Request to etch polymer

Shroff, Yashesh A yashesh.a.shroff at
Wed Sep 27 16:27:23 PDT 2006

Hi Jim,

You're right, the matrix does have heated chuck. Hoewver, I'd prefer to
run it with the pins up. Attached is an O2 plasma ash data of WaferBOND.
Unfortunately, I don't have the temp dependence data but I hope this
suffices to answer your last question. 


-----Original Message-----
From: Jim McVittie [mailto:mcvittie at cis.Stanford.EDU] 
Sent: Wednesday, September 27, 2006 4:06 PM
To: Shroff, Yashesh A
Cc: specmat at snf.Stanford.EDU
Subject: Re: Request to etch polymer


Do you have any info on the vapor pressure of Waferboond at a T of 180C.

In the Matrix the wafer is usually heated to about 180C if my memory is 
correct. You lower the temperature by running with the pins up but the 
etch is temperature dependent (Ea ~ 1 eV). If there are any metals in
glue/wax, they will be oxidized and will be hard to get off. Do you have

any data on anyone who has use a asher to strip Waferbond?

	Thanks, Jim  

On Wed, 27 Sep 2006, Shroff, Yashesh A wrote:

> Hi,
> I wish to ash a polymer called WaferBOND in the "dirty" asher. The
> polymer is made by BrewerScience. I have attached the MSDS for
> reference. Can I please get approval? Thanks :-)
> /yashesh
> Yashesh Shroff, PhD
> Advanced Programs Group, Litho CED, Intel Corporation
> Office: 408-765-7379 
> Fax: 408-765-3995
Jim McVittie, Ph.D.    			Senior Research Scientist 
Allen Center for Integrated Systems     Electrical Engineering
Stanford University             	jmcvittie at
Rm. 336, 330 Serra Mall			Fax: (650) 723-4659
Stanford, CA 94305-4075			Tel: (650) 725-3640

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