EADA3AF3E2 at 67-134-13-5.emerytech.net>



Hi Mahnaz,
 
Please find attached MSDS data for AZ400T. Our process is as follow:
 
1. PMGI coating
2. Standard i-line or g-line (SNF available)resist coating
3. exposure
4. develop in MIF or MIB(SNF available)
5. metalization
6. liftoff by acetone and then AZ400T(Need to be approved).
 
Because clean surface is crucial for our devices. We have data show our PMGI/AZ400T process works. So I really want to use process.
 
Please let me know if AZ400T is qulified or NOT and how I handle the AZ400T.
 
Thanks.
 
qian


-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061102/abf72dbe/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: SKMBT_C35106110111550.pdf
Type: application/pdf
Size: 420415 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061102/abf72dbe/attachment.pdf>

From mahnaz at stanford.edu  Thu Nov  2 09:54:32 2006
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Thu, 02 Nov 2006 09:54:32 -0800
Subject: [Fwd: AZ400T]
Message-ID: <454A30D8.2030908@stanford.edu>


Hello

I have talked to him and the process he likes to run here due to some 
equipment down in Berkeley is doable. Every one ok with NMP? that  he is 
asking in previous email.  we have ok that in past , he will run a test 
with 1165 that I have, or most likely might run the last step in their 
lab but like to have the option. What every one thinks? Please get back 
to me, I have promised him speedy answer.

mahnaz
-------- Original Message --------
Subject: 	AZ400T
Date: 	Thu, 2 Nov 2006 09:10:41 -0800
From: 	Qian Wang <QWang at nano.com>
To: 	Mahnaz Mansourpour <mahnaz at stanford.edu>



Hi Mahnaz,

 

I am not sure if you received the email including MSDS data for AZ400T 
and process yesterday. I wonder if we have chance to get approval to use 
AZ400T in SNF. Microlab of UC has been down for a while and we really 
need to start process in SNF.

 

Thanks a lot.

 

qian

-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061102/4737f59e/attachment.html>

From kurt at metatechnica.com  Fri Nov  3 16:35:48 2006
From: kurt at metatechnica.com (Kurt Schoedel)
Date: Fri, 03 Nov 2006 16:35:48 -0800
Subject: Thin film Analysis Using Surface Acoustic Waves
Message-ID: <E1Gg9Vk-0007jl-F4@svr58.ehostpros.com>

Hello

I would like to introduce to you the LASAW-NC instrument. The LASAW-NC 
uses laser generated surface acoustic waves to measure physical 
properties of density, elasticity, and Poisson?s ratio of thin film 
materials. The LASAW technique is especially effective for soft thin 
film materials such as polymers and organo-silicates. 

The LASAW-NC can effectively analyze these properties for most thin 
film materials down to around 1000 angstroms in thickness, a 
substantial improvement over the 3000 angstroms limitation of nano-
indentation. 

More information about the LASAW-NC is available at our website at 
www.metatechnica.com/lasawNC.html.

Sincerely,

Kurt Schoedel
MetaTechnica


From h0451691 at wu-wien.ac.at  Mon Nov  6 11:32:27 2006
From: h0451691 at wu-wien.ac.at (h0451691)
Date: Mon, 6 Nov 2006 20:32:27 +0100
Subject: Survey on Nanopositioning
Message-ID: <60347878890.20061106203227@wu-wien.ac.at>


Dear Sir or Madam of the Stanford Nanofabrication Facility,

We are a group of students at the Vienna University of Economics and Business Administration in Austria, currently working on a research project. We are trying to evaluate future markets and developments in the field of nano technology. More specifically, we are evaluating nano positioning markets.

Please find attached a questionnaire. We would kindly ask you to complete the form, or alternatively, if you are not an expert on this topic, forward the questionnaire to the respective experts. Even any information in general would be considerably helpful for us.

If you are interested in the results of this survey, we would provide you with the results.

Many thanks in advance and kind regards from Austria,
Roman Pickl
www.wu-wien.ac.at
www.e-and-i.org/
-------------- next part --------------
A non-text attachment was scrubbed...
Name: interview_questions__nano_technology.doc
Type: application/msword
Size: 388608 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061106/3f3451dc/attachment.doc>

From edmyers at stanford.edu  Tue Nov  7 09:08:35 2006
From: edmyers at stanford.edu (Ed Myers)
Date: Tue, 07 Nov 2006 09:08:35 -0800
Subject: SpecMat Logsheet 11/8/06
Message-ID: <6.2.5.6.2.20061107090610.04808e80@stanford.edu>

All,

Attached is the current Specmat logsheet.  As you can see, there are 
not items which require a meeting today.  As a result, enjoy your 
extra half hour of free time.

Ed
-------------- next part --------------
A non-text attachment was scrubbed...
Name: SpecMat Logsheet.xls
Type: application/octet-stream
Size: 211456 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061107/53cc3209/attachment.obj>

From shott at stanford.edu  Tue Nov  7 10:16:15 2006
From: shott at stanford.edu (John Shott)
Date: Tue, 07 Nov 2006 10:16:15 -0800
Subject: SpecMat Logsheet 11/8/06
In-Reply-To: <6.2.5.6.2.20061107090610.04808e80@stanford.edu>
References: <6.2.5.6.2.20061107090610.04808e80@stanford.edu>
Message-ID: <4550CD6F.304@stanford.edu>

Ed et al:

I may have forgotten to raise the following question.

Harold Ackler from Binghamton Univ (back near Cornell, I think) used to 
use Protek from Brewer Scientific as an organic protective layer that 
stands up to long KOH etches.  Harold is interested in using this here 
... but it seemed to me that this was likely a material that would be of 
broader interest here and, if so, something that we should formalize.

The link to Protek at Brewer Science is:
http://www.brewerscience.com/products/sm/product-information/mems-products

The datasheet for Protek B1 (which is the version that Harold has used 
in part because it can be stripped in acetone, or NMP, or their own 
strippers.  I think that B1-18 and B1-25 are essentially the same except 
for viscosity.

Here is a presentation that describes typical use:

http://www.brewerscience.com/fileadmin/bsi/home/products/SpecialtyMaterials/Upload_Files/sm_pdfs/ProTEK_B_pres_A60825.pdf

And attavched are the MSDSs from B1-18 and B1-25:

Does anyone have any experience with this material or 
questions/concerns.  It would certainly appear to provide useful 
functionality.

Thanks,

John



-------------- next part --------------
A non-text attachment was scrubbed...
Name: Brewer-B1-18-1356.pdf
Type: application/pdf
Size: 124956 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061107/468a1b4b/attachment.pdf>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: Brewer-B1-25-1700.pdf
Type: application/pdf
Size: 124386 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061107/468a1b4b/attachment-0001.pdf>

From mtang at stanford.edu  Tue Nov  7 10:23:52 2006
From: mtang at stanford.edu (Mary Tang)
Date: Tue,  7 Nov 2006 10:23:52 -0800
Subject: SpecMat Logsheet 11/8/06
In-Reply-To: <4550CD6F.304@stanford.edu>
References: <6.2.5.6.2.20061107090610.04808e80@stanford.edu> <4550CD6F.304@stanford.edu>
Message-ID: <1162923832.4550cf38d96c6@webmail.stanford.edu>

Hi John --

I think Yves Acremann requested this as well and it was approved.  This was
a few months ago.  We may actually have this stuff in -house now, if this
requestor needs it (I don't know -- we had arranged for samples to be sent,
but we should check with Yves as to whether he received them.)  This is
really good stuff, from what I hear, but there is a very limited shelf-life
and it is pricey, so not worth keeping a lot on hand.

Mary

Quoting John Shott <shott at stanford.edu>:

> Ed et al:
>
> I may have forgotten to raise the following question.
>
> Harold Ackler from Binghamton Univ (back near Cornell, I think) used to
> use Protek from Brewer Scientific as an organic protective layer that
> stands up to long KOH etches.  Harold is interested in using this here
> ... but it seemed to me that this was likely a material that would be of
> broader interest here and, if so, something that we should formalize.
>
> The link to Protek at Brewer Science is:
> http://www.brewerscience.com/products/sm/product-information/mems-products
>
> The datasheet for Protek B1 (which is the version that Harold has used
> in part because it can be stripped in acetone, or NMP, or their own
> strippers.  I think that B1-18 and B1-25 are essentially the same except
> for viscosity.
>
> Here is a presentation that describes typical use:
>
>
http://www.brewerscience.com/fileadmin/bsi/home/products/SpecialtyMaterials/Upload_Files/sm_pdfs/ProTEK_B_pres_A60825.pdf
>
> And attavched are the MSDSs from B1-18 and B1-25:
>
> Does anyone have any experience with this material or
> questions/concerns.  It would certainly appear to provide useful
> functionality.
>
> Thanks,
>
> John
>
>
>
>




From lhansen at nilt.com  Fri Nov 10 07:05:35 2006
From: lhansen at nilt.com (Lars Hansen - NIL Technology)
Date: Fri, 10 Nov 2006 16:05:35 +0100
Subject: Cut-price nanoimprint lithography (NIL) standard stamp
Message-ID: <20061110151106.6C5AE26084A@mail.bortnet.com>

Dear Sir/Madam, 

I have learned about your research activities at the Stanford
Nanofabrication Facility and find them very interesting ? especially due to
their relevance to nanoscale structures.

  
I would like to bring your attention to the nanoimprint lithography (NIL)
standard stamp for process testing recently introduced by NIL Technology
(www.nilt.com). The standard stamp contains different features with sizes
ranging from 250 nm down to 100 nm. This nano-structured standard stamp is
available to you at the unheard-of low price of ? 1,950 (app. $ 2,480).

  
I encourage you to take advantage of this opportunity to gain the capability
for yourself and your institution to imprint low-cost nanostructures. This
standard stamp is perfect for testing, optimization of imprint processes,
education and training, and can be used in both imprint machines and wafer
bonders. You can learn more about the unique features of this stamp and
order it here: http://www.nilt.com/Default.asp?Action=Details
<http://www.nilt.com/Default.asp?Action=Details&Item=240> &Item=240. All
relevant information is also available in the attached brochure.

Another possibility for gaining more information is visiting the NIL
Technology stand at the upcoming Fifth International Conference on NNT in
San Francisco (15-17 November; see http://www.nntconf.org/). Booth no. 8
-we?d love to meet you there!

Otherwise, in case nanoimprint lithography does not have your interest, I
would appreciate if you could forward this mail to relevant persons who
might find it more valuable.

  
  
Best regards, 
  
Lars Hansen, M.Sc.E 
Director of sales 
NIL Technology ApS 
?rsteds Plads 
DTU - Building 347 
DK-2800 Kongens Lyngby 
Denmark 

Phone: +45 4525 5828 
Mobile: +45 2223 1515 
Fax: +45 3927 2722 
E-mail: lars.hansen at nilt.com 

P.S. In the future you will receive our free weekly NIL Technology Nano
Newsletter. This exclusive newsletter will provide you with hand-picked
nanotechnology breakthroughs and industry developments.


-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061110/d8bf873f/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: NILTStandard.pdf
Type: application/pdf
Size: 42852 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061110/d8bf873f/attachment.pdf>

From miner at romny-scientific.com  Fri Nov 10 14:27:52 2006
From: miner at romny-scientific.com (miner at romny-scientific.com)
Date: Fri, 10 Nov 2006 14:27:52 -0800 (PST)
Subject: new material inquiry: Bismuth/Antimony Telluride
Message-ID: <20061110222753.44094.qmail@web401.biz.mail.mud.yahoo.com>

Hello,
I am not a lab member but am looking into the capabilities of the SNF and perhaps having my company work in the facility.  Bismuth/Antimony Telluride is not listed in the standard materials, and I would like to know if I can use it in a limited way in the lab.

1. Andrew Miner, Romny Scientific.  miner at romny-scientific.com
2. Bismuth Telluride, Antimony Telluride.  MSDS attached.  CAS #1304-82-1, 1327-50-0. (solid semiconductors)
3. This material is formed at Romny Scientific facilities from raw materials acquired from standard chemical supply houses.
4. I have used this material at the UC Berkeley Microlab from 1999-2002 and in my clean room at Nanocoolers, Inc. (www.nanocoolers.com) from 2002-2005.  With care there is little safety or contamination risk from this material.
5. The material would be brought into the lab as patterned films on the order of 10 um thick on 4 inch silicon wafers or smaller chips.  Initially I will be doing SEM work.  Later I will be depositing metals, thereby encapsulating the Bi/Sb-Te, and patterning the metals.  I do not know the specifics of the equipment that would be used but they would be the 'contaminated' class of tools.
6. The material is a solid semiconductor and would be brought in as patterned films that are about 10 um thick, on wafers or chips.
7. The material would be stored in labeled wafer carriers.
8. The material will be disposed of as other solid metal waste materials are disposed. 



Andrew Miner, Ph.D.
Founder and Chief Technical Officer
Romny Scientific
248 30th Ave.
San Francisco, California 94121
512-809-8929
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061110/1a79bbdb/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: bismuthtelluride_msds.pdf
Type: application/pdf
Size: 12641 bytes
Desc: pat917657448
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061110/1a79bbdb/attachment.pdf>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: SbTe_MSDS.pdf
Type: application/pdf
Size: 38430 bytes
Desc: pat1210799241
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061110/1a79bbdb/attachment-0001.pdf>

From zhidan_tolt at yahoo.com  Fri Nov 17 15:01:50 2006
From: zhidan_tolt at yahoo.com (Zhidan Tolt)
Date: Fri, 17 Nov 2006 15:01:50 -0800 (PST)
Subject: request for New Material approval
Message-ID: <20061117230150.11483.qmail@web54105.mail.yahoo.com>

My process flow is the following:
1. Silicon Nitride deposition on Si wafer (clean)
2. Litho to pattern the nitride
3. Ni (10nm) and Fe (3nm) deposition through an polycarbonate membrane and SS shadow mask in Innotech. (cont)
4. PECVD SiO2 depoosition (cont)
5. CMP (outside lab)
6. Drytek 4 etch of SiO2 (cont)
7. PECVD SiO2 dep (cont)
8. Cr dep (cont)

I am requesting approval of the following: 
1. application of polycarbonate plastic film in Innotech. 
2. Bring in outside wafer after CMP. The surface at this stage surface contains SiO2 and carbon.
3. SiO2 etch in drytek 4 of a wafer having both SiO2 and carbon on the surface.
4. PECVD SiO2 dep on a wafer that has carbon nanotube exposed.

Note: I am in the process of obtaining the MSDS data sheet from the vendor of the polycarbonate membrane.  The company does not provide the data sheet in general since it is not considered toxic substance.

Thanks,

Zhidan
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061117/21d3bbb6/attachment.html>

From ztolt at oxfordxtg.com  Fri Nov 17 15:18:27 2006
From: ztolt at oxfordxtg.com (Zhidan Tolt)
Date: Fri, 17 Nov 2006 15:18:27 -0800
Subject: Emailing: 1900_PC1000_Polycarbonate
Message-ID: <08A54121B6C4F54F8FE9EE5C568BED5C3985F9@usxtgnts01.oxfordxtg.com>

  
My process flow is the following:
1. Silicon Nitride deposition on Si wafer (clean)
2. Litho to pattern the nitride
3. Ni (10nm) and Fe (3nm) deposition through an polycarbonate membrane
and SS shadow mask in Innotech. (cont)
4. PECVD SiO2 depoosition (cont)
5. CMP (outside lab)
6. Drytek 4 etch of SiO2 (cont)
7. PECVD SiO2 dep (cont)
8. Cr dep (cont)
 
I am requesting approval of the following: 
1. application of polycarbonate plastic film in Innotech. 
2. Bring in outside wafer after CMP. The surface at this stage surface
contains SiO2 and carbon.
3. SiO2 etch in drytek 4 of a wafer having both SiO2 and carbon on the
surface.
4. PECVD SiO2 dep on a wafer that has carbon nanotube exposed.

Attached is the MSDA data sheet for polycarbonate.

Thanks,

Zhidan
 <<1900_PC1000_Polycarbonate.url>> 
-------------- next part --------------
A non-text attachment was scrubbed...
Name: 1900_PC1000_Polycarbonate.url
Type: application/octet-stream
Size: 121 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061117/09926808/attachment.obj>

From Education at academic-software-outlet.com  Sun Nov 19 15:10:20 2006
From: Education at academic-software-outlet.com (CPE AutoCAD Education Sales)
Date: Sun, 19 Nov 2006 18:10:20 -0500
Subject: Autodesk AutoCAD Academic Software Special                   
Message-ID: <397d395f4a38af86908787e610d754@bmw>

AutoDesk AutoCAD 2007 Educational Software Sale!
!!!!!! AUTODESK EDUCATION SALE at CPE !!!!!!!!!!!!!!!!!!!
 
COMPUTER PRODUCTS FOR EDUCATION is very pleased to offer the best educational software prices and customer service to all qualified faculty, staff, and students of U.S. schools, on all AUTODESK EDUCATIONAL SOFTWARE VERSIONS - AT DISCOUNTS UP TO 97% OFF RETAIL PRICES!!!

!!!!!!!!!!!!!!!! AUTODESK NOVEMBER SALE !!!!!!!!!!!!!!!!!!!!!!

Visit:    www.academic-software-outlet.com/autodesk.html
OR Call:  800-679-7007

******* SALE PRICES VALID THROUGH November 30, 2006 **********

-------------------------------------------  Education Standard  You
Student-Faculty Version Perptual Licenses*    Price    Retail   Save!                 
-------------------------------------------  --------  ------   -----
Autodesk AutoCAD 2007 Full Version 2D+3D      $379.95   $3750    90%
Autodesk AutoCAD 2007 LT (2D Only)            $148.95    $899    84%
Autodesk AutoCAD 2006 Full Version 2D+3D      $369.95   $3750    90%
Autodesk AutoCAD 2006 LT (2D Only)            $147.95    $899    84%
Autodesk Architectural Desktop 2007           $379.95   $4695    92%
Autodesk AutoCAD Revit Series 9               $469.95   $4995    91%
Autodesk AutoCAD Revit Series 8.1             $469.95   $4995    91%
Autodesk Building systems 2006                $469.95   $5995    92%
Autodesk Civil 3D 2007                        $469.95   $5995    91%
Autodesk Inventor Professional 2006           $469.95   $5195    91%
Autodesk Land Desktop 2006                    $469.95   $4995    91%
Autodesk Map 3D 2006                          $469.95   $4795    90%
Autodesk Raster Design 2006                   $149.95   $1695    91%
Autodesk Survey 2006                          $149.95    $995    85%
Autodesk Viz 2006                             $269.95   $1995    85%
Autodesk Discreet 3ds Max 8                   $679.95   $3495    81%

*Perpetual Licenses never expire, whereas 1-year licenses shown
below expire at the end of 1-year after installation.

 www.academic-software-outlet.com/autodesk.html

-------------------------------------------  Education Standard You
Student-Faculty Version 1-Year Licenses**      Price    Retail  Save!                 
-------------------------------------------  --------  ------   ----
Autodesk AutoCAD 2007 Full Version 2D+3D*     $158.95   $3750    96%
Autodesk AutoCAD 2006 Full Version 2D+3D*     $158.95   $3750    96%
Autodesk Architectural Desktop 2007*          $158.95   $4695    97%
Autodesk AutoCAD Revit Series 9               $158.95   $4995    97%
Autodesk Building systems 2006                $158.95   $5995    97%
Autodesk Civil 3D 2006*                       $158.95   $5995    97%
Autodesk Inventor Professional 2006           $158.95   $5195    97%
Autodesk Land Desktop 2006*                   $158.95   $4995    91%
Autodesk Map 3D 2006*                         $157.95   $4795    97%
Autodesk Raster Design 2006                   $ 98.95   $1695    94%
Autodesk Survey 2006                          $ 98.95    $995    90%
Autodesk Viz 2006*                            $158.95   $1995    92%
Autodesk Discreet 3ds Max 8                   $179.95   $3495    95%

** 1-Year licenses expire 1-year after installation.
------------------------------------------------------------

For more information, visit our website at:
   www.academic-software-outlet.com/autodesk.html
or Call 800-679-7007.

Autodesk Educational Software has the exact same features and functionality as the Commerical Full-Versions of the software.  The only difference is that the educational version prints a small notation on the edge of print-outs stating that the graphic was created with an educational version of the software.

Autodesk Educational Software may be uprgaded to the commercial 
version of the software.  Call for pricing and more information.

COMPUTER PRODUCTS FOR EDUCATION is an Autodesk Authorized Educational 
Reseller and we licensed to sell the educational software version of 
AutoDesk's products to qualified Students, Teachers, Faculty, and Staff
of K-12 and Higher Education institutions. 

All software products sold by CPE are authentic original software
from the manufacturer.  THESE ARE NOT PIRATED COPIES.  ALL SOFTWARE 
COMES IN ORIGINAL MANUFACTURER'S BOXES AND INCLUDES A VALID 
VERIFIABLE LICENSE.

----------
LICENSING:
----------
For school purchases of multiple licenses for classroom use, please 
call 800-679-7007 for more infomation on instiutional licensing prices.   

---------------------------
QUALIFIED EDUCATIONAL BUYERS:
---------------------------
The following are defined as Qualified Education Buyers.  Qualifed Educational 
Buyers must provide the below verification upon making any purchase.

1.  Students of Higher Education - All enrolled college, junior college, community 
     college, technical school, vocational school, and university students.
2.  K-12 Students - K-12 students enrolled at accedited K-12 schools.
3.  Teachers - All K-12 school and Higher Education institution teachers.
4.  Faculty - All K-12 school and Higher Education institution faculty.
5.  Staff - All K-12 school and Higher Education institution staff.

-------------------------
VERIFICATION:
-------------------------
Purchasers must provide fax-verification of status as being a current faculty, staff, or student.  
After placing your order, you simply fax to CPE either: 
(a) a copy of a current picture School I.D. Card; or,
(b) a current paycheck stub with an alternative picture I.D. (drivers license, etc.) Sensitive
      information may be blacked out; or
(c) Schools may purchase by faxing a valid school purchase order. 
For more details, call us or visit our website.

-------------------------
ABOUT US:
-------------------------
COMPUTER PRODUCTS FOR EDUCATION is an Authorized Education Reseller for AutoDesk other major software manufacturers. COMPUTER PRODUCTS FOR EDUCATION is a national software distributor committed to providing the best prices and the best customer service to the Education Community!!

Prices and availability are subject to change without notice, due to factors outside our control.

__________________________
U-N-S-U-B-S-C-R-1-B-E LINK:
We hope you have found this message useful.  However, if you do not wish to recieve any more mail
 from CPE, please click on the following link:
http://www.academic-software-outlet.com/rem.asp?a=remv&e=specmat at snf.stanford.edu 
Or call 800-679-7007 and ask to be deleted from our list.

__________________________


Computer Products for Education
5325 140th Avenue North
Clearwater, Florida 33760
Tel: 800-679-7007 / 727-530-1709
Fax: 800-679-6996 / 727-530-7994
___________________

THANK YOU!!!





From chris.detrick at global-fab.com  Mon Nov 20 00:09:24 2006
From: chris.detrick at global-fab.com (Chris Detrick & David Lee)
Date: Mon, 20 Nov 2006 03:09:24 -0500 (EST)
Subject: November Equipment from G-Fab
Message-ID: <1101462502325.1101401002153.9044.6.1203108A@scheduler>

Global Fab Surplus
Semiconductor Equipment Sale
November 20, 2006


Greetings!

Global Fab Surplus (G-Fab) provides New, Used,
2nd hand, Rebuilt and Refurbished Semiconductor
Process Equipment to Integrated Device
Manufacturers, Wafer Foundries, Research and
Development Sites and to the semiconductor
refurbishing community. We buy and
sell used semiconductor equipment of all types
including backend, front end and special application
tools and toolsets saving our clients millions in
capital equipment costs.

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Available Equipment listing
We curriently have the following key equipment
available for immediate sale along with many other
tools. Please visit our website for a complete
listing. www.global-fab.com (http://rs6.net/tn.jsp?t=v65pe9bab.0.vsd6mybab.jfe8jybab.9044&ts=S0209&p=http%3A%2F%2Fwww.global-fab.com)





* ASML PAS 5000/45 (LIKE NEW
CONDITION) This is the best one we have seen in a
long time.

* Speedfam/IPEC 676 CMP (2 available in NEW
CONDITION)

* IPEC/Speedfam 372 CMP with Novascan (2
available)

* Rudolph METAPULSE 200

* AMAT 8330 Metal

* SVG 90S Track

* Teradyne 973ST Tester

* eMxP+ Centura (refurbished not install yet) 

* Endura (refurbished not install yet)

* Ultima + (refurbished not install yet)

* Gasonic PEP 3510,  2 units (New from Novellus)

* Novellus C2, 2 units (New from Novellus)

* Strasbaugh 	6DS-SP 	Rotational CMP

* TEL Alpha 8SE

* GSI Lumonics WLI 4100

* Nikon NSR 2205-i9, i10C, i11, i12 and i14

* LAM Research TCP9608SE

* FSI Mercury MP

* Kokusai DJ 802V

* Kokusai DJ 835V

* Kokusai DJ 853V

* Eaton NV 10-160 Implanter

* KLA-Tencor 2132

* Fein Focus FXS100.23S Wafer Inspection

* Advantest EDS Test T666AF ESD Test

* Teradyne Standalone AOI 5539Ci Tester



If any of these tools are of interest please contact
us for complete details or to set up an inspection.
We also offer a complete line
of new bellows, Ferrofluidic Seals, Spindles and
Subassemblies, and complete Clean - Repair and
Refurbishment services on ASTEX/MKS Remote Plasma
Source and the WJ heated box.

<font color=blue>For a complete list of equipment click here</font> - http://rs6.net/tn.jsp?t=v65pe9bab.0.cqtvuzbab.jfe8jybab.9044&ts=S0209&p=http%3A%2F%2Fwww.global-fab.com%2FusedsemiconductorequipmentGlobalFabSurplus.html

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Equipment Wanted
G-Fab is always looking for equipment that our
customers have a need for.  We would be happy to
help you dispose of your surplus equipment. Please
send us a listing of any equipment you have or are
considering to dispose of.


Curriently we have open RFQ's for the following
tools. 





* WJ 1000H BPSG

* Applied Materials Endura's

* Back Grinder (100mm -200mm capable with a 2 step
process)

* TEL IW 6C

* DNS SS-W80A - dual sided scrubber

* TEL Unity M, 85TD




Thank you for your time. I hope you find our
services and support beneficial. Please feel free to
forward this email to whom ever you feel would
benefit. Just click on the forward link below.

Sincerely,

Chris Detrick... chris.detrick at global-fab.com
David Lee... support at global-fab.com
G-Fab
------------------------------------------------------------
email: chris.detrick at global-fab.com
phone: Chris (805) 215-9188
David (719) 686-0128
web: http://www.global-fab.com
------------------------------------------------------------

Forward email
http://ui.constantcontact.com/sa/fwtf.jsp?m=1101401002153&ea=specmat%40snf.stanford.edu&a=1101462502325





This email was sent to specmat at snf.stanford.edu,
by chris.detrick at global-fab.com

Update Profile/Email Address
http://ui.constantcontact.com/d.jsp?p=oo&m=1101401002153&ea=specmat%40snf.stanford.edu&se=9044&t=1101462502325&lang=en&reason=F

Instant removal with SafeUnsubscribe(TM)
http://ui.constantcontact.com/d.jsp?p=un&m=1101401002153&ea=specmat%40snf.stanford.edu&se=9044&t=1101462502325&lang=en&reason=F

Privacy Policy:
http://ui.constantcontact.com/roving/CCPrivacyPolicy.jsp








Global Fab Surplus | 1344 Ironbark Street | San Luis Obispo | CA | 93401








-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061120/b237747b/attachment.html>

From mahnaz at stanford.edu  Mon Nov 20 09:13:24 2006
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Mon, 20 Nov 2006 09:13:24 -0800
Subject: [Fwd: Using HBr]
Message-ID: <4561E234.8080208@stanford.edu>



-------- Original Message --------
Subject: 	Using HBr
Date: 	Mon, 20 Nov 2006 15:58:05 +0000
From: 	Shabbir A. Bashar, Ph.D. <Shabbir.Bashar at nLight.net>
Reply-To: 	Shabbir.Bashar at nLight.net
To: 	Ulrike Thumser <uli at snf.stanford.edu>, Mahnaz Mansourpour 
<mahnaz at snf.stanford.edu>
CC: 	Pradeep Nataraj <pradeep.nataraj at gmail.com>



Hi uli and Mahnaz,

I would like to get approval for using HBr -liquid form - for etching InP wafers.

Please forward this request to specmat committee.

Thanks.

Shabbir.
=================
Shabbir A. Bashar, PhD
nLight Photonics Corp.
5408 NE 88th Street, Bldg. E
Vancouver, WA 98665
Cell: +1 510 386 7304
Office: +1 360 713 5145
Fax: +1 360 546 1960
E-mail: Shabbir.Bashar at nLight.net
Web: www.nLight.net    


-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061120/eea8d52b/attachment.html>

From uli at snf.stanford.edu  Mon Nov 20 09:39:40 2006
From: uli at snf.stanford.edu (Uli Thumser)
Date: Mon, 20 Nov 2006 09:39:40 -0800
Subject: [Fwd: Using HBr]
Message-ID: <4561E85C.10006@snf.stanford.edu>


-- 
Uli Thumser
Stanford Nanofabrication Facility
Center for Integrated Systems
420 Via Palou Mall, CIS Room 146
Stanford, CA  94305
(650)725-3694
uli at snf.stanford.edu

-------------- next part --------------
An embedded message was scrubbed...
From: "=?UTF-8?B?U2hhYmJpciBBLiBCYXNoYXIsIFBoLkQu?=" <Shabbir.Bashar at nLight.net>
Subject: Using HBr
Date: Mon, 20 Nov 2006 15:58:05 +0000
Size: 1458
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20061120/3b3f0a15/attachment.mht>

From mtang at stanford.edu  Mon Nov 20 10:02:01 2006
From: mtang at stanford.edu (Mary Tang)
Date: Mon, 20 Nov 2006 10:02:01 -0800
Subject: [Fwd: Using HBr]
In-Reply-To: <4561E85C.10006@snf.stanford.edu>
References: <4561E85C.10006@snf.stanford.edu>
Message-ID: <4561ED99.5040203@stanford.edu>

Hi Pradeep, Shabbir --

Please provide info to SpecMat as per 
http://snf.stanford.edu/Materials/NewMatProc.html

I should warn you that there is a rather high barrier for bringing in 
HBr.  We'll need to know what chemical mixture you plan to use -- the 
concentration of HBr you wish to bring and how you are going to mix it 
for your etch.  From what I understand, if you mix just pour HBr with an 
oxidizing acid, you get Br2 gas -- there is an art to mixing the 
chemicals together.  If you have your own procedure that you are 
experienced with, please provide details about this.  If not, we also 
have a procedure from John Choi which has been demonstrated to be safe 
for etching InP, although don't know if this would meet your specific 
process needs.  By the way, this was done only at wbgaas and all waste 
was collected locally. 

So, please provide more details about your etch and MSDS info on the 
chemicals you wish to bring in.  It would be best if you could use 
dilute rather than concentrated solutions as starting materials.

Thanks,

Mary

Uli Thumser wrote:
>
>
> ------------------------------------------------------------------------
>
> Subject:
> Using HBr
> From:
> "Shabbir A. Bashar, Ph.D." <Shabbir.Bashar at nLight.net>
> Date:
> Mon, 20 Nov 2006 15:58:05 +0000
> To:
> "Ulrike Thumser" <uli at snf.stanford.edu>, "Mahnaz Mansourpour" 
> <mahnaz at snf.stanford.edu>
>
> To:
> "Ulrike Thumser" <uli at snf.stanford.edu>, "Mahnaz Mansourpour" 
> <mahnaz at snf.stanford.edu>
> CC:
> "Pradeep Nataraj" <pradeep.nataraj at gmail.com>
>
>
> Hi uli and Mahnaz,
>
> I would like to get approval for using HBr -liquid form - for etching InP wafers.
>
> Please forward this request to specmat committee.
>
> Thanks.
>
> Shabbir.
> =================
> Shabbir A. Bashar, PhD
> nLight Photonics Corp.
> 5408 NE 88th Street, Bldg. E
> Vancouver, WA 98665
> Cell: +1 510 386 7304
> Office: +1 360 713 5145
> Fax: +1 360 546 1960
> E-mail: Shabbir.Bashar at nLight.net
> Web: www.nLight.net    
>   


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu