From mkexr at brcml.org.au Mon Oct 16 06:37:22 2006 From: mkexr at brcml.org.au (Archibald Cochran) Date: Mon, 16 Oct 2006 13:37:22 +0000 Subject: buffoon Message-ID: <000d01c6f128$71398a57$5a8bd9c4@nbgp> The only Easternraces that have developed at all quickly are the independent ones. Like all bachelors servants, KoSla was lazy and dirty, and yet he was devoted to Flory. Well, doctor, wevebeen arguing so much that I havent asked for your news. The evil time ofday was beginning, the time, as the Burmese say, when feet aresilent. It wass that thatput the idea into my head. Ive heard a good deal about U Po Kyin from various sources,Flory said. How could the Rice Ring go onskinning the unfortunate peasant if it hadnt the Government behindit? Creeping round the world building prisons. They were intimate enough to laugh over thedoctors queer English occasionally. We darent; frightened of thecompetition in industry. That fact iss, my friend, there iss a most unpleasant businessafoot. And consider how noble a type iss the English gentleman! My friend, my friend, you are forgetting the Oriental character. How could the Rice Ring go onskinning the unfortunate peasant if it hadnt the Government behindit? In the eighteenth century the Indians cast guns thatwere at any rate up to the European standard. Call them niggers or Aryans or whatyou like. But the trees avenge themselves, as the oldchap says in The Wild Duck. Cant do anything unless youput your foot down firmly. Teaching bazaar sweepers theyre as good as we are. The evil time ofday was beginning, the time, as the Burmese say, when feet aresilent. And then, what a lesson that will teach them! The unswerving British Justice and the Pax Britannica. Thecountrys only rotten with sedition because weve been too softwith them. He was notorious for his soft-heartedness, and allthe beggars in Kyauktada made him their target. In the eighteenth century the Indians cast guns thatwere at any rate up to the European standard. It might explain that black mark on hisface. A pack of Madrassi servants and Karen school-teachers. Theres a kind of spurious good-fellowshipbetween the English and this country. Living and working among Orientals would try thetemper of a saint. A damp patch was growing larger and larger in the backof Mr Macgregors silk coat. Well, perhaps theywill discover their mistake when it is too late. Such a relief tobe out of the stink of it for a little while. Then he put on his pink gaungbaung and musliningyi and brought the tea-tray to his masters bedside. Really I think the laziness of these servants is getting tooshocking, she sighed. Of course drink is what keeps the machinegoing. Theres a kind of spurious good-fellowshipbetween the English and this country. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: rapprochement.gif Type: image/gif Size: 4959 bytes Desc: not available URL: From artyjamo at comcast.net Mon Oct 2 11:00:16 2006 From: artyjamo at comcast.net (artyjamo at comcast.net) Date: Mon, 02 Oct 2006 18:00:16 +0000 Subject: Req.Approval SIPR 7123M-20 + MSDS Message-ID: <100220061800.17013.452153AF000ED68F00004275220075078401030E06979B9D0E@comcast.net> Hello Spec-Mat Committee, I would like to bring in a new photoresist made by Shin-etsu Micro Si called SIPR 7123M -20. This is a high viscosity positive photoresist for 15-70 um thick coatings. I would like to bring in an 8oz bottle (like those that are issued in the SNF stockroom) and keep it in the small flammables cabinet, along with the other SNF members resist samples. I would be using these resists to coat my substrates on the Headway spinner (15 to 80 um thick) and softbaking them on the hotplates that are immediately to the right of the Headway spinner. I would like to expose the coated substrates on the Karl Suss aligners, and develop the patterns in LDD-26W at the develop bench in the litho area. Used developer would go down the drain in the develop bench. Any waste of these resists would be put in the solvent waste carboy in the Solvent bench. Any clean roomwipes contaminated with this resist, empty bottles with resist residues would be bagged and put in the solid chemical waste bin in the Litho area. I am attaching a soft copy of the MSDS sheet Please let me know ASAP if I can bring this sample in for use. Much Thanks, Aleta Jamora (ajamo) -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: SIPR-7123M-20 MSDS.pdf Type: application/pdf Size: 1046016 bytes Desc: not available URL: From artyjamo at comcast.net Mon Oct 2 11:28:39 2006 From: artyjamo at comcast.net (artyjamo at comcast.net) Date: Mon, 02 Oct 2006 18:28:39 +0000 Subject: Req Approval-CA-40 Cleaning solution + MSDS Message-ID: <100220061828.13315.45215A57000070DD00003403220075078401030E06979B9D0E@comcast.net> Hello Spec Mat. I would like to bring in a new chemical called CA-40 Cleaning solution which is made by Cyantek Corporation. This is a slightly basic aqueous detergent (99% water by content) that I would like to use to clean 5 inch photomasks (for the Karl Seuss). I would like to keep this solution in a squeeze bottle and use it at the developer bench in the litho area. I would like to store the squeeze bottle with the developers in the chemical cabinet in the back. (any suggestions for storage welcome) The procedure for cleaning masks would be as follows: Hold the photomask over the sink, wet the mask with DI water and squirt 10 mls of the CA-40 Cleaning solution on the mask. While still holding the mask over the sink, lightly scrub the mask with a soft tooth brush or a clean-room wipe. Rinse the mask under running D.I. water in the sink. Dry the mask with an air-gun. Any gloves, or clean room wipes contaminated with CA-40 cleaning solution would be bagged and disposed of in the ha zardous materials garbage. Any waste CA-40 cleaning solution would be rinsed down the sink at the developer bench in the Litho Area with copious amounts of D.I. water. I am attaching the MSDS sheet for the Cleaning Solution. Thanks, Aleta Jamora (ajamo) -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: MSDS Cyantek.pdf Type: application/pdf Size: 550684 bytes Desc: not available URL: From security at onlinepaypal.com Tue Oct 3 22:24:31 2006 From: security at onlinepaypal.com (PayPal) Date: 4 Oct 2006 06:24:31 +0100 Subject: Update your PayPal records Message-ID: <20061004052431.19032.qmail@neteuropa.co.uk> An HTML attachment was scrubbed... URL: From service at paypal.com Tue Oct 3 23:22:19 2006 From: service at paypal.com (Paypal Inc.) Date: Wed, 4 Oct 2006 08:22:19 +0200 Subject: Activate Your PayPal Account! Message-ID: <1159942939.16393.qmail@paypal.com> An HTML attachment was scrubbed... URL: From chris.detrick at global-fab.com Wed Oct 4 00:53:24 2006 From: chris.detrick at global-fab.com (Chris Detrick & David Lee) Date: Wed, 4 Oct 2006 03:53:24 -0400 (EDT) Subject: October Equipment from G-Fab Message-ID: <1101417808912.1101401002153.9044.6.90350C9@scheduler> Global Fab Surplus October Key Equipment Sale October 03, 2006 Greetings! G-Fab is proud to announce that we have the following key equipment available for immediate sale. ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Equipment listing * Speedfam/IPEC 676 CMP (2 available for $50K total) * Keithly S900 (2 available) * ASML 300 DUV (call or email for details) * Applied Materials Centura II DPS+ * ASML 2500/40 * KLA Tencor Prometrix FT-750 * Rudolph METAPULSE 200 * TEL Alpha 8SE furnace * TEL Mark II Developer * TEL Act 8 Clean track If any of these tools are of interest please contact us for more details. We also offer a complete line of new bellows, Ferrofluidic Seals, Spindles and Subassemblies, and complete Clean - Repair and Refurbishment services on ASTEX/MKS Remote Plasma Source and the WJ heated box. For a complete list of equipment click here - http://rs6.net/tn.jsp?t=qab7zybab.0.wsd6mybab.jfe8jybab.9044&ts=S0208&p=http%3A%2F%2Fwww.global-fab.com%2F15.html ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Equipment Wanted G-Fab is always looking for equipment that our customers have a need for. We would be happy to help you dispose of your surplus equipment. Curriently we have open RFQ's for the following tools. If you have any of these available please contact us immediatly. * WJ 1000H BPSG * Applied Materials Endura's * Back Grinder (100mm -200mm capable with a 2 step process) * TEL IW 6C * OnTrak DSS Series II * DNS SS-W60A - dual sided scrubber * DNS SS-W80A - dual sided scrubber * TEL Unity M, 85TD Thank you for your time. I hope you find our services and support beneficial. Please feel free to forward this email to whom ever you feel would benefit. Just click on the forward link below. Sincerely, Chris Detrick & David Lee G-Fab ------------------------------------------------------------ email: chris.detrick at global-fab.com phone: (805) 215-9188 web: http://www.global-fab.com ------------------------------------------------------------ Forward email http://ui.constantcontact.com/sa/fwtf.jsp?m=1101401002153&ea=specmat%40snf.stanford.edu&a=1101417808912 This email was sent to specmat at snf.stanford.edu, by chris.detrick at global-fab.com Update Profile/Email Address http://ui.constantcontact.com/d.jsp?p=oo&m=1101401002153&ea=specmat%40snf.stanford.edu&se=9044&t=1101417808912&lang=en&reason=F Instant removal with SafeUnsubscribe(TM) http://ui.constantcontact.com/d.jsp?p=un&m=1101401002153&ea=specmat%40snf.stanford.edu&se=9044&t=1101417808912&lang=en&reason=F Privacy Policy: http://ui.constantcontact.com/roving/CCPrivacyPolicy.jsp Global Fab Surplus | 1344 Ironbark Street | San Luis Obispo | CA | 93401 -------------- next part -------------- An HTML attachment was scrubbed... URL: From mahnaz at stanford.edu Fri Oct 6 11:35:55 2006 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Fri, 06 Oct 2006 11:35:55 -0700 Subject: Req.Approval SIPR 7123M-20 + MSDS In-Reply-To: <100220061800.17013.452153AF000ED68F00004275220075078401030E06979B9D0E@comcast.net> References: <100220061800.17013.452153AF000ED68F00004275220075078401030E06979B9D0E@comcast.net> Message-ID: <4526A20B.10708@stanford.edu> artyjamo at comcast.net wrote: > > Hello Spec-Mat Committee, > > I would like to bring in a new photoresist made by Shin-etsu Micro Si > called SIPR 7123M -20. > > This is a high viscosity positive photoresist for 15-70 um thick > coatings. I would > like to bring in an 8oz bottle (like those that are issued in the > SNF stockroom) and keep it in the small flammables > cabinet, along with the other SNF members resist samples. I would be > using these resists to coat my substrates on the Headway spinner (15 > to 80 > um thick) and softbaking them on the hotplates that are immediately to > the > right of the Headway spinner. I would like to expose the coated > substrates on the Karl Suss aligners, and develop the patterns in LDD-26W > at the develop bench in the litho area. Used developer would go down > the drain in the develop bench. Any waste of these resists would be put > in the solvent waste carboy in the Solvent bench. Any clean > roomwipes contaminated with this resist, empty bottles with resist > resid ues would be bagged and put in the solid chemical waste bin in > the Litho area. > > I am attaching a soft copy of the MSDS sheet > > Please let me know ASAP if I can bring this sample in for use. > > Much Thanks, > > Aleta Jamora (ajamo) Hi Aleta, SpecMat has reviewed and approved your request. I think this is a better substitute for the other resist presently used and you know the routine well so stop by and get the yellow labels and the bar-code. mahnaz From edmyers at stanford.edu Tue Oct 10 10:38:09 2006 From: edmyers at stanford.edu (Ed Myers) Date: Tue, 10 Oct 2006 10:38:09 -0700 Subject: SpecMat Logsheet, 10/10/06 Message-ID: <6.2.5.6.2.20061010103030.039aefa8@stanford.edu> All, Here is the specmat logsheet for this week. Sounds like a number of conflicts for the meeting, so we will not hold a meeting this week. Semiclean W or Ni from IBM : Still waiting for response. Nb etching in Drytek or MRC: Jim McVittie has been working with the student for etch capability. poly(ethylene oxide-b-methylmethacrylate-b-sytrene): Should be approved. Material is being processed down the gold contaminated equipment set. Brewer Science WaferBond: Asking for more information regarding the process. The request is only for Matrix ashing, but he does not define where the material is deposited or cured. If they only want the Matrix, it should be OK. PMMA Processing: Should be approved. Material is being processed down the gold contaminated equipment set. CA-40 Cleaning solution : I will confirm with Mahnaz, but should be OK. Shin-etsu Micro Si called SIPR 7123M -20 : Approved by Mahnaz -------------- next part -------------- A non-text attachment was scrubbed... Name: SpecMat Logsheet.xls Type: application/octet-stream Size: 203776 bytes Desc: not available URL: From ForStudents at academic-software-outlet.com Thu Oct 12 08:45:41 2006 From: ForStudents at academic-software-outlet.com (Computer Products) Date: Thu, 12 Oct 2006 11:45:41 -0400 Subject: Student, Teacher, School - Academic Software Discounts Message-ID: <56e04eb1ac8ea8fc12438caedd3313@bmw> Adobe Web Bundle 2.0 at 69% OFF, Macromedia Dreamvweaver 8 at 52% OFF, Microsoft Office 2003 Professional at 60% OFF, Adobe InDesign CS2 4.0 at 72% OFF, Corel WordPerfect Office 12 at 67% OFF, !!!!!!BACK-TO-SCHOOL EDUCATIONAL SOFTWARE SALE!!!!!!!!!!! **** EXCLUSIVELY available to Qualified Faculty, Staff, and Students of Higher Education and K-12 institutions.(see below for details) **** COMPUTER PRODUCTS FOR EDUCATION is pleased to offer to qualified students, faculty, and staff, the best prices and service on all ACADEMIC EDITION SOFTWARE from MICROSOFT, MACROMEDIA, ADOBE, MACROMEDIA, SYMANTEC, COREL, AUTODESK, ENDNOTE, FILEMAKER, and MANY OTHER MAJOR SOFTWARE MANUFACTURERS - AT DISCOUNTS UP TO 91% OFF COMMERCIAL RETAIL PRICES!!! 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From hmkang at stanford.edu Mon Oct 16 23:17:25 2006 From: hmkang at stanford.edu (Hee Min Kang) Date: Mon, 16 Oct 2006 23:17:25 -0700 Subject: Use of "Ammonium Dichromate" as a photosensitizer in litho process Message-ID: To whom may concern: My name is Hee Min and I am a Ph.D. student in Materials Science and Engineering department. I'd like to know if I could use Ammonium dichromate as a photosensitizer in litho process. The lithography process is described in the paper which I have attached in this e-mail. I'd like to use a water-based solution of polyvinyl alcohol(PVA) with ammonium dichromate photosensitizer to be spun onto the polytehylene naphthalate(PEN) substrate. Then I'd like to expose it with UV using chrome mask and develop it in water. Since this is my first time to submit this request, if you need some more info, please let me know. Thanks so much in advance, Hee Min -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: A_D circuits on polyester substrates.pdf Type: application/pdf Size: 54772 bytes Desc: not available URL: From bwchui at gmail.com Tue Oct 17 10:40:55 2006 From: bwchui at gmail.com (Ben Chui) Date: Tue, 17 Oct 2006 10:40:55 -0700 Subject: Followup to ZnSe request Message-ID: Hi all, On behalf of A.M.Fitzgerald and Associates, I'd like to follow up on our ZnSe request as follows, with a modified process: All ZnSe islands (deposited through a shadow mask at external vendors) will be fully encapsulated with LTO and/or sputtered silicon (both deposited at external vendors as well) before the wafers are brought back into the fab. From this point onwards, the ZnSe will NOT be exposed to the outside world at all during any subsequent litho and etching steps. Etching of other regions of the wafer will be restricted to the MRC and/or drytek4, and wbgeneral (using our own glassware). We'll be glad to do a TXRF analysis of a ZnSe sample if necessary. Please let us know if this is acceptable. Thanks, Ben Chui A.M.Fitzgerald and Associates From agibby at stanford.edu Tue Oct 17 12:37:00 2006 From: agibby at stanford.edu (Aaron Matthew Gibby) Date: Tue, 17 Oct 2006 12:37:00 -0700 Subject: Germanium Antimony Telluride Message-ID: <1161113820.453530dc5d647@webmail.stanford.edu> Dear Specmat Members, I would like to etch germanium antimony telluride in SNF. Attached is my detailed information. Here are the URLs for the appropriate MSDSs: http://www.alfa.com/CGI-BIN/LANSAWEB?WEBEVENT+L0C0022074AC90000B273052+ALF+ENG http://www.alfa.com/CGI-BIN/LANSAWEB?WEBEVENT+L0C00240F4D9985000D93061+ALF+ENG Feel free to contact me with any questions. Aaron -------------- next part -------------- A non-text attachment was scrubbed... Name: SPECMAT Approval Form.doc Type: application/msword Size: 30720 bytes Desc: not available URL: From mcvittie at cis.Stanford.EDU Tue Oct 17 12:46:00 2006 From: mcvittie at cis.Stanford.EDU (Jim McVittie) Date: Tue, 17 Oct 2006 12:46:00 -0700 (PDT) Subject: Germanium Antimony Telluride In-Reply-To: <1161113820.453530dc5d647@webmail.stanford.edu> Message-ID: Aaron, I suggest you give a more details about what you want to do. In particular, it would be useful to know how much material you want to remove and what pattern resolution you need. I believe you have info on both F and Cl based etching of this materail. I suspect you are thinking in terms of using the MRC or one of the Dryteks. If this is the case, you should say so. Thanks, Jim On Tue, 17 Oct 2006, Aaron Matthew Gibby wrote: > Dear Specmat Members, > > I would like to etch germanium antimony telluride in SNF. Attached is my > detailed information. Here are the URLs for the appropriate MSDSs: > > http://www.alfa.com/CGI-BIN/LANSAWEB?WEBEVENT+L0C0022074AC90000B273052+ALF+ENG > http://www.alfa.com/CGI-BIN/LANSAWEB?WEBEVENT+L0C00240F4D9985000D93061+ALF+ENG > > Feel free to contact me with any questions. > > Aaron -- -------------------------------------------------------------- Jim McVittie, Ph.D. Senior Research Scientist Allen Center for Integrated Systems Electrical Engineering Stanford University jmcvittie at stanford.edu Rm. 336, 330 Serra Mall Fax: (650) 723-4659 Stanford, CA 94305-4075 Tel: (650) 725-3640 From agibby at stanford.edu Tue Oct 17 13:03:45 2006 From: agibby at stanford.edu (Aaron Matthew Gibby) Date: Tue, 17 Oct 2006 13:03:45 -0700 Subject: Germanium Antimony Telluride In-Reply-To: References: Message-ID: <1161115425.45353721ccf55@webmail.stanford.edu> Jim, Thanks for the prompt reply. I have edited the attached file to make my request more clear. Aaron Quoting Jim McVittie : > Aaron, > > I suggest you give a more details about what you want to do. In > particular, it would be useful to know how much material you want to > remove and what pattern resolution you need. I believe you have info on > both F and Cl based etching of this materail. I suspect you are thinking > in terms of using the MRC or one of the Dryteks. If this is the case, you > should say so. > > Thanks, Jim > > On Tue, 17 Oct 2006, Aaron Matthew Gibby wrote: > > > Dear Specmat Members, > > > > I would like to etch germanium antimony telluride in SNF. Attached is > my > > detailed information. Here are the URLs for the appropriate MSDSs: > > > > > http://www.alfa.com/CGI-BIN/LANSAWEB?WEBEVENT+L0C0022074AC90000B273052+ALF+ENG > > > http://www.alfa.com/CGI-BIN/LANSAWEB?WEBEVENT+L0C00240F4D9985000D93061+ALF+ENG > > > > Feel free to contact me with any questions. > > > > Aaron > > -- > -------------------------------------------------------------- > Jim McVittie, Ph.D. Senior Research Scientist > Allen Center for Integrated Systems Electrical Engineering > Stanford University jmcvittie at stanford.edu > Rm. 336, 330 Serra Mall Fax: (650) 723-4659 > Stanford, CA 94305-4075 Tel: (650) 725-3640 > > > -------------- next part -------------- A non-text attachment was scrubbed... Name: SPECMAT Approval Form.doc Type: application/msword Size: 31232 bytes Desc: not available URL: From edmyers at stanford.edu Wed Oct 18 13:59:19 2006 From: edmyers at stanford.edu (Ed Myers) Date: Wed, 18 Oct 2006 13:59:19 -0700 Subject: Fwd: Re: Teflon Process step In-Reply-To: <20061017165310.46113.qmail@web60016.mail.yahoo.com> References: <20061017165310.46113.qmail@web60016.mail.yahoo.com> Message-ID: <6.2.5.6.2.20061018135815.026bdbc0@stanford.edu> Harshal, Do you have the MSDS for this chemical? Regards, At 09:53 AM 10/17/2006, you wrote: >Hi Ed, > >This is with regards to your email (see below) to Erhan a few weeks >ago regarding TeflonAF use in the lab. > >The TeflonAF we plan to use is already mixed with a water-like, >non-toxic solvent, FC75 (from 3M) to a certain concentration, 6% by >wt, in this case. We want to dilute it more (~1%) for our process in >order to have thinner films. > >I wanted to request permission to take FC75 in the lab for this >purpose. Please refer to this >data >sheet. > >Please let me know how we can proceed. > >Thank you. > >Best regards, >Harshal. > >Erhan Ata wrote: >Date: Mon, 28 Aug 2006 16:35:10 -0700 (PDT) >From: Erhan Ata >Subject: Fwd: Re: Process step >To: zlwan at yahoo.com, 'Erhan Ata' , >Harshal Surangalikar , Mark Wang , >'George Wu' , 'nan zhang' > >Hi all, >In case we want to use teflon in SNF, we've received an approval for >spinning and patterning it with O2 plasma. Of course we'll be >limited to gold contaminated equipment. > >Erhan > >Ed Myers wrote: >Date: Mon, 28 Aug 2006 16:04:08 -0700 >To: Erhan Ata >From: Ed Myers >Subject: Re: Process step >CC: Mahnaz Mansourpour ,mtang at snf.stanford.edu, >rissman at snf.stanford.edu > >Erhan, > >SpecMat has reviewed and approved your request. > >I looked over the specmat archives have and did not find anything >related to teflon processing. Your material can be processed through >the gold contaminated equipment. I do not know how effective the O2 >etch will be. You will have massive photoresist loss which could >make this a challenging process step. > >Regards, > > >At 09:07 AM 8/23/2006, Mahnaz Mansourpour wrote: > >Hi Erhan, > > > >I am forwarding your email to specmat committee, we have ok teflon > >use in the past to be spun only on headway and the same treatment > >of SU8 meaning that do not use any of litho cassette and ...etc. > >Let see if Ed has more info on this as he is the one who keeps track > >of the data base. > > > >mahnaz > > > > > > From kevhuang at stanford.edu Fri Oct 20 16:23:32 2006 From: kevhuang at stanford.edu (Kevin Huang) Date: Fri, 20 Oct 2006 16:23:32 -0700 Subject: KOH decontamination and TylanPoly questions Message-ID: <93586f8c0610201623j5fa4ce73oeaf482601bf5c8b1@mail.gmail.com> Hi, I have two questions: 1) Why is no matter allowed in the KOH decontamination process? Is it because KOH usually attacks metal? What if the metals are capped by oxide, will this be allowed to go through the decontamination procedure? 2) Tystar used to be a semi-clean poly deposition tool but I heard it's no longer in the fab. Can the tylanPoly tube take wafers with tungsten on them or is there other metal-compatible poly deposition machine? Thanks. Kevin -- ================================== Kevin Huang Ph.D. Candidate Stanford Organic Electronics Lab Dept. of Electrical Engineering Email: kevhuang at stanford.edu Phone: (650) 725-6924 ================================== -------------- next part -------------- An HTML attachment was scrubbed... URL: From edmyers at stanford.edu Tue Oct 24 08:32:12 2006 From: edmyers at stanford.edu (Ed Myers) Date: Tue, 24 Oct 2006 08:32:12 -0700 Subject: SpecMat, 10/24/06 Message-ID: <6.2.5.6.2.20061024082904.04187ca8@stanford.edu> All, We have a couple of items on this weeks agenda. I propose we go ahead and hold our meeting at 1:30 today in CIS101. It should be quick. Regards, Ed -------------- next part -------------- A non-text attachment was scrubbed... Name: SpecMat Logsheet.xls Type: application/octet-stream Size: 207872 bytes Desc: not available URL: From mtang at stanford.edu Tue Oct 24 08:58:14 2006 From: mtang at stanford.edu (Mary Tang) Date: Tue, 24 Oct 2006 08:58:14 -0700 Subject: SpecMat, 10/24/06 In-Reply-To: <6.2.5.6.2.20061024082904.04187ca8@stanford.edu> References: <6.2.5.6.2.20061024082904.04187ca8@stanford.edu> Message-ID: <453E3816.7060904@stanford.edu> Hi Ed, et al - My comments: #190: Given that Rohit and IBM are not entirely happy with us these days, what can we do to somehow involve them in the SpecMat process of this request? I think it is way to easy for them to say that we are stonewalling them on this, even though we believe the ball is in their court... #218: I think he is doing a modification of a standard photography process. Ammonium Chromate is toxic and strong oxidizer. It should be collected locally, and should not be used anywhere solvents and resists are likely to be used. He should indicate where he's getting his chemicals and include an MSDS. I think you can buy commercially available, pre-mixed, dilute solutions (like 1%) which are then not likely to pose any mixing hazards in our lab. This would be preferred. By the way, I'm not sure why this chemical is considered a sensitizer -- I'm no chemist, but I think it's more of an inhibitor or developer of some sort... It would be good to see his protocol. #219/#220: These seem to be OK to me.... #221: I think we may need to do a little better on our clean documentation (and you'd know that Kevin would ask this...) One of us should sit down with him and explain to him what contamination means.... By the way, Nancy and/or Jim probably have a much clearer memory of this... We used have tylanpoly as a semiclean tube. And we have operated it as a clean tube, but would allow semiclean processing, provided a doped poly capping layer was run subsequent to the semiclean run. I don't believe we ever ran with metal-film-containing wafers, however; just wafers which had been exposed to metals (and then removed) or semiclean equipment. (This was Randy True did, I think....) So, I don't recall that we ever ran poly dep on top of pure metals (though maybe silicides...) Ed Myers wrote: > All, > > We have a couple of items on this weeks agenda. I propose we go ahead > and hold our meeting at 1:30 today in CIS101. It should be quick. > > Regards, > > Ed From amf at amfitzgerald.com Tue Oct 24 17:53:53 2006 From: amf at amfitzgerald.com (Alissa M. Fitzgerald) Date: Tue, 24 Oct 2006 17:53:53 -0700 Subject: Followup to ZnSe request In-Reply-To: Message-ID: <009c01c6f7d0$0bb53100$6501a8c0@minicat> Hi SpecMat, Please let us know how soon you might have an answer for us on this inquiry. I don't mean to be a pest, as I know you don't meet every week, but it would be very helpful to know how soon we might have a verdict, or if you are going to need further input from us to reach a verdict. We're doing a significant amount of planning for this project and some critical decisions are hinging on your final verdict. Please let us know if you have any questions. Best regards, Alissa 650 592 6100 > -----Original Message----- > From: Ben Chui [mailto:bwchui at gmail.com] > Sent: Tuesday, October 17, 2006 10:41 AM > To: specmat at snf.stanford.edu > Cc: Alissa M. Fitzgerald > Subject: Followup to ZnSe request > > Hi all, > > On behalf of A.M.Fitzgerald and Associates, I'd like to > follow up on our ZnSe request as follows, with a modified process: > > All ZnSe islands (deposited through a shadow mask at external > vendors) will be fully encapsulated with LTO and/or sputtered > silicon (both deposited at external vendors as well) before > the wafers are brought back into the fab. From this point > onwards, the ZnSe will NOT be exposed to the outside world at > all during any subsequent litho and etching steps. Etching > of other regions of the wafer will be restricted to the MRC > and/or drytek4, and wbgeneral (using our own glassware). > > We'll be glad to do a TXRF analysis of a ZnSe sample if necessary. > > Please let us know if this is acceptable. > > Thanks, > > Ben Chui > A.M.Fitzgerald and Associates > From pvandorp at imec.be Wed Oct 25 14:41:02 2006 From: pvandorp at imec.be (Van Dorpe Pol) Date: Wed, 25 Oct 2006 23:41:02 +0200 Subject: Bringing in Si and GaAs pieces in the lab. Message-ID: <38C0C9E3083ADB42BFFFC6C2A8B012CE04DDFFF3@WINEX2.imec.be> Dear Mr/Ms, I just had the general safety tour and the all-litho tour. Coral login: vandorpe, phone number: 650 3915548 I am in stanford as a visiting scholar in the group of Mark Brongersma. I have brought some samples with me from Imec, Belgium (www.imec.be), that I would like to process in the SNF lab. I have 4 kinds of samples: 1. one GaAs quarter: (an AlGaAs/GaAs heterostructure, covered with Al2O3 and Ge) 2. 6 pieces of Si/(thermally grown) SiO2, covered with a protective layer of resist. These samples have been processed (i.e. grown and diced) in the Imec clean room (the CMOS compatible production line) 3. 4 pieces of Si/SiO2/Al2O3, covered with a protective layer of resist. These samples have also been processed (grown and diced) in the Imec clean room: the SiO2 is thermally grown, while the Al2O3 (8A) is deposited by atomic layer deposition. Everything also in the CMOS compatible production line 4. 6 pieces of processed Si/SiO2/Au wafers. These contain Au and have been processed in the III-V part of the Imec cleanroom The processing that I want to do involve optical lithography, a wet oxidation (LOCOS - with a Ge hard mask), e-beam lithography and Au deposition (2 times) Can I bring these pieces with me? Best regards, Pol Van Dorpe ============================================ Dr. ir. Pol Van Dorpe Imec- MCP/ART Currently active in Stanford as a visiting scholar in the group of Prof. Mark Brongersma (GLAM, Mat. Science & Eng. Dept.) Phone: +32 16 28 10 26 Fax: +32 16 28 15 01 E-mail: Pol.Vandorpe at imec.be IMEC vzw - Register of Legal Entities Leuven VAT BE 0425.260.668 - Kapeldreef 75, B-3001 Leuven, Belgium - http://www.imec.be =========================================== From jimkruger at yahoo.com Sun Oct 29 16:48:59 2006 From: jimkruger at yahoo.com (jim kruger) Date: Sun, 29 Oct 2006 16:48:59 -0800 (PST) Subject: PolyVinylPhenol already spun, baked on wafers Message-ID: <20061030004859.52450.qmail@web38908.mail.mud.yahoo.com> Request to bring PVP, already baked on wafers, into SNF for processing. Proposed process flow and MSDS for PVP and cross-linker are attached. jimkruger __________________________________________________ Do You Yahoo!? Tired of spam? Yahoo! Mail has the best spam protection around http://mail.yahoo.com -------------- next part -------------- An embedded and charset-unspecified text was scrubbed... Name: PVP_MSDS.txt URL: -------------- next part -------------- An embedded and charset-unspecified text was scrubbed... Name: PVP_crosslinker.txt URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: SpecMat-PVP2.xls Type: application/vnd.ms-excel Size: 14848 bytes Desc: 1327539525-SpecMat-PVP2.xls URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: SpecMat-PVP.doc Type: application/msword Size: 49152 bytes Desc: 2709381399-SpecMat-PVP.doc URL: From info at fabsurplus.com Tue Oct 31 03:48:41 2006 From: info at fabsurplus.com (info at fabsurplus.com) Date: Tue, 31 Oct 2006 12:48:41 +0100 (CET) Subject: fabsurplus.com used equipment listing 31/October/06 Message-ID: <1141922.1162311769064.JavaMail.root@flavio.tower> Dear All, Please find attached in an excel spreadsheet our WAFER FAB ASSEMBLY, SMT AND TEST EQUIPMENT sales list for 31st October 2006. SDI Semiconductor Instruments Group brokers and supports Semiconductor Fab/Assembly/SMT equipment from it's offices in Italy, Ireland and the USA. We are committed to providing accurate and professional help to clients looking to buy and sell used I.C.making equipment. SDI NEWS -------- SDI Group has expanded it's sales team in the USA by appointment of Randall Copeland as Sales Manager for the Western USA. 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Meath, Ireland Tel: Ireland (353) 4694 38804 Mobile: Ireland (353) 872 985 561 Fax: Ireland (353) 4694 86893 ollie.dunne at fabsurplus.com Skype: sdiireland Michael Fortune SDI Semiconductor Instruments Ireland Limited 7, Friarspark, Trim, Co. Meath, Ireland Tel: Ireland (353) 4694 31951 Mobile: Ireland (353) 879150198 Mike Murehead SDI Fabsurplus LLC Georgetown, TX 78628 Tel: 512-635-8027 Fax: 801-217-6104 mike at fabsurplus.com Skype: sditexas Randall Copeland SDI Fabsurplus LLC Beaverton, Oregon Tel: (503) 523-7027 Fax: (801) 217-6104 support at fabsurplus.com Contact us now to buy and sell used equipment and enjoy the benefits of cost-saving. This message may be considered an advertisement or solicitation. If you would like to opt-out of receiving future commercial email marketing messages from SDI Group , Please reply to this message with the word "remove" in the subject line.If you reply from an e-mail address different from the one you wish to unsubscribe, please send us also the e-mail address you wish to unsubscribe. -------------- next part -------------- A non-text attachment was scrubbed... Name: Fabsurplus_Sales_31_Oct_06.xls Type: application/vnd.ms-excel Size: 493056 bytes Desc: not available URL: From mtang at stanford.edu Tue Oct 31 14:31:32 2006 From: mtang at stanford.edu (Mary Tang) Date: Tue, 31 Oct 2006 14:31:32 -0800 Subject: PolyVinylPhenol already spun, baked on wafers In-Reply-To: <20061030004859.52450.qmail@web38908.mail.mud.yahoo.com> References: <20061030004859.52450.qmail@web38908.mail.mud.yahoo.com> Message-ID: <4547CEC4.2090606@stanford.edu> Hi all -- I understand from Jim Kruger that this request has been changed slightly. The request is now to spin coat this material at the headway and heat cure on a hot plate. The questions now with this new request change are: 1. Is there a solvent that this polymer is dispersed in? If so, what is it and could we have the MSDS? 2. Is the crosslinker a high MW compound? If so, then I take it we don't have to worry about vapors and TLV? 3. What is the crosslinking reaction byproduct? Is it formaldehyde? If so, what kind of concentrations might be expected? Basically, one general rule of thumb for organics is that we try to keep to chemicals with toxicity less than that of chlorobenzene... So, if you could tell us a little more about your process and the chemistry involved (well, actually, the potential exposure risks involved) it would be extremely helpful... Thanks! Mary jim kruger wrote: > Request to bring PVP, already baked on wafers, into > SNF for processing. Proposed process flow and MSDS > for PVP and cross-linker are attached. > > jimkruger > > __________________________________________________ > Do You Yahoo!? > Tired of spam? Yahoo! Mail has the best spam protection around > http://mail.yahoo.com > ------------------------------------------------------------------------ > > Valid 08/2002 - 10/2002 > > Aldrich Chemical Co., Inc. > 1001 West St. Paul > Milwaukee, WI 53233 USA > Phone: 414-273-3850 > > > > > > M A T E R I A L S A F E T Y D A T A S H E E T > > SECTION 1. - - - - - - - - - CHEMICAL IDENTIFICATION- - - - - - - - - - > CATALOG #: 436216 > NAME: POLY(4-VINYLPHENOL), AVERAGE MW CA. 8,000 > SECTION 2. - - - - - COMPOSITION/INFORMATION ON INGREDIENTS - - - - - - > CAS #: 24979-70-2 > SECTION 3. - - - - - - - - - - HAZARDS IDENTIFICATION - - - - - - - - - > LABEL PRECAUTIONARY STATEMENTS > IRRITANT > IRRITATING TO EYES. > IN CASE OF CONTACT WITH EYES, RINSE IMMEDIATELY WITH PLENTY OF > WATER AND SEEK MEDICAL ADVICE. > WEAR SUITABLE PROTECTIVE CLOTHING. > SECTION 4. - - - - - - - - - - FIRST-AID MEASURES- - - - - - - - - - - > IN CASE OF CONTACT, IMMEDIATELY FLUSH EYES WITH COPIOUS AMOUNTS OF > WATER FOR AT LEAST 15 MINUTES. > IN CASE OF CONTACT, IMMEDIATELY WASH SKIN WITH SOAP AND COPIOUS > AMOUNTS OF WATER. > IF INHALED, REMOVE TO FRESH AIR. IF NOT BREATHING GIVE ARTIFICIAL > RESPIRATION. IF BREATHING IS DIFFICULT, GIVE OXYGEN. > IF SWALLOWED, WASH OUT MOUTH WITH WATER PROVIDED PERSON IS CONSCIOUS. > CALL A PHYSICIAN. > WASH CONTAMINATED CLOTHING BEFORE REUSE. > SECTION 5. - - - - - - - - - FIRE FIGHTING MEASURES - - - - - - - - - - > EXTINGUISHING MEDIA > WATER SPRAY. > CARBON DIOXIDE, DRY CHEMICAL POWDER OR APPROPRIATE FOAM. > SPECIAL FIREFIGHTING PROCEDURES > WEAR SELF-CONTAINED BREATHING APPARATUS AND PROTECTIVE CLOTHING TO > PREVENT CONTACT WITH SKIN AND EYES. > UNUSUAL FIRE AND EXPLOSIONS HAZARDS > EMITS TOXIC FUMES UNDER FIRE CONDITIONS. > SECTION 6. - - - - - - - - ACCIDENTAL RELEASE MEASURES- - - - - - - - - > WEAR RESPIRATOR, CHEMICAL SAFETY GOGGLES, RUBBER BOOTS AND HEAVY > RUBBER GLOVES. > SWEEP UP, PLACE IN A BAG AND HOLD FOR WASTE DISPOSAL. > USE NONSPARKING TOOLS. > AVOID RAISING DUST. > VENTILATE AREA AND WASH SPILL SITE AFTER MATERIAL PICKUP IS COMPLETE. > SECTION 7. - - - - - - - - - - HANDLING AND STORAGE- - - - - - - - - - - > REFER TO SECTION 8. > SECTION 8. - - - - - - EXPOSURE CONTROLS/PERSONAL PROTECTION- - - - - - > CHEMICAL SAFETY GOGGLES. > COMPATIBLE CHEMICAL-RESISTANT GLOVES. > NIOSH/MSHA-APPROVED RESPIRATOR. > SAFETY SHOWER AND EYE BATH. > MECHANICAL EXHAUST REQUIRED. > AVOID INHALATION. > AVOID CONTACT WITH EYES, SKIN AND CLOTHING. > AVOID PROLONGED OR REPEATED EXPOSURE. > WASH THOROUGHLY AFTER HANDLING. > EYE IRRITANT. > KEEP TIGHTLY CLOSED. > PREVENT FORMATION OF STATIC ELECTRICITY. > STORE IN A COOL DRY PLACE. > SECTION 9. - - - - - - - PHYSICAL AND CHEMICAL PROPERTIES - - - - - - - > PHYSICAL PROPERTIES > SPECIFIC GRAVITY: 1.160 > SECTION 10. - - - - - - - - -STABILITY AND REACTIVITY - - - - - - - - - > STABILITY > STABLE. > INCOMPATIBILITIES > STRONG OXIDIZING AGENTS > HAZARDOUS COMBUSTION OR DECOMPOSITION PRODUCTS > TOXIC FUMES OF: > CARBON MONOXIDE, CARBON DIOXIDE > HAZARDOUS POLYMERIZATION > WILL NOT OCCUR. > SECTION 11. - - - - - - - - - TOXICOLOGICAL INFORMATION - - - - - - - - > ACUTE EFFECTS > MAY BE HARMFUL BY INHALATION, INGESTION, OR SKIN ABSORPTION. > CAUSES EYE IRRITATION. > MAY CAUSE SKIN IRRITATION. > MATERIAL MAY BE IRRITATING TO MUCOUS MEMBRANES AND UPPER > RESPIRATORY TRACT. > TO THE BEST OF OUR KNOWLEDGE, THE CHEMICAL, PHYSICAL, AND > TOXICOLOGICAL PROPERTIES HAVE NOT BEEN THOROUGHLY INVESTIGATED. > SECTION 12. - - - - - - - - - ECOLOGICAL INFORMATION - - - - - - - - - - > DATA NOT YET AVAILABLE. > SECTION 13. - - - - - - - - - DISPOSAL CONSIDERATIONS - - - - - - - - - > DISSOLVE OR MIX THE MATERIAL WITH A COMBUSTIBLE SOLVENT AND BURN IN A > CHEMICAL INCINERATOR EQUIPPED WITH AN AFTERBURNER AND SCRUBBER. > OBSERVE ALL FEDERAL, STATE AND LOCAL ENVIRONMENTAL REGULATIONS. > SECTION 14. - - - - - - - - - - TRANSPORT INFORMATION - - - - - - - - - > CONTACT ALDRICH CHEMICAL COMPANY FOR TRANSPORTATION INFORMATION. > SECTION 15. - - - - - - - - - REGULATORY INFORMATION - - - - - - - - - - > EUROPEAN INFORMATION > CAUTION: SUBSTANCE NOT YET FULLY TESTED. > IRRITANT > R 36 > IRRITATING TO EYES. > S 26 > IN CASE OF CONTACT WITH EYES, RINSE IMMEDIATELY WITH PLENTY OF > WATER AND SEEK MEDICAL ADVICE. > S 36 > WEAR SUITABLE PROTECTIVE CLOTHING. > SECTION 16. - - - - - - - - - - OTHER INFORMATION- - - - - - - - - - - - > THE ABOVE INFORMATION IS BELIEVED TO BE CORRECT BUT DOES NOT PURPORT TO > BE ALL INCLUSIVE AND SHALL BE USED ONLY AS A GUIDE. SIGMA, ALDRICH, > FLUKA SHALL NOT BE HELD LIABLE FOR ANY DAMAGE RESULTING FROM HANDLING > OR FROM CONTACT WITH THE ABOVE PRODUCT. SEE REVERSE SIDE OF INVOICE OR > PACKING SLIP FOR ADDITIONAL TERMS AND CONDITIONS OF SALE. > COPYRIGHT 2001 SIGMA-ALDRICH CO. > LICENSE GRANTED TO MAKE UNLIMITED PAPER COPIES FOR INTERNAL USE ONLY > > > > > > > > > > > ------------------------------------------------------------------------ > > Product #: 418552 Name: POLY(MELAMINE-CO-FORMALDEHYDE), METHYLATED > Material Safety Data Sheet, Valid Dates 2/2004- 4/2004 > Printed 19/07/2006 04:59 > > > Sigma-Aldrich Pty, Ltd > Unit 2, 14 Anella Avenue > Castle Hill NSW 1765 > Australia > Technical Phone: +61 2 9841 0555 > Fax: +61 2 9841 0500 > Emergency Phone: +61 2 9841 0566 > > > SECTION 1. - - - - - - - - - CHEMICAL IDENTIFICATION- - - - - - - - - - > CATALOG #: 418552 > NAME: POLY(MELAMINE-CO-FORMALDEHYDE), METHYLATED > SECTION 2. - - - - - COMPOSITION/INFORMATION ON INGREDIENTS - - - - - - > CAS #: 68002-20-0 > ADDITIONAL INFORMATION > CONTAINS FORMALDEHYDE, CHEMICAL ABSTRACTS REGISTRY NUMBER 50-00-0. > SYNONYMS > CYMEL 481 RESIN * > SECTION 3. - - - - - - - - - - HAZARDS IDENTIFICATION - - - - - - - - - > LABEL PRECAUTIONARY STATEMENTS > TOXIC > MAY CAUSE SENSITIZATION BY SKIN CONTACT. > MAY CAUSE HERITABLE GENETIC DAMAGE. > IRRITATING TO EYES, RESPIRATORY SYSTEM AND SKIN. > MAY CAUSE CANCER. > DO NOT BREATHE VAPOR. > WEAR SUITABLE PROTECTIVE CLOTHING, GLOVES AND EYE/FACE > PROTECTION. > IN CASE OF ACCIDENT OR IF YOU FEEL UNWELL, SEEK MEDICAL ADVICE > IMMEDIATELY (SHOW THE LABEL WHERE POSSIBLE). > IN CASE OF CONTACT WITH EYES, RINSE IMMEDIATELY WITH PLENTY OF > WATER AND SEEK MEDICAL ADVICE. > SECTION 4. - - - - - - - - - - FIRST-AID MEASURES- - - - - - - - - - - > IN CASE OF CONTACT, IMMEDIATELY FLUSH EYES OR SKIN WITH COPIOUS > AMOUNTS OF WATER FOR AT LEAST 15 MINUTES WHILE REMOVING CONTAMINATED > CLOTHING AND SHOES. > IF SWALLOWED, WASH OUT MOUTH WITH WATER PROVIDED PERSON IS CONSCIOUS. > CALL A PHYSICIAN. > IF INHALED, REMOVE TO FRESH AIR. IF NOT BREATHING GIVE ARTIFICIAL > RESPIRATION. IF BREATHING IS DIFFICULT, GIVE OXYGEN. > SECTION 5. - - - - - - - - - FIRE FIGHTING MEASURES - - - - - - - - - - > EXTINGUISHING MEDIA > WATER SPRAY. > CARBON DIOXIDE, DRY CHEMICAL POWDER OR APPROPRIATE FOAM. > SPECIAL FIREFIGHTING PROCEDURES > WEAR SELF-CONTAINED BREATHING APPARATUS AND PROTECTIVE CLOTHING TO > PREVENT CONTACT WITH SKIN AND EYES. > USE WATER SPRAY TO COOL FIRE-EXPOSED CONTAINERS. > UNUSUAL FIRE AND EXPLOSIONS HAZARDS > EMITS TOXIC FUMES UNDER FIRE CONDITIONS. > CONTAINER EXPLOSION MAY OCCUR UNDER FIRE CONDITIONS. > SECTION 6. - - - - - - - - ACCIDENTAL RELEASE MEASURES- - - - - - - - - > EVACUATE AREA. > WEAR SELF-CONTAINED BREATHING APPARATUS, RUBBER BOOTS AND HEAVY > RUBBER GLOVES. > WEAR DISPOSABLE COVERALLS AND DISCARD THEM AFTER USE. > COVER WITH DRY LIME OR SODA ASH, PICK UP, KEEP IN A CLOSED CONTAINER > AND HOLD FOR WASTE DISPOSAL. > VENTILATE AREA AND WASH SPILL SITE AFTER MATERIAL PICKUP IS COMPLETE. > SECTION 7. - - - - - - - - - - HANDLING AND STORAGE- - - - - - - - - - - > REFER TO SECTION 8. > SECTION 8. - - - - - - EXPOSURE CONTROLS/PERSONAL PROTECTION- - - - - - > WEAR APPROPRIATE NIOSH/MSHA-APPROVED RESPIRATOR, CHEMICAL-RESISTANT > GLOVES, SAFETY GOGGLES, OTHER PROTECTIVE CLOTHING. > USE ONLY IN A CHEMICAL FUME HOOD. > SAFETY SHOWER AND EYE BATH. > DO NOT BREATHE VAPOR. > AVOID ALL CONTACT. > AVOID PROLONGED OR REPEATED EXPOSURE. > WASH THOROUGHLY AFTER HANDLING. > DISCARD CONTAMINATED CLOTHING AND SHOES. > SENSITIZER. > IRRITANT. > KEEP TIGHTLY CLOSED. > STORE IN A COOL DRY PLACE. > SECTION 9. - - - - - - - PHYSICAL AND CHEMICAL PROPERTIES - - - - - - - > APPEARANCE AND ODOR > VISCOUS, COLORLESS LIQUID > PHYSICAL PROPERTIES > FLASHPOINT >230 > SPECIFIC GRAVITY: 1.200 > SECTION 10. - - - - - - - - -STABILITY AND REACTIVITY - - - - - - - - - > INCOMPATIBILITIES > STRONG OXIDIZING AGENTS > HAZARDOUS COMBUSTION OR DECOMPOSITION PRODUCTS > CARBON MONOXIDE, CARBON DIOXIDE > NITROGEN OXIDES > METHANOL > FORMALDEHYDE > HAZARDOUS POLYMERIZATION > WILL NOT OCCUR. > SECTION 11. - - - - - - - - - TOXICOLOGICAL INFORMATION - - - - - - - - > ACUTE EFFECTS > CAUSES SKIN IRRITATION. > HARMFUL IF SWALLOWED, INHALED, OR ABSORBED THROUGH SKIN. > VAPOR OR MIST IS IRRITATING TO THE EYES, MUCOUS MEMBRANES AND UPPER > RESPIRATORY TRACT. > MAY CAUSE ALLERGIC SKIN REACTION. > CHRONIC EFFECTS > CARCINOGEN. > RTECS #: XZ1077000 > 1,3,5-TRIAZINE-2,4,6-TRIAMINE, POLYMER WITH FORMALDEHYDE, METHYLATED > TOXICITY DATA > ORL-RAT LD50:12300 UL/KG ATDAEI 1,158,1992 > ONLY SELECTED REGISTRY OF TOXIC EFFECTS OF CHEMICAL SUBSTANCES > (RTECS) DATA IS PRESENTED HERE. SEE ACTUAL ENTRY IN RTECS FOR > COMPLETE INFORMATION. > SECTION 12. - - - - - - - - - ECOLOGICAL INFORMATION - - - - - - - - - - > DATA NOT YET AVAILABLE. > SECTION 13. - - - - - - - - - DISPOSAL CONSIDERATIONS - - - - - - - - - > CONTACT A LICENSED PROFESSIONAL WASTE DISPOSAL SERVICE TO DISPOSE OF > THIS MATERIAL. > OBSERVE ALL FEDERAL, STATE AND LOCAL ENVIRONMENTAL REGULATIONS. > SECTION 14. - - - - - - - - - - TRANSPORT INFORMATION - - - - - - - - - > CONTACT ALDRICH CHEMICAL COMPANY FOR TRANSPORTATION INFORMATION. > SECTION 15. - - - - - - - - - REGULATORY INFORMATION - - - - - - - - - - > EUROPEAN INFORMATION > CAUTION: SUBSTANCE NOT YET FULLY TESTED. > TOXIC > R 43 > MAY CAUSE SENSITIZATION BY SKIN CONTACT. > R 46 > MAY CAUSE HERITABLE GENETIC DAMAGE. > R 36/37/38 > IRRITATING TO EYES, RESPIRATORY SYSTEM AND SKIN. > R 45 > MAY CAUSE CANCER. > S 23 > DO NOT BREATHE VAPOR. > S 36/37/39 > WEAR SUITABLE PROTECTIVE CLOTHING, GLOVES AND EYE/FACE > PROTECTION. > S 45 > IN CASE OF ACCIDENT OR IF YOU FEEL UNWELL, SEEK MEDICAL ADVICE > IMMEDIATELY (SHOW THE LABEL WHERE POSSIBLE). > S 26 > IN CASE OF CONTACT WITH EYES, RINSE IMMEDIATELY WITH PLENTY OF > WATER AND SEEK MEDICAL ADVICE. > TLV AND SOURCE > FOR FORMALDEHYDE: > ACGIH TLV-TWA: 1.0PPM(1.2 MG/M3); STEL: 2 PPM(2.5 MG/M3). > OSHA PEL: 8H TWA 0.75 PPM; STEL: 2 PPM. > REVIEWS, STANDARDS, AND REGULATIONS > OEL=MAK > NOES 1983: HZD X1229; NIS 18; TNF 450; NOS 18; TNE 14039; TFE 746 > EPA TSCA SECTION 8(B) CHEMICAL INVENTORY > EPA TSCA TEST SUBMISSION (TSCATS) DATA BASE, JANUARY 2001 > U.S. INFORMATION > 0.3% FORMALDEHYDE 50-00-0 > THIS PRODUCT IS SUBJECT TO SARA SECTION 313 REPORTING REQUIREMENTS. > SECTION 16. - - - - - - - - - - OTHER INFORMATION- - - - - - - - - - - - > THE ABOVE INFORMATION IS BELIEVED TO BE CORRECT BUT DOES NOT PURPORT TO > BE ALL INCLUSIVE AND SHALL BE USED ONLY AS A GUIDE. SIGMA, ALDRICH, > FLUKA SHALL NOT BE HELD LIABLE FOR ANY DAMAGE RESULTING FROM HANDLING > OR FROM CONTACT WITH THE ABOVE PRODUCT. SEE REVERSE SIDE OF INVOICE OR > PACKING SLIP FOR ADDITIONAL TERMS AND CONDITIONS OF SALE. > COPYRIGHT 2001 SIGMA-ALDRICH CO. > LICENSE GRANTED TO MAKE UNLIMITED PAPER COPIES FOR INTERNAL USE ONLY > > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu