PECVD Process Change Request

[Ron Kuse]

Jim,

Thanks for your comments.  I'll wait to hear from Jeannie if she is okay
with the lower temperature.  Naturally, I'll do any necessary cleaning
after my experiments.

Thanks,
Ron

-----Original Message-----
From: Jim McVittie [mailto:mcvittie at cis.Stanford.EDU] 
Sent: Monday, August 27, 2007 4:19 PM
To: Ron Kuse
Cc: specmat at snf.stanford.edu
Subject: Re: PECVD Process Change Request

Ron,

We have seen this problem before with Al. Your approach is in the right

direction. Years ago, we developed a 300 C LTO process for this same 
reason. In the LTO case we were limited to a min temp of 300C. We  
deposited about 500A at 300C before finishing the deposition at 400C.
This gave a big improvement over a complete deposition at 400C.

For the PECVD system, the temp is kept at 350C to delay flaking from the

chamber walls so we can do more runs before cleaning the system. At this

time, I am not sure we have any of the data from the test runs used to

determine that it was best to leave the system at 350C. We will need to 
talk to Jeanie and see what data before we can answer your request.

	Jim 

On Mon, 27 Aug 2007, Ron Kuse wrote:

> I would like to change the temperature of PECVD STS tool from 350 deg.
C
> to 300, 250, and 200 to investigate effect on pinhole formation when
> deposited on 100nm Al film.  At 350 deg. C, a large number of pinholes
> form.  Images are available upon request but will not be emailed as
they
> include proprietary design information.  Thank you.
> 
> 

-- 
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Jim McVittie, Ph.D.    			Senior Research Scientist 
Allen Center for Integrated Systems     Electrical Engineering
Stanford University             	jmcvittie at stanford.edu
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